Microjet Laser fasahar kayan aiki wafer yankan SiC kayan aiki

Takaitaccen Bayani:

Microjet Laser fasahar kayan aiki ne wani nau'i na machining tsarin da hada high makamashi Laser da micron-matakin ruwa jet. Ta hanyar haɗa katako na Laser zuwa jet ruwa mai sauri (ruwan da aka lalata ko ruwa na musamman), ana iya gane kayan aiki tare da madaidaicin madaidaici da ƙananan lalacewar thermal. Wannan fasaha ta dace musamman don yankan, hakowa da sarrafa microstructure na kayan aiki masu wuya da gatsewa (kamar SiC, sapphire, gilashin), kuma ana amfani dashi sosai a cikin semiconductor, nunin hoto, na'urorin likitanci da sauran fannoni.


Siffofin

Ƙa'idar aiki:

1. Laser hada guda biyu: pulsed Laser (UV / kore / infrared) aka mayar da hankali a cikin ruwa jet don samar da barga makamashi watsa tashar.

2. Jagorar ruwa: jet mai sauri (yawan kwarara 50-200m / s) sanyaya wurin sarrafawa da kuma kwashe tarkace don guje wa tarawar zafi da gurɓataccen yanayi.

3. Material kau: The Laser makamashi haifar cavitation sakamako a cikin ruwa don cimma sanyi aiki na kayan (zafi shafi yankin <1μm).

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Mahimman sigogi:

1. Ƙarfin Laser: 10-500W (mai daidaitawa)

2. Jet diamita: 50-300μm

3.Machining daidaito: ± 0.5μm (yankan), zurfin zuwa nisa rabo 10: 1 (hakowa)

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Fa'idodin fasaha:

(1) Kusan sifili lalacewa
- Liquid jet sanyaya yana sarrafa yankin zafi da ya shafa (HAZ) zuwa ** <1μm**, yana guje wa micro-cracks lalacewa ta hanyar sarrafa Laser na al'ada (HAZ yawanci> 10μm).

(2) Machining mai girman gaske
- Yanke / hakowa daidaito har zuwa ** ± 0.5μm **, gefen roughness Ra <0.2μm, rage bukatar m polishing.

- Goyan bayan hadadden tsarin sarrafa tsarin 3D (kamar ramukan conical, ramummuka masu siffa).

(3) Faɗin dacewa da kayan aiki
- Kayan aiki mai wuya da gaggautsa: SiC, sapphire, gilashin, yumbu (hanyoyin gargajiya suna da sauƙin rushewa).

- Abubuwan da ke da zafi: polymers, kyallen ƙwayoyin halitta (babu haɗarin haɓakar thermal).

(4) Kariyar muhalli da inganci
- Babu gurɓatar ƙura, ana iya sake sarrafa ruwa da tacewa.

- 30% -50% karuwa a cikin saurin sarrafawa (vs. machining).

(5) sarrafa hankali
- Haɗaɗɗen matsayi na gani da haɓaka siginar AI, kauri mai daidaitawa da lahani.

Bayanan fasaha:

Ƙarfin ƙira 300*300*150 400*400*200
Linear axis XY Motar layin layi. Motar layin layi Motar layin layi. Motar layin layi
Linear axis Z 150 200
Matsayi daidai μm +/-5 +/-5
Matsakaicin daidaitawa mai maimaita μm +/-2 +/-2
Acceleration G 1 0.29
Ikon lamba 3 axis / 3+1 axis / 3+2 axis 3 axis / 3+1 axis / 3+2 axis
Nau'in sarrafawa na lamba DPSS Nd: YAG DPSS Nd: YAG
Tsawon tsayin nm 532/1064 532/1064
rated ikon W 50/100/200 50/100/200
Jirgin ruwa 40-100 40-100
Matsi na bututun ƙarfe 50-100 50-600
Girma (kayan injin) (nisa * tsayi * tsayi) mm 1445*1944*2260 1700*1500*2120
Girman (kamannin sarrafawa) (W * L * H) 700*2500*1600 700*2500*1600
Nauyi (kayan aiki) T 2.5 3
Nauyi (control cabinet) KG 800 800
Ƙarfin sarrafawa Rarraba saman Ra≤1.6um

Gudun buɗewa ≥1.25mm/s

Yanke kewaye ≥6mm/s

Gudun yankan madaidaiciya ≥50mm/s

Raushin saman Ra≤1.2um

Gudun buɗewa ≥1.25mm/s

Yanke kewaye ≥6mm/s

Gudun yankan madaidaiciya ≥50mm/s

   

Don gallium nitride crystal, matsananci-fadi band rata semiconductor kayan (lu'u-lu'u/Gallium oxide), Aerospace musamman kayan, LTCC carbon yumbu substrate, photovoltaic, scintillator crystal da sauran kayan aiki.

Lura: Ƙarfin sarrafawa ya bambanta dangane da halayen kayan aiki

 

 

Shari'ar sarrafawa:

图片2

Ayyukan XKH:

XKH yana ba da cikakken kewayon cikakken tallafin sabis na sake zagayowar rayuwa don kayan aikin fasaha na laser microjet, daga farkon aiwatar da haɓakawa da shawarwarin zaɓin kayan aiki, zuwa tsarin haɗin kai na tsakiyar lokaci na musamman (ciki har da matching na musamman na tushen Laser, tsarin jet da tsarin sarrafa kansa), zuwa aiki na gaba da horarwa da kiyayewa da ci gaba da haɓaka aiwatarwa, tsarin duka yana sanye take da goyan bayan ƙungiyar ƙwararru; Dangane da shekaru 20 na ƙwarewar mashin daidaitattun mashin ɗin, zamu iya samar da mafita guda ɗaya wanda ya haɗa da tabbatar da kayan aiki, gabatarwar samar da taro da sauri bayan-tallace-tallace (sa'o'i 24 na goyan bayan fasaha + maɓalli na kayan ajiya) don masana'antu daban-daban kamar semiconductor da likita, da kuma alkawalin garanti na tsawon watanni 12 da tsawon rayuwa da sabis na haɓakawa. Tabbatar cewa kayan aikin abokin ciniki koyaushe suna kiyaye aikin sarrafa masana'antu da kwanciyar hankali.

Cikakken zane

Kayan fasahar Laser Microjet 3
Kayan fasahar Laser Microjet 5
Kayan fasahar Laser Microjet 6

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