Multi-Wire Diamond Sawing Machine don SiC Sapphire Ultra-Hard Brittle Materials
Gabatarwa zuwa Na'ura mai Zazzage Waya Diamond
Na'ura mai sassaka lu'u-lu'u da yawa shine tsarin yankan zamani na zamani wanda aka kera don sarrafa kayan aiki mai wuyar gaske da karye. Ta hanyar tura wayoyi masu lu'u-lu'u iri-iri da yawa, injin zai iya yanke wafers a lokaci guda a cikin zagaye guda, yana samun babban kayan aiki da daidaito. Wannan fasaha ta zama kayan aiki mai mahimmanci a cikin masana'antu irin su semiconductor, hasken rana photovoltaics, LEDs, da kuma ci-gaba da yumbu, musamman ga kayan kamar SiC, sapphire, GaN, quartz, da alumina.
Idan aka kwatanta da na al'ada guda-waya yankan, Multi-waya sanyi sanyi isar da dama zuwa daruruwan yanka a kowane tsari, ƙwarai rage sake zagayowar lokaci yayin da kiyaye m flatness (Ra <0.5 μm) da kuma girma madaidaici (± 0.02 mm). Ƙirar sa na yau da kullun yana haɗawa da tashin hankali mai sarrafa kansa, tsarin sarrafa kayan aiki, da saka idanu akan layi, yana tabbatar da dogon lokaci, barga, da cikakken samarwa mai sarrafa kansa.
Ma'aunin Fasaha na Na'ura mai Zazzage Waya ta Lu'u-lu'u
| Abu | Ƙayyadaddun bayanai | Abu | Ƙayyadaddun bayanai |
|---|---|---|---|
| Matsakaicin girman aikin (Square) | 220 × 200 × 350 mm | Tukar mota | 17.8 kW × 2 |
| Matsakaicin girman aikin (Zagaye) | Φ205 × 350 mm | Waya direban mota | 11.86 kW × 2 |
| Tazarar spindle | Φ250 ± 10 × 370 × 2 axis (mm) | Motar ɗagawa mai aiki | 2.42 kW × 1 |
| Babban axis | 650 mm | Motar motsi | 0.8 kW × 1 |
| Gudun gudu na waya | 1500 m/min | Motar shiryawa | 0.45 kW × 2 |
| Diamita na waya | Φ0.12-0.25 mm | Motar tashin hankali | 4.15 kW × 2 |
| Saurin dagawa | 225 mm/min | Motar da ake so | 7.5 kW × 1 |
| Max. jujjuyawar tebur | ± 12° | Slurry tanki iya aiki | 300 L |
| kusurwar lilo | ±3° | Sanyi kwarara | 200 l/min |
| Mitar lilo | ~ sau 30/min | Temp. daidaito | ± 2 °C |
| Yawan ciyarwa | 0.01-9.99 mm/min | Tushen wutan lantarki | 335+210 (mm²) |
| Yawan ciyarwar waya | 0.01-300 mm/min | Matse iska | 0.4-0.6 MPa |
| Girman inji | 3550 × 2200 × 3000 mm | Nauyi | 13,500 kg |
Injin Aiki na Na'ura mai Zazzage Waya Diamond
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Multi-Wire Yankan Motsi
Wayoyin lu'u-lu'u da yawa suna motsawa akan saurin aiki tare har zuwa 1500 m/min. Madaidaicin jagororin ja-gora da sarrafa tashin hankali na rufaffiyar madauki (15-130 N) suna kiyaye wayoyi su tsaya tsayin daka, rage damar karkacewa ko karyewa. -
Madaidaicin Ciyarwa & Matsayi
Matsayin da aka yi amfani da Servo ya cimma daidaito ± 0.005 mm. Laser zaɓi na zaɓi ko daidaitawar hangen nesa yana haɓaka sakamako don hadaddun siffofi. -
Sanyaya da Cire tarkace
Babban mai sanyaya matsa lamba yana ci gaba da cire kwakwalwan kwamfuta kuma yana sanyaya wurin aiki, yana hana lalacewar thermal. Tace-mataki da yawa yana tsawaita rayuwa mai sanyi kuma yana rage lokacin raguwa. -
Platform Sarrafa Smart
Direbobin servo masu ba da amsa mai girma (<1 ms) suna daidaita ciyarwa, tashin hankali, da saurin waya. Haɗe-haɗe sarrafa girke-girke da canza siga ta danna sau ɗaya sauƙaƙe samar da taro.
Muhimman Fa'idodin Na'urar Saƙon Waya Mai-Waya Diamond
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Babban Haɓakawa
Iya yankan 50-200 wafers a kowace gudu, tare da asarar kerf <100 μm, inganta amfani da kayan aiki har zuwa 40%. Abin da ake samarwa shine 5-10 × na tsarin tsarin waya ɗaya na gargajiya. -
Daidaitaccen Sarrafa
Tsayar da tashin hankali na waya tsakanin ± 0.5 N yana tabbatar da daidaiton sakamako akan abubuwa masu gatsewa daban-daban. Sa ido na ainihi akan mahaɗin HMI 10" yana goyan bayan ajiyar girke-girke da aiki mai nisa. -
Mai sassauƙa, Gina Modular
Mai jituwa tare da diamita na waya daga 0.12-0.45 mm don matakai daban-daban na yanke. Gudanar da mutum-mutumi na zaɓi yana ba da damar cikakken layin samarwa na atomatik. -
Dogaro da Matsayin Masana'antu
Simintin gyare-gyare masu nauyi/ firam ɗin ƙirƙira suna rage lalacewa (<0.01 mm). Jagororin jagorori tare da suturar yumbu ko carbide suna ba da fiye da sa'o'i 8000 na rayuwar sabis.
Filayen Aikace-aikace na Na'ura mai Zazzagewar Waya Diamond
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Semiconductors: Yanke SiC don kayan aikin wutar lantarki na EV, GaN substrates don na'urorin 5G.
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Photovoltaics: High-gudun silicon wafer slicing tare da ± 10 μm uniformity.
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LED & Optics: Sapphire substrates don epitaxy da daidaitattun abubuwan gani tare da guntuwar gefen 20 μm.
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Na gaba Ceramics: Gudanar da alumina, AlN, da makamantansu don abubuwan sarrafa sararin samaniya da abubuwan sarrafa zafi.
FAQ – Multi-Wire Diamond Sawing Machine
Q1: Mene ne abũbuwan amfãni na Multi-waya sawing idan aka kwatanta da guda-waya inji?
A: Multi-waya tsarin na iya yanka dozin zuwa ɗaruruwan wafers lokaci guda, haɓaka aiki ta 5-10 ×. Hakanan amfani da kayan yana da girma tare da asarar kerf ƙasa da μm 100, yana mai da shi manufa don samarwa da yawa.
Q2: Wadanne nau'ikan kayan za a iya sarrafa su?
A: An ƙera na'ura don kayan aiki mai wuyar gaske, gami da silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, alumina (Al₂O₃), da aluminum nitride (AlN).
Q3: Menene daidaitattun da za a iya cimmawa da ingancin saman?
A: Taushin saman zai iya kaiwa Ra <0.5 μm, tare da daidaiton girman ± 0.02 mm. Ana iya sarrafa guntuwar gefen zuwa <20 μm, saduwa da semiconductor da ka'idojin masana'antar optoelectronic.
Q4: Shin tsarin yankan yana haifar da fasa ko lalacewa?
A: Tare da babban matsi mai sanyaya da kuma kula da tashin hankali-madauki, an rage haɗarin ƙananan ƙwayoyin cuta da lalacewar danniya, yana tabbatar da ingantaccen amincin wafer.
