Cikakken Kayan Aikin Yankan Wafer Ring Na atomatik Girman Wafer 8inch/12inch

Cikakken Na'urar Yankan Wafer Ring Na atomatik Girman Girman Wafer 8inch/12inch Fitaccen Hoto

Takaitaccen Bayani:

XKH ta ɓullo da kanta ta ɓullo da cikakken tsarin gyara gefen wafer na atomatik, wanda ke wakiltar ingantaccen bayani wanda aka ƙera don aiwatar da ayyukan masana'antu na gaba-gaba. Wannan kayan aikin ya haɗa da sabbin fasahar sarrafa kayan aiki tare da ɗimbin axis kuma yana fasalta tsarin tsinke mai ƙarfi (mafi girman saurin juyawa: 60,000 RPM), yana isar da daidaitaccen gefuna tare da yanke daidaito har zuwa ± 5μm. Tsarin yana nuna kyakykyawan dacewa tare da wasu na'urori na semiconductor, gami da amma ba'a iyakance ga:
1.Silicon wafers (Si): Ya dace da sarrafa gefen 8-12 inch wafers;
2.Compound semiconductor: Na uku-ƙarni semiconductor kayan kamar GaAs da SiC;
3.Special substrates: Piezoelectric abu wafers ciki har da LT / LN;

Zane na zamani yana goyan bayan saurin maye gurbin kayan masarufi da yawa ciki har da ruwan lu'u-lu'u da kawuna na Laser, tare da dacewa da ya wuce matsayin masana'antu. Don buƙatun tsari na musamman, muna ba da cikakkun hanyoyin magancewa:
· Sadaukar yankan kayan amfanin gona
· Ayyukan sarrafawa na al'ada
· Hanyoyin inganta siga na tsari

Aika mana imel

Siffofin

Siffofin fasaha

Siga	Naúrar	Ƙayyadaddun bayanai
Matsakaicin Girman Kayan Aiki	mm	ku 12"
Spindle	Kanfigareshan	Spindle Guda Daya
	Gudu	3,000-60,000 rpm
	Ƙarfin fitarwa	1.8 kW (2.4 na zaɓi) a 30,000 min⁻¹
	Max Blade Dia.	mm Ø58
X-Axis	Yanke Range	mm 310
Y-Axis	Yanke Range	mm 310
	Ƙarfafa mataki	0.0001 mm
	Matsayi Daidaito	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (kuskure daya)
Z-Axis	Shawarar motsi	0.00005 mm
Z-Axis	Maimaituwa	0.001 mm
θ-Axis	Matsakaicin Juyawa	ku 380
Nau'in Spindle		Sanda guda ɗaya, sanye take da tsayayyen ruwa don yankan zobe
Daidaiton Yanke Zobe	μm	± 50
Daidaiton Matsayin Wafer	μm	± 50
Ingantaccen Wafer Guda Daya	min/wafar	8
Ingantaccen Wafer Multi-Wafer		Har zuwa wafers 4 ana sarrafa su lokaci guda
Nauyin Kayan aiki	kg	≈3,200
Girman Kayan aiki (W×D×H)	mm	2,730 × 1,550 × 2,070

Ƙa'idar Aiki

Tsarin yana samun ingantaccen aikin gyarawa ta hanyar waɗannan mahimman fasahohin:

1.Intelligent Motion Control System:
Motar madaidaiciya madaidaiciya madaidaiciya (maimaita daidaiton matsayi: ± 0.5μm)
· Ikon aiki tare da axi-axis guda shida mai goyan bayan hadadden tsarin tsari
· Real-time vibration suppressing algorithms tabbatar da yanke kwanciyar hankali

2. Babban Tsarin Ganewa:
Haɗin firikwensin tsayi Laser 3D (daidai: 0.1μm)
Matsayin gani na CCD mai girma (5 megapixels)
· Modular duba ingancin kan layi

3. Cikakken Tsari mai sarrafa kansa:
Lodawa / saukewa ta atomatik (mai jituwa daidaitaccen ƙirar FOUP)
· Tsarin rarraba hankali
Naúrar tsabtace madauki (tsaftar: Class 10)

Aikace-aikace na yau da kullun

Wannan kayan aikin yana ba da ƙima mai mahimmanci a cikin aikace-aikacen masana'anta na semiconductor:

Filin Aikace-aikace	Kayayyakin Tsari	Fa'idodin Fasaha
IC Manufacturing	8/12" Silicon Wafers	Yana haɓaka daidaita lithography
Na'urorin Wutar Lantarki	SiC/GaN Wafers	Yana hana lahani
Sensors na MEMS	SOI Wafers	Yana tabbatar da amincin na'urar
Na'urorin RF	GaAs Wafers	Yana haɓaka aiki mai girma
Babban Marufi	Wafers da aka sake ginawa	Yana ƙara yawan marufi

Siffofin

1.Four-tashar sanyi don babban aiki yadda ya dace;
2.Stable TAIKO zobe deboding da cire;
3.High jituwa tare da key consumables;
4.Multi-axis synchronous trimming fasaha yana tabbatar da daidaitaccen yankan;
5.Fully sarrafa kansa tsari kwarara muhimmanci rage aiki halin kaka;
6.Customized worktable zane sa barga aiki na musamman Tsarin;

Ayyuka

1.Ring-drop gano tsarin;
2.Automatic worktable tsaftacewa;
3.Intelligent UV debonding tsarin;
4. Yin rikodin rikodin aiki;
5.Factory aiki da kai module hadewa;

Daukar Hidima

XKH yana ba da cikakkiyar sabis na tallafi na rayuwa wanda aka tsara don haɓaka aikin kayan aiki da ingantaccen aiki a cikin tafiyar samar da ku.
1. Sabis na Musamman
Kungiyar Injiniyan ta Ilimin Injiniyanmu: Kungiyar Injiniyanmu ta hada gwiwa tare da abokan ciniki don inganta sigogi na tsarin (si / Sic / Gaas) da buƙatun tsari.
Taimakon Ci Gaban Tsari: Muna ba da samfurin aiki tare da cikakkun rahotannin bincike ciki har da ma'aunin rashin ƙarfi da taswirar lahani.
Haɗin Haɓakawa: Don kayan labari (misali, Ga₂O₃), muna haɗin gwiwa tare da manyan masana'antun da ake amfani da su don haɓaka ƙayyadaddun ruwan wukake / Laser na gani na aikace-aikace.

2. Taimakon Ƙwararrun Ƙwararru
Taimako na Yanar Gizo mai sadaukarwa: Sanya ƙwararrun injiniyoyi don mahimman matakan haɓakawa (yawanci makonni 2-4), waɗanda ke rufe:
Daidaita kayan aiki & aiwatar da ingantaccen daidaitawa
Horon cancantar aiki
ISO Class 5 jagorar haɗin kai mai tsabta
· Kulawa da Hasashen: Binciken lafiya na kwata-kwata tare da nazarin jijjiga da kuma binciken motar servo don hana raguwar lokacin da ba a shirya ba.
· Kulawa mai nisa: bin diddigin aikin kayan aiki na lokaci-lokaci ta hanyar dandalinmu na IoT (JCFront Connect®) tare da faɗakarwar anomaly mai sarrafa kansa.

3. Ƙimar-Ƙara Ayyuka
Tushen Ilimin Tsari: Samun ingantattun ingantattun girke-girke na yankan 300+ don abubuwa daban-daban (an sabunta kowane wata).
Daidaita taswirar hanya ta Fasaha: Tabbacin gaba na saka hannun jari tare da hanyoyin haɓaka kayan masarufi/software (misali, tsarin gano lahani na tushen AI).
Amsar Gaggawa: Tabbataccen ganewar asali na sa'o'i 4 na nesa da sa'o'i 48 akan rukunin yanar gizo (ƙirar duniya).

4. Kayayyakin sabis
Garanti na Aiki: Ƙaddamar da yarjejeniya zuwa ≥98% lokacin kayan aiki tare da lokutan amsawar SLA.

Ci gaba da Ingantawa

Muna gudanar da binciken gamsuwar abokin ciniki na shekara-shekara da aiwatar da ayyukan Kaizen don haɓaka isar da sabis. Ƙungiyar R&D ɗinmu tana fassara fa'idodin filin cikin haɓaka kayan aiki - 30% na haɓaka firmware sun samo asali daga ra'ayin abokin ciniki.