Daidaitaccen Tsarin Laser Microjet don Kayayyakin Hard & Brittle
Mabuɗin Siffofin
1. Dual-Wavelength Nd: YAG Laser Source
Yin amfani da diode-pumped m-state Nd:YAG Laser, tsarin yana goyan bayan duka kore (532nm) da infrared (1064nm). Wannan damar-band-band yana ba da damar dacewa mafi girma tare da ɗimbin nau'ikan bayanan bayanan shaye-shaye, haɓaka saurin sarrafawa da inganci.
2. Innovation Microjet Laser watsa
Ta hanyar haɗa Laser tare da microjet ruwa mai matsa lamba, wannan tsarin yana amfani da duka tunani na ciki zuwa tashar makamashin Laser daidai tare da rafin ruwa. Wannan tsarin isarwa na musamman yana tabbatar da mafi kyawun mayar da hankali tare da ƙarancin watsawa kuma yana ba da faɗin layi daidai kamar 20μm, yana ba da ingancin yanke wanda bai dace ba.
3. Thermal Control a Micro Scale
Haɗe-haɗe daidaitaccen tsarin sanyaya ruwa yana daidaita zafin jiki a wurin aiki, yana kiyaye yankin da zafi ya shafa (HAZ) tsakanin 5μm. Wannan fasalin yana da mahimmanci musamman lokacin aiki tare da abubuwan da ke da zafi da kuma karaya kamar SiC ko GaN.
4. Modular Power Kanfigareshan
Dandalin yana goyan bayan zaɓuɓɓukan wutar lantarki guda uku-50W, 100W, da 200W-ba da damar abokan ciniki don zaɓar tsarin da ya dace da kayan aiki da buƙatun ƙuduri.
5. Daidaitaccen Tsarin Kula da Motsi
Tsarin ya haɗa da babban matakin daidaitaccen matsayi tare da matsayi na ± 5μm, yana nuna motsi na 5-axis da na zaɓi na madaidaiciya ko na'urori masu motsi kai tsaye. Wannan yana tabbatar da babban maimaitawa da sassauƙa, har ma don hadadden geometries ko sarrafa tsari.
Yankunan aikace-aikace
Silicon Carbide Wafer Processing:
Mafi dacewa don datsa gefe, slicing, da dicing na wafers na SiC a cikin kayan lantarki.
Gallium Nitride (GAN) Machining Substrate Machining:
Yana goyan bayan babban madaidaicin rubutun da yanke, wanda aka keɓance don aikace-aikacen RF da LED.
Tsarin Semiconductor Faɗin Bandgap:
Mai jituwa tare da lu'u-lu'u, gallium oxide, da sauran kayan da ke fitowa don aikace-aikace masu ƙarfi da ƙarfi.
Yankan Haɗin Jirgin Sama:
Daidaitaccen yankan yumbu matrix composites da ci-gaba aerospace-sa substrates.
LTCC & Kayayyakin Hoto:
Ana amfani da shi don ƙananan ta hanyar hakowa, trenching, da rubutu a cikin PCB mai girma da masana'antar hasken rana.
Scintillator & Optical Crystal Siffar:
Yana ba da damar yankan ƙananan lahani na yttrium-aluminum garnet, LSO, BGO, da sauran madaidaicin na'urorin gani.
Ƙayyadaddun bayanai
Ƙayyadaddun bayanai | Daraja |
Nau'in Laser | DPSS Nd: YAG |
Ana Goyan bayan Tsawon Wave | 532nm / 1064nm |
Zaɓuɓɓukan wuta | 50W / 100W / 200W |
Matsayi Daidaito | ± 5μm |
Mafi qarancin Nisa Layi | ≤20 μm |
Yankin da Zafi ya shafa | ≤5 μm |
Tsarin Motsi | Motar linzamin kwamfuta / kai tsaye |
Matsakaicin Yawan Makamashi | Har zuwa 10 ⁷ W/cm² |
Kammalawa
Wannan tsarin Laser microjet yana sake fasalta iyakokin mashin ɗin laser don ƙaƙƙarfan, gaggautsa, da kayan zafin jiki. Ta hanyar haɗin kai na musamman na Laser-ruwa, daidaitawar dual-wavelength, da tsarin motsi mai sauƙi, yana ba da mafita mai dacewa ga masu bincike, masana'antun, da masu haɗawa da tsarin aiki tare da kayan yankan. Ko ana amfani da shi a masana'anta na semiconductor, dakunan gwaje-gwaje na sararin samaniya, ko samar da hasken rana, wannan dandali yana ba da aminci, maimaitawa, da daidaito wanda ke ba da ikon sarrafa kayan zamani na gaba.
Cikakken zane


