Kayan Aikin Ɗaga Laser na Semiconductor

Takaitaccen Bayani:

 

Kayan Aikin Lift-Off na Semiconductor Laser yana wakiltar mafita ta zamani don rage girman ingot a cikin sarrafa kayan semiconductor. Ba kamar hanyoyin wafering na gargajiya waɗanda suka dogara da niƙa na inji, yanke waya ta lu'u-lu'u, ko kuma tsarin injiniya, wannan dandamalin laser yana ba da madadin da ba ya taɓawa, wanda ba ya lalatawa don cire yadudduka masu siriri daga ingots na semiconductor mai yawa.

An inganta shi don kayan aiki masu ƙarfi da ƙarfi kamar gallium nitride (GaN), silicon carbide (SiC), sapphire, da gallium arsenide (GaAs), Kayan Aikin Lift-Off na Semiconductor Laser yana ba da damar yanke daidai fim ɗin wafer kai tsaye daga cikin ingot ɗin kristal. Wannan fasahar ci gaba tana rage sharar kayan aiki sosai, tana inganta yawan fitarwa, kuma tana haɓaka ingancin substrate - duk waɗannan suna da mahimmanci ga na'urori na zamani a cikin na'urorin lantarki masu amfani da wutar lantarki, tsarin RF, photonics, da ƙananan nuni.


Siffofi

Bayanin Samfurin Kayan Aikin Ɗaga Laser

Kayan Aikin Lift-Off na Semiconductor Laser yana wakiltar mafita ta zamani don rage girman ingot a cikin sarrafa kayan semiconductor. Ba kamar hanyoyin wafering na gargajiya waɗanda suka dogara da niƙa na inji, yanke waya ta lu'u-lu'u, ko kuma tsarin injiniya, wannan dandamalin laser yana ba da madadin da ba ya taɓawa, wanda ba ya lalatawa don cire yadudduka masu siriri daga ingots na semiconductor mai yawa.

An inganta shi don kayan aiki masu ƙarfi da ƙarfi kamar gallium nitride (GaN), silicon carbide (SiC), sapphire, da gallium arsenide (GaAs), Kayan Aikin Lift-Off na Semiconductor Laser yana ba da damar yanke daidai fim ɗin wafer kai tsaye daga cikin ingot ɗin kristal. Wannan fasahar ci gaba tana rage sharar kayan aiki sosai, tana inganta yawan fitarwa, kuma tana haɓaka ingancin substrate - duk waɗannan suna da mahimmanci ga na'urori na zamani a cikin na'urorin lantarki masu amfani da wutar lantarki, tsarin RF, photonics, da ƙananan nuni.

Tare da mai da hankali kan sarrafa kansa ta atomatik, siffanta katako, da kuma nazarin hulɗar kayan laser, an tsara Semiconductor Laser Lift-Off Equipment don haɗawa cikin ayyukan ƙera semiconductor ba tare da wata matsala ba yayin da yake tallafawa sassaucin R&D da haɓaka yawan samar da kayayyaki.

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Fasaha da Ka'idar Aiki na Kayan Aikin Ɗaga Laser

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Tsarin da Semiconductor Laser Lift-Off Equipment ke gudanarwa yana farawa ne ta hanyar haskaka ingot ɗin mai bayarwa daga gefe ɗaya ta amfani da hasken ultraviolet mai ƙarfi. Wannan hasken yana mai da hankali sosai kan wani takamaiman zurfin ciki, yawanci tare da hanyar haɗin injiniya, inda ake ƙara yawan shan makamashi saboda bambancin gani, zafi, ko sinadarai.

 

A wannan matakin shaƙar makamashi, dumama na gida yana haifar da fashewar ƙananan abubuwa cikin sauri, faɗaɗa iskar gas, ko rugujewar wani layin da ke tsakanin fuskoki (misali, fim ɗin damuwa ko oxide na hadaya). Wannan rushewar da aka sarrafa daidai yana sa saman layin kristal - mai kauri na dubun micrometers - ya cire daga tushen ingot cikin tsabta.

 

Kayan Aikin Lift-Off na Semiconductor Laser yana amfani da kawunan na'urorin daukar hoto masu aiki da motsi, sarrafa axis na z-axis, da kuma reflectometry na ainihin lokaci don tabbatar da cewa kowace bugun jini tana isar da kuzari daidai a matakin da aka nufa. Haka kuma ana iya tsara kayan aikin ta hanyar yanayin fashewa ko ƙarfin bugun jini da yawa don haɓaka santsi na rabuwa da rage damuwa. Abu mafi mahimmanci, saboda hasken laser ba ya taɓa kayan a zahiri, haɗarin fashewar micro, durƙusawa, ko fashewar saman yana raguwa sosai.

 

Wannan ya sa hanyar rage girman laser ta zama abin da ke canza wasa, musamman a aikace-aikace inda ake buƙatar wafers masu faɗi sosai tare da sub-micron TTV (Bambancin Kauri Gabaɗaya).

Sigogi na Kayan Aikin Ɗaga Laser na Semiconductor

Tsawon Raƙuman Ruwa IR/SHG/THG/FHG
Faɗin bugun jini Nanosecond, Picosecond, Femtosecond
Tsarin Tantancewa Tsarin gani mai gyara ko tsarin gani na Galvano
Matakin XY 500 mm × 500 mm
Tsarin sarrafawa 160 mm
Gudun Motsi Matsakaicin 1,000 mm/sec
Maimaitawa ±1 μm ko ƙasa da haka
Daidaiton Matsayi: ±5 μm ko ƙasa da haka
Girman Wafer Inci 2-6 ko kuma an keɓance shi
Sarrafa Windows 10, 11 da PLC
Wutar Lantarki ta Wutar Lantarki AC 200 V ±20 V, Mataki ɗaya, 50/60 kHz
Girman Waje 2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Nauyi 1,000 kg

 

Aikace-aikacen Masana'antu na Kayan Aikin Ɗaga Laser

Kayan Aikin Ɗaga Laser na Semiconductor yana canza yadda ake shirya kayan aiki a fannoni daban-daban na semiconductor:

    • Na'urorin Wutar Lantarki na GaN a Tsaye na Kayan Aikin Ɗaga Laser

Ɗaga fina-finan GaN-on-GaN masu siriri sosai daga manyan ingots yana ba da damar tsarin watsawa a tsaye da kuma sake amfani da ƙananan abubuwa masu tsada.

    • Na'urar rage kiba ta SiC Wafer don na'urorin Schottky da MOSFET

Yana rage kauri na'urar yayin da yake kiyaye siffar substrate - ya dace da na'urorin lantarki masu saurin canzawa.

    • Kayan aikin ɗagawa na Laser da kayan nuni na tushen sapphire

Yana ba da damar raba yadudduka na na'urori daga sapphire boules don tallafawa samar da ƙananan ƙananan LED waɗanda aka inganta ta hanyar zafi.

    • Injiniyan Kayan Aiki na Kayan Aiki na Ɗaga Laser na III-V

Yana sauƙaƙa rabuwar yadudduka na GaAs, InP, da AlGaN don haɓaka optoelectronic mai ci gaba.

    • Na'urar ƙera na'urar auna firikwensin da kuma na'urar auna firikwensin Thin-Wafer

Yana samar da siraran yadudduka masu aiki don na'urori masu auna matsin lamba, na'urori masu auna accelerometers, ko na'urorin photodiodes, inda girmansu ke haifar da matsala a aiki.

    • Lantarki masu sassauƙa da gaskiya

Yana shirya ƙananan abubuwa masu siriri waɗanda suka dace da nunin faifai masu sassauƙa, da'irori masu sauƙin ɗauka, da tagogi masu haske.

A kowanne daga cikin waɗannan fannoni, Kayan Aikin Lift-Off na Semiconductor Laser suna taka muhimmiyar rawa wajen ba da damar rage amfani da kayan aiki, sake amfani da su, da kuma sauƙaƙe tsarin aiki.

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Tambayoyin da Ake Yawan Yi (Tambayoyin da Ake Yawan Yi) game da Kayan Aikin Ɗaga Laser

T1: Menene mafi ƙarancin kauri da zan iya samu ta amfani da Kayan Aikin Lift-Off na Semiconductor Laser?
A1:Yawanci yana tsakanin microns 10-30 dangane da kayan. Tsarin yana iya samun sakamako mai laushi tare da gyare-gyaren saitunan.

T2: Za a iya amfani da wannan don yanke wafers da yawa daga ingot iri ɗaya?
A2:Eh. Mutane da yawa suna amfani da dabarar ɗaga laser don cire siraran yadudduka da yawa daga cikin babban ingot ɗaya.

Q3: Waɗanne fasalulluka na aminci ne aka haɗa don aikin laser mai ƙarfi?
A3:Rufe-rufe na aji 1, tsarin kulle-kulle, kariyar katako, da rufe-kulle ta atomatik duk na yau da kullun ne.

T4: Ta yaya wannan tsarin yake kwatanta da yanka wayoyi na lu'u-lu'u dangane da farashi?
A4:Duk da cewa capex na farko zai iya zama mafi girma, ɗaga laser yana rage farashin amfani da shi sosai, lalacewar substrate, da matakan bayan sarrafawa - yana rage jimlar farashin mallaka (TCO) na dogon lokaci.

T5: Shin tsarin zai iya kaiwa inci 6 ko inci 8?
A5:Hakika. Dandalin yana tallafawa har zuwa inci 12 tare da rarrabawar haske iri ɗaya da kuma matakan motsi masu girma.

game da Mu

XKH ta ƙware a fannin haɓaka fasaha, samarwa, da kuma sayar da gilashin gani na musamman da sabbin kayan lu'ulu'u. Kayayyakinmu suna ba da kayan lantarki na gani, na'urorin lantarki na masu amfani, da kuma sojoji. Muna ba da kayan gani na Sapphire, murfin ruwan tabarau na wayar hannu, yumbu, LT, Silicon Carbide SIC, Quartz, da wafers na lu'ulu'u na semiconductor. Tare da ƙwarewa mai ƙwarewa da kayan aiki na zamani, mun yi fice a fannin sarrafa samfura marasa tsari, da nufin zama babban kamfanin fasahar zamani na kayan lantarki na optoelectronic.

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