12inch Cikakkiyar Daidaitaccen Dicing Ga Kayan Kayan Aikin Wafer Tsararren Yankan Tsarin don Si/SiC & HBM (Al)

12inch Cikakkiyar Daidaitaccen Dicing Dicing Ga Kayan Kayan Aikin Wafer Tsararren Yankan Tsari don Si/SiC & HBM (Al) Hoton da Aka Fito

Takaitaccen Bayani:

Cikakken atomatik madaidaicin kayan dicing shine babban madaidaicin tsarin yankan da aka haɓaka musamman don masana'antar semiconductor da kayan haɗin lantarki. Ya haɗa da fasahar sarrafa motsi na ci gaba da madaidaicin gani na gani don cimma daidaiton sarrafa matakin ƙananan micron. Wannan kayan aikin ya dace da madaidaicin dicing na kayan aiki masu wuya da gaggautsa, gami da:
1.Semiconductor Materials: Silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), lithium tantalate / lithium niobate (LT / LN) substrates, da dai sauransu.
2.Packaging Materials: Ceramic substrates, QFN / DFN Frames, BGA marufi substrates.
3.Functional Devices: Surface Acoustic Wave (SAW) filtata, thermoelectric sanyaya kayayyaki, WLCSP wafers.

XKH yana ba da gwajin dacewa da kayan aiki da sabis na gyare-gyare don tabbatar da kayan aiki daidai daidai da bukatun samar da abokan ciniki, yana ba da mafita mafi kyau duka don samfuran R&D da sarrafa tsari.

Aika mana imel

Siffofin

Siffofin fasaha

Siga	Ƙayyadaddun bayanai
Girman Aiki	Φ8", Φ12"
Spindle	Dual-axis 1.2/1.8/2.4/3.0, Max 60000 rpm
Girman Ruwa	2" ~ 3"
Y1/Y2 Axis	Ƙaruwa ɗaya-mataki: 0.0001 mm
	Daidaitaccen matsayi: <0.002 mm
	Yanke iyaka: 310 mm
X axis	Matsakaicin saurin ciyarwa: 0.1-600 mm/s
Z1/Z2 Axis	Ƙaruwa ɗaya-mataki: 0.0001 mm
Z1/Z2 Axis	Daidaitaccen matsayi: ≤ 0.001 mm
θ axis	Daidaitaccen matsayi: ± 15"
Tashar Tsaftacewa	Saurin juyawa: 100-3000 rpm
Tashar Tsaftacewa	Hanyar tsaftacewa: kurkura ta atomatik & bushe-bushe
Aiki Voltage	3-lokaci 380V 50Hz
Girma (W×D×H)	1550×1255×1880 mm
Nauyi	2100 kg

Ƙa'idar Aiki

Kayan aikin suna samun yanke madaidaici ta hanyar fasaha masu zuwa:
1.High-Rigidity Spindle System: Juyawa gudun har zuwa 60,000 RPM, sanye take da lu'u-lu'u ruwan wukake ko Laser yankan shugabannin don daidaita da daban-daban kayan Properties.

2.Multi-Axis Motion Control: X / Y / Z-axis sakawa daidaito na ± 1μm, guda biyu tare da high-daidaici grating ma'auni don tabbatar da karkacewa-free yankan hanyoyi.

3.Intelligent Visual Alignment: Babban CCD (5 megapixels) yana gane yanke tituna ta atomatik kuma yana ramawa don faɗakarwa ko rashin daidaituwa.

4.Cooling & Dust Removal: Integrated pure water cooling system and vacuum tsot kura kau don rage girman tasirin thermal da gurɓataccen ƙwayar cuta.

Yanayin Yanke

1.Blade Dicing: Ya dace da kayan aikin semiconductor na gargajiya kamar Si da GaAs, tare da faɗin kerf na 50-100μm.

2.Stealth Laser Dicing: An yi amfani da shi don wafers na bakin ciki (<100μm) ko kayan da ba su da ƙarfi (misali, LT / LN), yana ba da damar rabuwa ba tare da damuwa ba.

Aikace-aikace na yau da kullun

Abubuwan da suka dace	Filin Aikace-aikace	Bukatun sarrafawa
Silicon (Si)	ICs, MEMS firikwensin	Babban madaidaicin yanke, guntu <10μm
Silicon Carbide (SiC)	Na'urorin wuta (MOSFET/diodes)	Yanke ƙarancin lalacewa, haɓakar kula da thermal
Gallium Arsenide (GaAs)	Na'urorin RF, kwakwalwan kwamfuta na optoelectronic	Rigakafin ƙwayar cuta, kula da tsabta
LT/LN Substrates	SAW tacewa, na'urar modulator	Yanke mara damuwa, adana kaddarorin piezoelectric
Abubuwan yumbura	Modulolin wutar lantarki, marufi na LED	High-taurin kayan sarrafa, gefen flatness
QFN/DFN Frames	Babban marufi	Multi-chip yankan lokaci guda, inganta ingantaccen aiki
WLCSP Wafers	Marufi matakin wafer	Dicing mara lahani na wafers na bakin ciki (50μm)

Amfani

1. Binciken firam ɗin kaset mai sauri tare da ƙararrawar rigakafin karo, saurin canja wuri, da ƙarfin gyara kuskure mai ƙarfi.

2. Ingantacciyar yanayin yanke dual-spindle, inganta ingantaccen aiki da kusan 80% idan aka kwatanta da tsarin spindle guda ɗaya.

3. Madaidaicin-shigo da ƙwallon ƙwallon ƙwallon ƙafa, jagororin layi, da sikelin grating na Y-axis rufe-madaidaicin iko, tabbatar da kwanciyar hankali na dogon lokaci na ingantattun machining.

4. Cikakken ƙaddamarwa / saukewa ta atomatik, matsayi na canja wuri, yankan daidaitawa, da dubawar kerf, rage yawan aikin mai aiki (OP).

5.Gantry-style spindle hawa tsarin, tare da m dual-blade tazara na 24mm, kunna mafi fadi adaptability for dual-spindle yankan matakai.

Siffofin

1.High-daidaitaccen ma'aunin tsayi mara lamba.

2.Multi-wafer dual-blade yankan akan tire guda.

3.Automatic calibration, kerf dubawa, da kuma tsarin gano fashewar ruwa.

4.Supports daban-daban matakai tare da zažužžukan atomatik jeri algorithms.

5.Fault kai-gyara ayyuka da kuma real-lokaci Multi-matsayi saka idanu.

6.First-yanke dubawa iyawar post-farko dicing.

7.Customizable factory aiki da kai kayayyaki da sauran na zaɓi ayyuka.

Abubuwan da suka dace

Sabis na Kayan aiki

Muna ba da cikakken tallafi daga zaɓin kayan aiki zuwa kulawa na dogon lokaci:

(1) Ci gaba na Musamman
· Ba da shawarar hanyoyin yankan ruwa/Laser dangane da kaddarorin abu (misali, taurin SiC, GaAs gaggawa).

Bayar da gwajin samfurin kyauta don tabbatar da ingancin yankan (ciki har da guntu, faɗin kerf, rashin ƙarfi, da sauransu).

(2) Koyarwar Fasaha
· Koyarwa ta asali: Ayyukan kayan aiki, daidaita ma'auni, kiyayewa na yau da kullun.
Babban Darussan: Haɓaka tsari don hadaddun kayan (misali, yankan LT ba tare da damuwa ba).

(3) Tallafin Bayan-tallace-tallace
24/7 Amsa: Bincike mai nisa ko taimako na kan layi.
· Samar da Kayan Kayayyakin Kaya: Hannun dunƙule, ruwan wukake, da kayan aikin gani don saurin sauyawa.
· Kulawa na rigakafi: daidaitawa na yau da kullun don kiyaye daidaito da tsawaita rayuwar sabis.

90bf3f9d-353c-408a-a-a804-56eb276dea24_副本

Amfaninmu

✔ Kwarewar Masana'antu: Bauta 300+ semiconductor na duniya da masana'antun lantarki.
✔ Fasaha na Yanke-Edge: Madaidaicin jagororin layi da tsarin servo suna tabbatar da kwanciyar hankali na jagorancin masana'antu.
✔ Cibiyar Sabis ta Duniya: Rufewa a Asiya, Turai, da Arewacin Amurka don tallafi na gida.
Don gwaji ko tambayoyi, tuntuɓe mu!