Microjet Laser fasahar kayan aiki wafer yankan SiC kayan aiki
Ƙa'idar aiki:
1. Laser hada guda biyu: pulsed Laser (UV / kore / infrared) aka mayar da hankali a cikin ruwa jet don samar da barga makamashi watsa tashar.
2. Jagorar ruwa: jet mai sauri (yawan kwarara 50-200m / s) sanyaya wurin sarrafawa da kuma kwashe tarkace don guje wa tarawar zafi da gurɓataccen yanayi.
3. Material kau: The Laser makamashi haifar cavitation sakamako a cikin ruwa don cimma sanyi aiki na kayan (zafi shafi yankin <1μm).
.
Mahimman sigogi:
1. Ƙarfin Laser: 10-500W (mai daidaitawa)
2. Jet diamita: 50-300μm
3.Machining daidaito: ± 0.5μm (yankan), zurfin zuwa nisa rabo 10: 1 (hakowa)

Fa'idodin fasaha:
(1) Kusan sifili lalacewa
- Liquid jet sanyaya yana sarrafa yankin zafi da ya shafa (HAZ) zuwa ** <1μm**, yana guje wa micro-cracks lalacewa ta hanyar sarrafa Laser na al'ada (HAZ yawanci> 10μm).
(2) Machining mai girman gaske
- Yanke / hakowa daidaito har zuwa ** ± 0.5μm **, gefen roughness Ra <0.2μm, rage bukatar m polishing.
- Goyan bayan hadadden tsarin sarrafa tsarin 3D (kamar ramukan conical, ramummuka masu siffa).
(3) Faɗin dacewa da kayan aiki
- Kayan aiki mai wuya da gaggautsa: SiC, sapphire, gilashin, yumbu (hanyoyin gargajiya suna da sauƙin rushewa).
- Abubuwan da ke da zafi: polymers, kyallen ƙwayoyin halitta (babu haɗarin haɓakar thermal).
(4) Kariyar muhalli da inganci
- Babu gurɓatar ƙura, ana iya sake sarrafa ruwa da tacewa.
- 30% -50% karuwa a cikin saurin sarrafawa (vs. machining).
(5) sarrafa hankali
- Haɗaɗɗen matsayi na gani da haɓaka siginar AI, kauri mai daidaitawa da lahani.
Bayanan fasaha:
Ƙarfin ƙira | 300*300*150 | 400*400*200 |
Linear axis XY | Motar layin layi. Motar layin layi | Motar layin layi. Motar layin layi |
Linear axis Z | 150 | 200 |
Matsayi daidai μm | +/-5 | +/-5 |
Matsakaicin daidaitawa mai maimaita μm | +/-2 | +/-2 |
Acceleration G | 1 | 0.29 |
Ikon lamba | 3 axis / 3+1 axis / 3+2 axis | 3 axis / 3+1 axis / 3+2 axis |
Nau'in sarrafawa na lamba | DPSS Nd: YAG | DPSS Nd: YAG |
Tsawon tsayin nm | 532/1064 | 532/1064 |
rated ikon W | 50/100/200 | 50/100/200 |
Jirgin ruwa | 40-100 | 40-100 |
Matsi na bututun ƙarfe | 50-100 | 50-600 |
Girma (kayan injin) (nisa * tsayi * tsayi) mm | 1445*1944*2260 | 1700*1500*2120 |
Girman (kamannin sarrafawa) (W * L * H) | 700*2500*1600 | 700*2500*1600 |
Nauyi (kayan aiki) T | 2.5 | 3 |
Nauyi (control cabinet) KG | 800 | 800 |
Ƙarfin sarrafawa | Rarraba saman Ra≤1.6um Gudun buɗewa ≥1.25mm/s Yanke kewaye ≥6mm/s Gudun yankan madaidaiciya ≥50mm/s | Raushin saman Ra≤1.2um Gudun buɗewa ≥1.25mm/s Yanke kewaye ≥6mm/s Gudun yankan madaidaiciya ≥50mm/s |
Don gallium nitride crystal, matsananci-fadi band rata semiconductor kayan (lu'u-lu'u/Gallium oxide), Aerospace musamman kayan, LTCC carbon yumbu substrate, photovoltaic, scintillator crystal da sauran kayan aiki. Lura: Ƙarfin sarrafawa ya bambanta dangane da halayen kayan aiki
|
Shari'ar sarrafawa:

Ayyukan XKH:
XKH yana ba da cikakken kewayon cikakken tallafin sabis na sake zagayowar rayuwa don kayan aikin fasaha na laser microjet, daga farkon aiwatar da haɓakawa da shawarwarin zaɓin kayan aiki, zuwa tsarin haɗin kai na tsakiyar lokaci na musamman (ciki har da matching na musamman na tushen Laser, tsarin jet da tsarin sarrafa kansa), zuwa aiki na gaba da horarwa da kiyayewa da ci gaba da haɓaka aiwatarwa, tsarin duka yana sanye take da goyan bayan ƙungiyar ƙwararru; Dangane da shekaru 20 na ƙwarewar mashin daidaitattun mashin ɗin, zamu iya samar da mafita guda ɗaya wanda ya haɗa da tabbatar da kayan aiki, gabatarwar samar da taro da sauri bayan-tallace-tallace (sa'o'i 24 na goyan bayan fasaha + maɓalli na kayan ajiya) don masana'antu daban-daban kamar semiconductor da likita, da kuma alkawalin garanti na tsawon watanni 12 da tsawon rayuwa da sabis na haɓakawa. Tabbatar cewa kayan aikin abokin ciniki koyaushe suna kiyaye aikin sarrafa masana'antu da kwanciyar hankali.
Cikakken zane


