Kayan aikin yanke Laser na Infrared Picosecond guda biyu don sarrafa Gilashin gani/Quartz/Sapphire

Takaitaccen Bayani:

Takaitaccen Bayani na Fasaha:
Tsarin Yanke Laser na Gilashin Infrared Picosecond Dual-Station wani tsari ne na masana'antu wanda aka ƙera musamman don yin aiki daidai gwargwado na kayan aiki masu haske masu karyewa. An sanye shi da tushen laser picosecond infrared 1064nm (faɗin bugun jini <15ps) da ƙirar dandamali mai tashoshi biyu, wannan tsarin yana ba da ingantaccen sarrafawa sau biyu, yana ba da damar yin aiki mai kyau na gilashin gani (misali, BK7, fused silica), lu'ulu'u na quartz, da sapphire (α-Al₂O₃) tare da tauri har zuwa Mohs 9.
Idan aka kwatanta da nanosecond lasers na gargajiya ko hanyoyin yankewa na inji, Tsarin Yanke Laser na Gilashin Infrared Picosecond Dual-Station yana cimma faɗin kerf matakin micron (tsawo na yau da kullun: 20-50μm) ta hanyar tsarin "share ablation", tare da yankin da zafi ya shafa wanda aka iyakance zuwa <5μm. Yanayin aiki na tashar biyu mai canzawa yana ƙara amfani da kayan aiki da kashi 70%, yayin da tsarin daidaitawar gani na mallakar (daidaitaccen matsayi na CCD: ±2μm) ya sa ya zama mafi dacewa don samar da kayan gilashin 3D masu lanƙwasa (misali, gilashin murfin wayar hannu, ruwan tabarau na smartwatch) a masana'antar kayan lantarki na mabukaci. Tsarin ya haɗa da kayan aiki na loda/saukewa ta atomatik, suna tallafawa samarwa 24/7 akai-akai.

Aika mana imel

Siffofi

Babban siga

Nau'in Laser	Infrared Picosecond
Girman Dandalin	700×1200 (mm)
	900×1400 (mm)
Kauri Yankewa	0.03-80 (mm)
Saurin Yankewa	0-1000 (mm/s)
Karyewar Gefen Yankan	<0.01 (mm)
Lura: Ana iya keɓance girman dandamali.

Mahimman Sifofi

1. Fasahar Laser Ultrafast:
· Gajerun bugun bugun matakin Picosecond (10⁻¹²s) tare da fasahar daidaita MOPA suna samun ƙarfin da ya fi girma >10¹² W/cm².
· Tsawon infrared (1064nm) yana ratsa kayan da ba su da layi, yana hana cire saman.
· Tsarin gani mai mayar da hankali da yawa yana samar da wurare huɗu masu zaman kansu na sarrafawa a lokaci guda.

2. Tsarin Daidaita Tashoshi Biyu:
· Matakan injin layi biyu na dutse mai tushe (daidaitaccen matsayi: ±1μm).
· Lokacin sauya tashar <0.8s, yana ba da damar gudanar da ayyukan "aiki-loda/saukewa" a layi ɗaya.
· Kula da zafin jiki mai zaman kansa (23±0.5°C) a kowace tasha yana tabbatar da dorewar injina na dogon lokaci.

3. Sarrafa Tsarin Aiki Mai Inganci:
· Bayanan kayan da aka haɗa (sigogi 200+ na gilashi) don daidaita sigogi ta atomatik.
· Kula da plasma na ainihin lokaci yana daidaita kuzarin laser sosai (ƙudurin daidaitawa: 0.1mJ).
· Kariyar labulen iska tana rage ƙananan fasa-tsattsage na gefen (<3μm).
A cikin yanayin aikace-aikacen da aka saba amfani da shi wanda ya ƙunshi yanke wafer mai kauri 0.5mm, tsarin yana cimma saurin yankewa na 300mm/s tare da girman guntu <10μm, wanda ke wakiltar ingantaccen inganci sau 5 fiye da hanyoyin gargajiya.

Amfanin Sarrafawa

1. Tsarin yankewa da rabawa mai haɗaka biyu don aiki mai sassauƙa;
2. Injin sarrafa bayanai masu sauri yana haɓaka ingancin juyawar tsari;
3. Gefen yankewa marasa taper tare da ƙarancin guntu (<50μm) da kuma kula da mai aiki lafiya;
4. Canjin da ba shi da matsala tsakanin ƙayyadaddun samfura tare da aiki mai sauƙi;
5. Ƙananan farashin aiki, yawan amfanin ƙasa mai yawa, tsarin da ba ya gurbata muhalli da kuma wanda ba ya gurbata muhalli;
6. Sifili samar da tarkace, ruwan sharar gida ko ruwan shara tare da tabbacin ingancin saman;

Nunin samfurin

Kayan aikin yanke laser na gilashi mai amfani da infrared picosecond guda biyu 5

Aikace-aikace na yau da kullun

1. Masana'antar Lantarki ta Masu Amfani:
· Yanke madaidaicin siffar gilashin murfin wayar hannu ta 3D (daidaitaccen kusurwar R: ±0.01mm).
· Haƙa rami mai zurfi a cikin ruwan tabarau na agogon sapphire (mafi ƙarancin buɗewa: Ø0.3mm).
· Kammala wuraren watsa gilashin gani don kyamarorin da ba a nuna su ba.

2. Samar da Kayan Aiki na gani:
· Injin sarrafa ƙananan na'urori don jerin ruwan tabarau na AR/VR (girman fasali ≥20μm).
· Yankan kusurwa na prism na quartz don masu haɗa laser (juriyar kusurwa: ±15").
· Siffar bayanin martaba na matatun infrared (yankewa ƙasa da 0.5°).

3. Marufi na Semiconductor:
· Tsarin sarrafa gilashi ta hanyar amfani da gilashi (TGV) a matakin wafer (rabo na al'amari 1:10).
· Ƙarƙashin Microchannel akan gilashin da aka yi amfani da su don ƙananan kwakwalwan microfluidic (Ra <0.1μm).
· Rage yawan maimaitawa don masu kunna sauti na quartz na MEMS.

Don ƙera tagogi na LiDAR na mota, tsarin yana ba da damar yanke gilashin quartz mai kauri 2mm tare da yankewa mai lanƙwasa na 89.5±0.3°, wanda ya cika buƙatun gwajin girgiza na matakin mota.

Aikace-aikacen Tsari

An ƙera shi musamman don yanke kayan da suka lalace/masu tauri, gami da:
1. Gilashin gilashi na yau da kullun da na gani (BK7, silica mai haɗewa);
2. Lu'ulu'u na Quartz da sapphire;
3. Matatun gilashi masu zafi da na gani
4. Madubin abubuwa
Yana da ikon yankewa da kuma haƙa ramin ciki daidai (mafi ƙarancin Ø0.3mm)

Ka'idar Yanke Laser

Laser ɗin yana samar da bugun jini mai gajeru tare da kuzari mai yawa wanda ke hulɗa da aikin a cikin lokacin femtosecond-to-picosecond. Yayin yaɗuwa ta cikin kayan, hasken yana lalata tsarin damuwa don samar da ramukan filamentation na sikelin micron. Ingantaccen tazara tsakanin ramuka yana haifar da ƙananan fasa, waɗanda ke haɗuwa da fasahar rabawa don cimma daidaiton rabuwa.

Amfanin Yanke Laser

1. Haɗakarwa ta atomatik mai girma (haɗakar aikin yankewa/tsaga) tare da ƙarancin amfani da wutar lantarki da kuma sauƙin aiki;
2. Tsarin aiki mara lamba yana ba da damar ƙwarewa ta musamman wacce ba za a iya cimma ta hanyar hanyoyin gargajiya ba;
3. Aiki mara amfani yana rage farashin gudanarwa kuma yana haɓaka dorewar muhalli;
4. Mafi kyawun daidaito tare da kusurwar sifili da kuma kawar da lalacewar kayan aiki na biyu;
XKH tana ba da cikakkun ayyukan keɓancewa don tsarin yanke laser ɗinmu, gami da saitunan dandamali na musamman, haɓaka sigogin tsari na musamman, da mafita na musamman don biyan buƙatun samarwa na musamman a cikin masana'antu daban-daban.