Kayan Aikin Yankan Zobe Mai Wafer Mai Cikakken Atomatik Girman Aiki 8in/12in Yankan Zoben Wafer

Kayan Aikin Yankan Zoben Wafer Mai Sauƙi Na Atomatik Girman Aiki 8in/12in Yanke Zoben Wafer Hoton da Aka Fi So

Takaitaccen Bayani:

XKH ta ƙirƙiro tsarin yanke gefen wafer mai sarrafa kansa, wanda ke wakiltar mafita mai inganci wanda aka tsara don hanyoyin kera semiconductor na gaba. Wannan kayan aikin ya haɗa da fasahar sarrafawa mai aiki da yawa kuma yana da tsarin madaurin juyawa mai ƙarfi (matsakaicin saurin juyawa: 60,000 RPM), yana ba da daidaitaccen yanke gefen tare da daidaiton yankewa har zuwa ±5μm. Tsarin yana nuna kyakkyawan jituwa tare da nau'ikan abubuwan semiconductor daban-daban, gami da amma ba'a iyakance ga:
1. Wafers ɗin Silicon (Si): Ya dace da sarrafa gefuna na wafers ɗin inci 8-12;
2. Masu haɗa semiconductors: Kayan semiconductor na ƙarni na uku kamar GaAs da SiC;
3. Abubuwan da aka yi amfani da su na musamman: Wafers na Piezoelectric, gami da LT/LN;

Tsarin na'urar yana tallafawa maye gurbin kayan amfani da yawa cikin sauri, gami da ruwan lu'u-lu'u da kawunan yanke laser, tare da dacewa da ta wuce ƙa'idodin masana'antu. Don buƙatun tsari na musamman, muna ba da cikakkun mafita waɗanda suka haɗa da:
· Kayan aikin yanke kayan masarufi na musamman
· Ayyukan sarrafawa na musamman
· Mafita inganta sigogin tsari

Aika mana imel

Siffofi

Sigogi na fasaha

Sigogi	Naúrar	Ƙayyadewa
Matsakaicin Girman workpiece	mm	ø12"
Dogayen sanda	Saita	Dogon Doki Guda ɗaya
	Gudu	3,000–60,000 rpm
	Ƙarfin Fitarwa	1.8 kW (zaɓi na 2.4) a minti 30,000⁻¹
	Max Blade Dia.	Ø58 mm
X-Axis	Yankan Yankan	310 mm
Axis Y	Yankan Yankan	310 mm
	Ƙara Mataki	0.0001 mm
	Daidaiton Matsayi	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (kuskure ɗaya)
Z-Axis	Yanke Shawarar Motsi	0.00005 mm
Z-Axis	Maimaitawa	0.001 mm
θ-Axis	Matsakaicin Juyawa	digiri 380
Nau'in Dogayen Dogaye		Dogon sanda guda ɗaya, sanye take da ruwan wuka mai tauri don yanke zobe
Daidaiton Yankan Zobe	μm	±50
Daidaiton Matsayin Wafer	μm	±50
Ingancin Wafer Guda Ɗaya	minti/wafer	8
Ingancin Wafer Mai Yawa		Har zuwa wafers guda 4 da aka sarrafa a lokaci guda
Nauyin Kayan Aiki	kg	≈3,200
Girman Kayan Aiki (W×D×H)	mm	2,730 × 1,550 × 2,070

Ka'idar Aiki

Tsarin yana samun kyakkyawan aikin gyaran gashi ta hanyar waɗannan fasahohin asali:

1. Tsarin Kula da Motsi Mai Hankali:
· Tuƙin mota mai layi mai inganci (sauƙaƙen matsayi mai maimaitawa: ±0.5μm)
· Ikon daidaitawa mai sassa shida yana tallafawa tsarin hanyoyin da ke da sarkakiya
· Algorithms na rage girgiza a ainihin lokaci suna tabbatar da kwanciyar hankali na yankewa

2. Tsarin Ganowa Mai Ci Gaba:
· Na'urar firikwensin tsayin laser 3D da aka haɗa (daidaitawa: 0.1μm)
· Matsayi mai kyau na gani na CCD (megapixels 5)
· Tsarin duba inganci ta yanar gizo

3. Tsarin Aiki Mai Cikakken Kai:
· Lodawa/saukewa ta atomatik (wanda ya dace da tsarin haɗin FOUP)
· Tsarin rarrabawa mai hankali
· Na'urar tsaftacewa mai rufewa (tsabta: Aji 10)

Aikace-aikace na yau da kullun

Wannan kayan aiki yana da mahimmanci a aikace-aikacen masana'antar semiconductor:

Filin Aikace-aikace	Kayan Aiki	Fa'idodin Fasaha
Masana'antar IC	Wafers ɗin Silicon 8/12"	Yana inganta daidaita lithography
Na'urorin Wutar Lantarki	Wafers na SiC/GaN	Yana hana lahani a gefen
Na'urori Masu auna MEMS	Wafers na SOI	Yana tabbatar da ingancin na'urar
Na'urorin RF	Wafers na GaAs	Yana inganta aikin mita mai yawa
Marufi Mai Ci Gaba	Wafers ɗin da aka sake tsarawa	Yana ƙara yawan amfanin marufi

Siffofi

1. Tsarin tashar huɗu don ingantaccen aiki mai inganci;
2.Tsarin cire zobe na TAIKO da kuma cirewa
3. Babban jituwa da mahimman abubuwan amfani;
4. Fasaha mai daidaitawa ta multi-axis tana tabbatar da daidaiton yanke gefen;
5. Tsarin aiki mai sarrafa kansa gaba ɗaya yana rage farashin aiki sosai.
6. Tsarin teburin aiki na musamman yana ba da damar aiki mai kyau na tsarin musamman.

Ayyuka

1. Tsarin gano Zobe-drop;
2. Tsaftace teburin aiki ta atomatik;
3. Tsarin cirewa na UV mai hankali.
4. Rikodin rikodin aiki;
5. Haɗakar tsarin sarrafa kansa na masana'antu;

Alƙawarin Sabis

XKH tana ba da cikakkun ayyuka na tallafi na tsawon rai waɗanda aka tsara don haɓaka aikin kayan aiki da ingancin aiki a duk tsawon tafiyar samar da kayan aikinku.
1. Ayyukan Keɓancewa
· Tsarin Kayan Aiki da Aka Keɓance: Ƙungiyar injiniyanmu tana haɗin gwiwa sosai da abokan ciniki don inganta sigogin tsarin (gudun yankewa, zaɓin ruwan wukake, da sauransu) bisa ga takamaiman kaddarorin kayan aiki (Si/SiC/GaAs) da buƙatun tsari.
· Tallafin Ci Gaban Tsarin Aiki: Muna bayar da samfurin sarrafa bayanai tare da cikakkun rahotannin bincike ciki har da auna tsatsa da kuma taswirar lahani.
· Haɓaka Kayan Amfani: Don sabbin kayan aiki (misali, Ga₂O₃), muna haɗin gwiwa da manyan masana'antun kayan amfani don ƙirƙirar ruwan wukake/na'urorin hangen nesa na laser na musamman don aikace-aikace.

2. Tallafin Fasaha na Ƙwararru
· Tallafin Aiki na Musamman a Wurin Aiki: Sanya injiniyoyi masu lasisi don mahimman matakan haɓakawa (yawanci makonni 2-4), waɗanda suka haɗa da:
Daidaita kayan aiki da daidaita tsari
Horar da ƙwarewar mai aiki
Jagorar haɗa ɗakunan tsafta na ISO Class 5
· Kulawa Mai Hasashen Hasashe: Duba lafiyar kowace shekara tare da nazarin girgiza da kuma gano alamun motar servo don hana lokacin hutu ba tare da shiri ba.
· Kulawa daga Nesa: Bin diddigin aikin kayan aiki na ainihin lokaci ta hanyar dandamalin IoT ɗinmu (JCFront Connect®) tare da faɗakarwar rashin daidaituwa ta atomatik.

3. Ayyukan da suka ƙara daraja
· Tushen Ilimin Tsarin Aiki: Samun damar girke-girke na yankewa sama da 300 don kayan aiki daban-daban (an sabunta su kwata-kwata).
· Daidaita Taswirar Fasaha: Tabbatar da jarin ku na gaba tare da hanyoyin haɓaka kayan aiki/software (misali, tsarin gano lahani bisa tushen AI).
· Amsar Gaggawa: An tabbatar da gano cutar daga nesa na tsawon awanni 4 da kuma shiga tsakani na awanni 48 a wurin (rufewar duniya baki ɗaya).

4. Kayayyakin Aikin Gidaje
· Garanti na Aiki: Kwantiragin kwangila na aiki na ≥98% tare da lokutan amsawa da SLA ke tallafawa.

Ci gaba da Ingantawa

Muna gudanar da binciken gamsuwar abokan ciniki sau biyu a shekara kuma muna aiwatar da shirye-shiryen Kaizen don haɓaka isar da sabis. Ƙungiyar bincikenmu da haɓaka fasaha ta fassara fahimtar filin zuwa haɓaka kayan aiki - kashi 30% na inganta firmware sun samo asali ne daga ra'ayoyin abokan ciniki.