Wafer ɗin Silikon da aka Rufe da Karfe na Ti/Cu (Titanium/Copper)
Cikakken Zane
Bayani
NamuWafers ɗin silicon mai rufi da ƙarfe na Ti/Cuyana da wani abu mai inganci na silicon (ko kuma gilashin/quartz na zaɓi) wanda aka rufe daLayer ɗin mannewa na titaniumkuma aLayer mai sarrafa jan ƙarfeta amfani dadaidaitaccen magnetron sputteringLayin Ti yana inganta mannewa da kwanciyar hankali na tsari sosai, yayin da saman Cu yana ba da ƙarancin juriya, saman da ya dace da haɗakar lantarki da ƙirar microfabrication a ƙasa.
An ƙera waɗannan wafers ɗin don duka bincike da aikace-aikacen sikelin gwaji, suna samuwa a cikin girma dabam-dabam da kewayon juriya, tare da keɓancewa mai sassauƙa don kauri, nau'in substrate, da tsarin shafi.
Mahimman Sifofi
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Mannewa mai ƙarfi da aminci: Tsarin haɗin Ti yana ƙara mannewa da fim ɗin Si/SiO₂ kuma yana inganta ƙarfin sarrafawa
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Babban yanayin kwararar iskaRufin Cu yana ba da kyakkyawan aikin lantarki don lambobin sadarwa da tsarin gwaji
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Faɗin keɓancewa mai faɗi: girman wafer, juriya, yanayin daidaitawa, kauri na substrate, da kauri fim ɗin da ake samu akan buƙata
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Substrates masu shirye-shirye: ya dace da ayyukan dakin gwaje-gwaje na yau da kullun da na fasaha (lithography, gina electroplating, metrology, da sauransu)
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Jerin kayan da ake samu: banda Ti/Cu, muna kuma bayar da wafers ɗin Au, Pt, Al, Ni, Ag waɗanda aka shafa da ƙarfe
Tsarin da Tsarin da Aka saba
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Tari: Layer ɗin substrate + Ti adhesion Layer + Layer ɗin shafi na Cu
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Tsarin tsari na yau da kullun: Magnetron sputtering
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Tsarin aiki na zaɓi: Ƙafewar zafi / Electroplating (don buƙatun Cu mai kauri)
Abubuwan Inji na Gilashin Quartz
| Abu | Zaɓuɓɓuka |
|---|---|
| Girman Wafer | 2", 4", 6", 8"; 10×10 mm; girman yanka na musamman |
| Nau'in watsa wutar lantarki | Nau'in P / Nau'in N / Babban juriya na ciki (Un) |
| Hanya | <100>, <111>, da sauransu. |
| Juriya | <0.0015 Ω · cm; 1-10 Ω · cm; > 1000-10000 Ω·cm |
| Kauri (µm) | 2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; musamman |
| Kayan ƙasa | Silicon; ma'adini na zaɓi, gilashin BF33, da sauransu. |
| Kauri a fim | 10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (ana iya keɓancewa) |
| Zaɓuɓɓukan fim ɗin ƙarfe | Ti/C; Hakanan Au, Pt, Al, Ni, Ag akwai |
Aikace-aikace
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Substrates masu hulɗa da kuma masu sarrafa yanayidon R&D na na'ura da gwajin lantarki
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Tsarin iri don yin amfani da wutar lantarki(RDL, tsarin MEMS, kauri na Cu)
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Sol-gel da nanomaterial growth substratesdon binciken nano da fim ɗin siriri
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Na'urar duban madubi da kuma nazarin yanayin saman ruwa(Shirye-shiryen samfurin SEM/AFM/SPM da aunawa)
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Taswirar halittu/sinadaraikamar dandamalin al'adar ƙwayoyin halitta, ƙananan rayayyun furotin/DNA, da kuma abubuwan da ke nuna reflectometry
FAQ (Ti/C Metal-Coated Silicon Wafers)
T1: Me yasa ake amfani da Layer na Ti a ƙarƙashin murfin Cu?
A: Titanium yana aiki azaman abu mai aikiLayer ɗin mannewa (haɗin gwiwa), inganta haɗewar jan ƙarfe zuwa ga substrate da haɓaka kwanciyar hankali na haɗin gwiwa, wanda ke taimakawa rage barewa ko wargajewa yayin sarrafawa da sarrafawa.
Q2: Menene tsarin kauri na Ti/Cu na yau da kullun?
A: Haɗuwa gama gari sun haɗa daTi: goma na nm (misali, 10–50 nm)kumaCu: 50–300 nmdon fina-finan da aka zube. Yawancin lokaci ana samun yadudduka masu kauri na Cu (μm-matakin) ta hanyarelectroplating akan wani nau'in Cu da aka fesa, ya danganta da aikace-aikacenku.
Q3: Za ku iya shafa wafer ɗin a ɓangarorin biyu?
A: Eh.Shafi na gefe ɗaya ko na gefe biyuyana samuwa idan an buƙata. Da fatan za a fayyace buƙatarku lokacin yin oda.
game da Mu
XKH ta ƙware a fannin haɓaka fasaha, samarwa, da kuma sayar da gilashin gani na musamman da sabbin kayan lu'ulu'u. Kayayyakinmu suna ba da kayan lantarki na gani, na'urorin lantarki na masu amfani, da kuma sojoji. Muna ba da kayan gani na Sapphire, murfin ruwan tabarau na wayar hannu, yumbu, LT, Silicon Carbide SIC, Quartz, da wafers na lu'ulu'u na semiconductor. Tare da ƙwarewa mai ƙwarewa da kayan aiki na zamani, mun yi fice a fannin sarrafa samfura marasa tsari, da nufin zama babban kamfanin fasahar zamani na kayan lantarki na optoelectronic.
