SiC substrate 3inch 350um kauri HPSI nau'in Firayim Grade dummmy grade
Kayayyaki
Siga | Matsayin samarwa | Matsayin Bincike | Dummy Grade | Naúrar |
Daraja | Matsayin samarwa | Matsayin Bincike | Dummy Grade | |
Diamita | 76.2 ± 0.5 | 76.2 ± 0.5 | 76.2 ± 0.5 | mm |
Kauri | 500 ± 25 | 500 ± 25 | 500 ± 25 | µm |
Wafer Orientation | Kan-axis: <0001> ± 0.5° | Kan-axis: <0001> ± 2.0° | Kan-axis: <0001> ± 2.0° | digiri |
Maƙarƙashiya Maɗaukaki (MPD) | ≤ 1 | ≤ 5 | ≤ 10 | cm-2^-2-2 |
Juriya na Lantarki | ≥ 1E10 | ≥ 1E5 | ≥ 1E5 | Ω · cm |
Dopant | An kwance | An kwance | An kwance | |
Hannun Filayen Firamare | {1-100} ± 5.0° | {1-100} ± 5.0° | {1-100} ± 5.0° | digiri |
Tsawon Fitowa na Farko | 32.5 ± 3.0 | 32.5 ± 3.0 | 32.5 ± 3.0 | mm |
Tsawon Lantarki na Sakandare | 18.0 ± 2.0 | 18.0 ± 2.0 | 18.0 ± 2.0 | mm |
Gabatarwar Flat na Sakandare | 90° CW daga firamare lebur ± 5.0° | 90° CW daga firamare lebur ± 5.0° | 90° CW daga firamare lebur ± 5.0° | digiri |
Ƙarƙashin Ƙarfi | 3 | 3 | 3 | mm |
LTV/TTV/Baka/Warp | 3 / 10 / ± 30 / 40 | 3 / 10 / ± 30 / 40 | 5 / 15 / ± 40 / 45 | µm |
Tashin Lafiya | Si-fuska: CMP, C-fuska: goge | Si-fuska: CMP, C-fuska: goge | Si-fuska: CMP, C-fuska: goge | |
Cracks (Haske mai ƙarfi) | Babu | Babu | Babu | |
Hex Plates (Haske mai ƙarfi) | Babu | Babu | Tarin yanki 10% | % |
Yankunan Polytype (Haske Mai Ƙarfi) | Yankin tarawa 5% | Tarin yanki 20% | Tarin yanki 30% | % |
Scratches (Haske mai ƙarfi) | ≤ 5 scratches, tara tsayi ≤ 150 | ≤ 10 scratches, tara tsayi ≤ 200 | ≤ 10 scratches, tara tsayi ≤ 200 | mm |
Chipping Edge | Babu ≥ 0.5 mm nisa/zurfin | 2 an yarda ≤ 1 mm nisa/zurfin | 5 an yarda ≤ 5 mm nisa/zurfin | mm |
Gurbatar Sama | Babu | Babu | Babu |
Aikace-aikace
1. High-Power Electronics
Maɗaukakin haɓakar zafin jiki da faffadan bandgap na wafers na SiC ya sa su dace don babban iko, na'urori masu tsayi:
●MOSFETs da IGBTs don canza wutar lantarki.
●Ingantattun tsarin wutar lantarki na abin hawa, gami da inverters da caja.
●Smart grid kayayyakin more rayuwa da sabunta makamashi tsarin.
2. RF da Microwave Systems
Abubuwan SiC suna ba da damar RF mai girma da aikace-aikacen microwave tare da ƙarancin sigina:
●Tsarin sadarwa da tauraron dan adam.
●Tsarin radar sararin samaniya.
● Abubuwan haɓaka cibiyar sadarwa na 5G.
3. Optoelectronics da Sensors
Abubuwan musamman na SiC suna tallafawa aikace-aikacen optoelectronic iri-iri:
●Mai gano UV don kula da muhalli da fahimtar masana'antu.
● LED da Laser substrates don m-state lighting da daidaitattun kayan aiki.
●Na'urori masu zafi masu zafi don sararin samaniya da masana'antu na motoci.
4. Bincike da Ci gaba
Bambance-bambancen maki (Samarwa, Bincike, Dummy) yana ba da damar gwaji mai zurfi da ƙirar na'urar a cikin masana'antu da masana'antu.
Amfani
● Amincewa:Kyakkyawan juriya da kwanciyar hankali a cikin maki.
● Keɓancewa:Keɓaɓɓen daidaitawa da kauri don dacewa da buƙatu daban-daban.
●Mafi Girma:Abun da ba a kwance ba yana tabbatar da ƙarancin bambance-bambance masu alaƙa da ƙazanta.
● Ƙimar ƙarfi:Ya dace da buƙatun duka samarwa da yawa da bincike na gwaji.
SiC wafers masu tsafta inch 3 sune ƙofar ku zuwa manyan na'urori masu aiki da sabbin ci gaban fasaha. Don tambayoyi da cikakkun bayanai, tuntuɓe mu a yau.
Takaitawa
3-inch High Purity Silicon Carbide (SiC) Wafers, samuwa a cikin Production, Bincike, da Dummy Grades, ƙira ne masu ƙima waɗanda aka tsara don manyan kayan lantarki, tsarin RF / microwave, optoelectronics, da R&D na ci gaba. Waɗannan wafers sun ƙunshi kaddarorin da ba a rufe su ba, kaddarorin masu rufewa tare da kyakkyawan juriya (≥1E10 Ω · cm don Matsayin Samarwa), ƙarancin ƙarancin micropipe (≤1 cm-2 ^ -2-2), da ingantaccen ingancin saman. An inganta su don manyan ayyuka, gami da canza wutar lantarki, sadarwa, jin UV, da fasahar LED. Tare da daidaitawar da za a iya daidaitawa, ingantaccen yanayin zafi, da ingantattun kaddarorin inji, waɗannan wafers na SiC suna ba da damar ƙirƙira ingantaccen na'ura da ingantaccen ƙirƙira a cikin masana'antu.