Kayan aikin fasahar laser Microjet kayan aikin yanke wafer SiC sarrafa kayan aiki

Kayan aikin fasahar laser na Microjet na yanke kayan aiki na SiC sarrafa kayan da aka nuna Hoto Mai Kyau

Takaitaccen Bayani:

Kayan aikin fasahar laser na Microjet wani nau'in tsarin injina ne na daidaitacce wanda ke haɗa babban ƙarfin laser da ƙaramin matakin ruwa. Ta hanyar haɗa hasken laser ɗin zuwa babban saurin ruwa (ruwa mai narkewa ko ruwa na musamman), ana iya cimma aikin sarrafa kayan tare da babban daidaito da ƙarancin lalacewar zafi. Wannan fasaha ta dace musamman don yankewa, haƙowa da sarrafa ƙananan kayan aiki na tauri da masu karyewa (kamar SiC, sapphire, gilashi), kuma ana amfani da ita sosai a cikin semiconductor, nunin hoto, na'urorin likitanci da sauran fannoni.

Aika mana imel

Siffofi

Ka'idar aiki:

1. Haɗin Laser: Ana mayar da hankali kan laser mai pulsed (UV/kore/infrared) a cikin jet ɗin ruwa don samar da tashar watsa makamashi mai ɗorewa.

2. Jagorar ruwa: jirgin sama mai sauri (yawan kwarara 50-200m/s) yana sanyaya yankin sarrafawa da kuma ɗaukar tarkace don guje wa taruwar zafi da gurɓatawa.

3. Cire kayan aiki: Ƙarfin laser yana haifar da tasirin cavitation a cikin ruwan don cimma aikin sanyi na kayan (yankin da zafi ya shafa <1μm).

4. Ikon sarrafawa mai ƙarfi: daidaitawar sigogin laser (ƙarfi, mita) da matsin lamba na jet a ainihin lokaci don biyan buƙatun kayan aiki da tsari daban-daban.

Maɓallan mahimmanci:

1. Ƙarfin Laser: 10-500W (wanda za a iya daidaitawa)

2. Diamita na Jet: 50-300μm

3. Daidaiton injina: ±0.5μm (yankewa), rabon zurfin zuwa faɗi 10:1 (hakowa)

Fa'idodin fasaha:

(1) Kusan babu wata illa da zafi zai iya haifarwa
- Sanyayawar jet mai ruwa yana sarrafa yankin da zafi ya shafa (HAZ) zuwa **<1μm**, yana guje wa ƙananan fasawa da ke faruwa sakamakon sarrafa laser na yau da kullun (HAZ yawanci yana >10μm).

(2) Injin aiki mai matuƙar inganci
- Daidaiton yankewa/haƙa har zuwa **±0.5μm**, ƙaiƙayin gefen Ra<0.2μm, rage buƙatar gogewa daga baya.

- Goyi bayan tsarin 3D mai rikitarwa (kamar ramuka masu siffar mazugi, ramuka masu siffar).

(3) Dacewar abu mai faɗi
- Kayan aiki masu tauri da karyewa: SiC, saffir, gilashi, yumbu (hanyoyin gargajiya suna da sauƙin karyewa).

- Kayan da ke da alaƙa da zafi: polymers, kyallen halitta (babu haɗarin denaturation na thermal).

(4) Kare muhalli da inganci
- Babu gurɓataccen ƙura, ana iya sake yin amfani da ruwa a tace shi.

- Ƙara yawan saurin sarrafawa 30%-50% (idan aka kwatanta da injina).

(5) Ikon sarrafawa mai hankali
- Haɗaɗɗen matsayi na gani da inganta sigogin AI, kauri da lahani na kayan daidaitawa.

Bayanan fasaha:

Ƙarar saman tebur	300300150	400400200
Axis mai layi XY	Motar layi. Motar layi	Motar layi. Motar layi
Axis mai layi Z	150	200
Daidaiton matsayi μm	+/-5	+/-5
Daidaiton matsayi mai maimaitawa μm	+/-2	+/-2
Hanzarta G	1	0.29
Sarrafa lambobi	Axis 3 /Axis 3+1 /Axis 3+2	Axis 3 /Axis 3+1 /Axis 3+2
Nau'in sarrafa lambobi	DPSS Nd:YAG	DPSS Nd:YAG
Tsawon zangon nm	532/1064	532/1064
Ƙarfin da aka ƙima W	50/100/200	50/100/200
Jirgin ruwa	40-100	40-100
Mashin matsi na bututun ƙarfe	50-100	50-600
Girma (kayan aikin injin) (faɗi * tsayi * tsayi) mm	144519442260	170015002120
Girman (kabad mai sarrafawa) (W * L * H)	70025001600	70025001600
Nauyi (kayan aiki) T	2.5	3
Nauyi (kabad mai sarrafawa) KG	800	800
Ƙarfin sarrafawa	Tsananin saman Ra≤1.6um Saurin buɗewa ≥1.25mm/s Yankewa da'ira ≥6mm/s Gudun yanke layi ≥50mm/s	Tsananin saman Ra≤1.2um Saurin buɗewa ≥1.25mm/s Yankewa da'ira ≥6mm/s Gudun yanke layi ≥50mm/s
	Don lu'ulu'u na gallium nitride, kayan semiconductor masu faɗi da faɗi (lu'u-lu'u/Gallium oxide), kayan aikin sararin samaniya na musamman, LTCC carbon ceramic substrate, photovoltaic, scintillator crystal da sauran kayan sarrafawa. Lura: Ƙarfin sarrafawa ya bambanta dangane da halayen kayan

Shari'ar sarrafawa:

Ayyukan XKH:

XKH tana ba da cikakken tallafi na cikakken sabis na zagayowar rayuwa ga kayan aikin fasahar laser microjet, tun daga farkon haɓaka tsari da shawarwarin zaɓar kayan aiki, zuwa haɗakar tsarin da aka keɓance na tsakiyar lokaci (gami da daidaitawa ta musamman na tushen laser, tsarin jet da tsarin sarrafa kansa), zuwa horo na aiki da kulawa na gaba da kuma ci gaba da inganta tsari, dukkan tsarin yana da kayan aikin ƙwararrun ƙwararrun ƙwararrun ma'aikata; Dangane da shekaru 20 na ƙwarewar injina daidai, za mu iya samar da mafita na tsayawa ɗaya, gami da tabbatar da kayan aiki, gabatarwar yawan kayan aiki da amsawa cikin sauri bayan siyarwa (awanni 24 na tallafin fasaha + ajiyar kayan gyara masu mahimmanci) ga masana'antu daban-daban kamar semiconductor da likita, kuma muna alƙawarin garanti na tsawon watanni 12 da sabis na kulawa da haɓakawa na tsawon rai. Tabbatar da cewa kayan aikin abokin ciniki koyaushe suna kula da aikin sarrafawa da kwanciyar hankali a masana'antu.