N-Type SiC akan Si Composite Substrates Dia6inch
等级Daraja | ku 级 | P级 | D 级 |
Babban darajar BPD | Matsayin samarwa | Dummy Grade | |
直径Diamita | 150.0 mm 0.25mm | ||
厚度Kauri | 500 μm± 25μm | ||
晶片方向Wafer Orientation | Kashe axis: 4.0 ° zuwa <11-20> ± 0.5° don 4H-N Kan axis: <0001>±0.5°don 4H-SI | ||
主定位边方向Firamare Flat | {10-10}±5.0° | ||
主定位边长度Tsawon Lantarki na Farko | 47.5 mm± 2.5 mm | ||
边缘Cire gefen | 3 mm ku | ||
总厚度变化/弯曲度/翘曲度 TTV/Baw /Warp | ≤15μm/≤40μm/≤60μm | ||
微管密度和基面位错MPD&BPD | MPD≤1 cm-2 | MPD≤5 cm-2 | MPD≤15 cm-2 |
BPD≤1000cm-2 | |||
电阻率Resistivity | ≥1E5 Ω·cm | ||
表面粗糙度Tashin hankali | Yaren mutanen Poland Ra≤1 nm | ||
CMP Ra≤0.5 nm | |||
裂纹(强光灯观测) # | Babu | Tsayin tarawa ≤10mm, tsayi ɗaya≤2mm | |
Fasasshiyar haske mai ƙarfi | |||
六方空洞(强光灯观测)* | Tarin yanki ≤1% | Tarin yanki ≤5% | |
Hex Plates ta babban haske mai ƙarfi | |||
多型(强光灯观测)* | Babu | Tarin yanki ≤5% | |
Wuraren Polytype ta babban haske mai ƙarfi | |||
划痕(强光灯观测)*& | 3 scratches zuwa 1 × wafer diamita | 5 scratches zuwa 1× wafer diamita | |
Scratches da babban tsananin haske | tsayin tarawa | tsayin tarawa | |
崩边# Ciwon daji | Babu | 5 izini, ≤1 mm kowanne | |
表面污染物(强光灯观测) | Babu | ||
Lalacewa ta wurin babban haske mai ƙarfi |