Tsarin Gabatar da Wafer don Ma'aunin Gabatar da Crystal

Takaitaccen Bayani:

Kayan aikin daidaitawar wafer na'ura ce mai inganci wacce ke amfani da ƙa'idodin watsa hasken X-ray don inganta masana'antar semiconductor da hanyoyin kimiyyar kayan aiki ta hanyar tantance yanayin kristal. Babban abubuwan da ke cikin sa sun haɗa da tushen hasken X (misali, Cu-Kα, tsawon rai na 0.154 nm), goniometer mai daidaito (ƙuduri mai kusurwa ≤0.001°), da na'urori masu ganowa (CCD ko masu ƙididdige scintillation). Ta hanyar jujjuya samfuran da kuma nazarin yanayin watsa hasken, yana ƙididdige ma'aunin kristal (misali, 100, 111) da tazara mai layi tare da daidaiton ±30 arcsecond. Tsarin yana tallafawa ayyukan atomatik, gyara injin, da juyawar axis da yawa, masu dacewa da wafers na inci 2-8 don aunawa cikin sauri na gefuna na wafer, jiragen sama na tunani, da daidaitawar Layer na epitaxial. Manyan aikace-aikacen sun haɗa da carbide na silicon mai yankewa, wafers na sapphire, da kuma tabbatar da aikin turbine mai zafi mai zafi, suna haɓaka halayen wutar lantarki na guntu da yawan amfanin ƙasa kai tsaye.


Siffofi

Gabatarwar Kayan Aiki

Kayan aikin daidaitawar wafer sune na'urori masu daidaito waɗanda suka dogara da ka'idodin diffraction na X-ray (XRD), waɗanda galibi ake amfani da su a masana'antar kera semiconductor, kayan gani, yumbu, da sauran masana'antar kayan lu'ulu'u.

Waɗannan kayan aikin suna tantance yanayin layin lu'ulu'u kuma suna jagorantar tsarin yankewa ko gogewa daidai. Manyan fasaloli sun haɗa da:

  • Ma'aunin daidaito mai girma:Yana iya warware jiragen kristal masu kusurwa masu ƙuduri har zuwa 0.001°.
  • Babban jituwa da samfurin:Yana tallafawa wafers har zuwa diamita na mm 450 da nauyin kilogiram 30, wanda ya dace da kayan aiki kamar silicon carbide (SiC), sapphire, da silicon (Si).
  • Tsarin Modular:Ayyukan da za a iya faɗaɗawa sun haɗa da nazarin lanƙwasa mai jujjuyawa, taswirar lahani a saman 3D, da na'urorin tara bayanai don sarrafa samfura da yawa.

Mahimman Sigogi na Fasaha

Nau'in Sigogi

Ƙimar da Aka Saba/Saitawa

Tushen X-ray

Cu-Kα (0.4×1 mm), ƙarfin lantarki mai saurin gudu 30 kV, wutar lantarki mai daidaitawa 0–5 mA

Range na Angular

θ: -10° zuwa +50°; 2θ: -10° zuwa +100°

Daidaito

ƙudurin kusurwar karkatarwa: 0.001°, gano lahani a saman: ±30 arcseconds (layin girgiza)

Saurin Dubawa

Binciken Omega yana kammala cikakken yanayin layi cikin daƙiƙa 5; Binciken Theta yana ɗaukar kimanin minti 1

Matakin Samfura

V-groove, tsotsa ta iska, juyawar kusurwa da yawa, mai dacewa da wafers mai inci 2-8

Ayyukan Faɗaɗawa

Binciken lanƙwasa mai jujjuyawa, taswirar 3D, na'urar tattara bayanai, gano lahani na gani (ƙarce-ƙarce, GBs)

Ka'idar Aiki

1. Tushen Diffraction na X-ray

  • Haskokin X suna hulɗa da ƙwayoyin atomic da electrons a cikin layin lu'ulu'u, suna samar da tsarin diffraction. Dokar Bragg (nλ = 2d sinθ​​) tana sarrafa alaƙar da ke tsakanin kusurwoyin diffraction (θ) da tazara tsakanin lattice (d).
    Masu ganowa suna kama waɗannan alamu, waɗanda aka yi nazari don sake gina tsarin kristal.

2. Fasahar Duba Omega

  • Gilashin yana juyawa akai-akai a kusa da wani tsayayyen axis yayin da hasken X-ray ke haskaka shi.
  • Masu ganowa suna tattara siginar diffraction a cikin jiragen kristal da yawa, wanda ke ba da damar tantance cikakken yanayin layi cikin daƙiƙa 5.

3. Binciken Layin Juyawa

  • Kusurwar lu'ulu'u mai kafaffen kusurwa mai bambancin yanayin X-ray don auna faɗin kololuwa (FWHM), tantance lahani da nau'in lattice.

4. Sarrafa ta atomatik

  • Haɗin PLC da allon taɓawa suna ba da damar saita kusurwoyin yankewa, amsawar lokaci-lokaci, da haɗa kai da injunan yankewa don sarrafa madauri mai rufewa.

Kayan Aikin Gabatar da Wafer 7

Amfani da Siffofi

1. Daidaito da Inganci

  • Daidaiton kusurwa ±0.001°, ƙudurin gano lahani <30 arcseconds.
  • Saurin duba Omega yana da sauri 200× fiye da na'urorin daukar hoto na Theta na gargajiya.

2. Daidaito da Sauƙi

  • Ana iya faɗaɗawa don aikace-aikace na musamman (misali, wafers na SiC, ruwan turbine).
  • Yana haɗawa da tsarin MES don sa ido kan samarwa a ainihin lokaci.

3. Dacewa da Kwanciyar Hankali

  • Yana ɗaukar samfuran da ba su da tsari daidai gwargwado (misali, fashewar sapphire ingots).
  • Tsarin sanyaya iska yana rage buƙatun kulawa.

4. Aikin Hankali

  • Daidaitawa da dannawa ɗaya da kuma sarrafa ayyuka da yawa.
  • Daidaita ta atomatik tare da lu'ulu'u masu nuni don rage kuskuren ɗan adam.

Kayan Aikin Gabatar da Wafer 5-5

Aikace-aikace

1. Masana'antar Semiconductor

  • Tsarin yanke wafer: Yana tantance yanayin wafer Si, SiC, GaN don ingantaccen ingancin yankewa.
  • Taswirar lahani: Yana gano ƙazantar saman ko gurɓataccen wuri don inganta yawan guntu.

2. Kayan gani

  • Lu'ulu'u marasa layi (misali, LBO, BBO) don na'urorin laser.
  • Alamar saman sapphire wafer don abubuwan da aka yi amfani da su na LED.

3. Tukwane da Haɗaɗɗun

  • Yana nazarin yanayin hatsi a cikin Si3N4 da ZrO2 don aikace-aikacen zafi mai yawa.

4. Bincike da Kula da Inganci

  • Jami'o'i/dakunan gwaje-gwaje don sabbin haɓaka kayan aiki (misali, ƙarfe masu yawan entropy).
  • QC na masana'antu don tabbatar da daidaiton tsari.

Ayyukan XKH

XKH tana ba da cikakken tallafin fasaha na zagayowar rayuwa don kayan aikin daidaitawar wafer, gami da shigarwa, inganta sigogin tsari, nazarin lanƙwasa mai jujjuyawa, da kuma taswirar lahani na saman 3D. Ana samar da mafita na musamman (misali, fasahar tara kayan ingot) don haɓaka ingancin samar da kayan semiconductor da na gani da sama da 30%. Wata ƙungiya mai himma tana gudanar da horo a wurin, yayin da tallafi na nesa 24/7 da maye gurbin kayan gyara cikin sauri ke tabbatar da amincin kayan aiki.


  • Na baya:
  • Na gaba:

  • Rubuta saƙonka a nan ka aika mana da shi