Kayan aikin hakowa na Laser na Nanosecond na Infrared don kauri hakowa na gilashi ≤20mm

Kayan aikin haƙa Laser na Nanosecond mai infrared don kauri haƙa gilashi ≤20mm Hoton da aka nuna

Takaitaccen Bayani:

Takaitaccen Bayani na Fasaha:
Tsarin Hako Gilashin Laser na Infrared Nanosecond wani tsari ne na sarrafa kayan gilashi na masana'antu wanda aka ƙera musamman don haƙo kayan gilashi daidai. Ta amfani da tushen laser nanosecond na infrared na 1064nm (faɗin bugun jini: 10-300ns), wannan tsarin yana cimma babban haƙowa a cikin nau'ikan gilashin da kauri ≤20mm ta hanyar ingantattun fasahar sarrafa makamashi da siffanta katako.
A aikace-aikacen layin samarwa na aiki, Tsarin Hako Gilashin Laser na Infrared Nanosecond yana nuna fa'idodi na musamman na tsari. Idan aka kwatanta da hako injina na gargajiya ko sarrafa laser na CO₂, ingantaccen tsarin sarrafa tasirin zafi yana ba da damar hako daidai tare da diamita na ramuka daga Φ0.1-5mm a cikin gilashin soda-lime na yau da kullun, yayin da yake kiyaye taper bango na rami a cikin ±0.5°. Musamman a cikin sarrafa ruwan tabarau na kyamarar wayar salula, tsarin zai iya samar da jerin ramuka na Φ0.3mm masu daidaiton matsayi na ±10μm, wanda ke biyan buƙatun ƙarancin aiki a cikin kayan lantarki na masu amfani. Tsarin yana zuwa daidai tare da hanyoyin haɗin kai na loda/saukewa ta atomatik don haɗa kai ba tare da matsala ba tare da layukan samarwa da ke akwai.

Aika mana imel

Siffofi

Babban siga

Nau'in Laser	Nanosecond mai infrared
Girman dandamali	*800600(mm)**
	*20001200(mm)**
Kauri haƙa rami	≤20(mm)
Gudun haƙa rami	0-5000(mm/s)
Karyewar gefen hakowa	<0.5(mm)
Lura: Ana iya keɓance girman dandamali.

Ka'idar hakowa ta Laser

Ana mayar da hankali kan hasken laser a wuri mafi kyau dangane da kauri na kayan aikin, sannan a duba ta hanyar hanyoyin da aka riga aka tsara a babban gudu. Ta hanyar hulɗa da hasken laser mai ƙarfi, ana cire kayan da aka nufa daga layi-layi don samar da hanyoyin yankewa, wanda ke cimma madaidaicin hudawa (da'ira, murabba'i, ko yanayin ƙasa mai rikitarwa) tare da raba kayan da aka sarrafa.

Amfanin hakowa na Laser

· Haɗa kai ta atomatik tare da ƙarancin amfani da wutar lantarki da kuma sauƙin aiki;

· Tsarin aiki mara hulɗa yana ba da damar yin amfani da tsarin siffofi marasa iyaka fiye da hanyoyin gargajiya;

· Aiki ba tare da amfani ba yana rage farashin aiki kuma yana ƙara dorewar muhalli;

· Daidaito mai kyau tare da ƙarancin guntuwar gefen da kuma kawar da lalacewar kayan aiki na biyu;

Kayan aikin haƙa laser nanosecond gilashi mai infrared 2

Nunin samfurin

Aikace-aikacen Tsari

An ƙera tsarin don sarrafa kayan da suka yi rauni/tauri, gami da haƙa rami, cire fim, da kuma daidaita saman. Amfanin da aka saba amfani da su sun haɗa da:

1. Hakowa da kuma cire kayan aikin ƙofar shawa

2. Daidaiton ramukan gilashin kayan aiki

3. Faifan hasken rana ta hanyar haƙa rami

4. Buɗewar farantin murfin makulli/soket

5. Cire murfin madubi tare da haƙa rami

6. Tsarin shimfidar wuri da kuma shimfidar wuri na musamman don samfuran musamman

Amfanin Sarrafawa

1. Babban dandamali mai tsari yana ɗaukar nau'ikan samfura daban-daban a faɗin masana'antu

2. Haƙa rami mai sarkakiya da aka samu a aikin wucewa ɗaya

3. Ƙaramin guntuwar gefen da ke da kyakkyawan ƙarewa (Ra <0.8μm)

4. Sauyi mara matsala tsakanin ƙayyadaddun samfura tare da aiki mai sauƙi

5. Aiki mai araha wanda ke ɗauke da:

· Yawan amfanin ƙasa mai yawa (>99.2%)

· Sarrafawa ba tare da amfani ba

· Babu hayakin gurɓatawa

6. Tsarin aiki mara lamba yana tabbatar da kiyaye daidaiton saman

Mahimman Sifofi

1. Fasahar Gudanar da Zafin da Ya Kamata:

· Yana amfani da tsarin haƙa mai saurin bugun jini da yawa tare da ƙarfin bugun jini ɗaya mai daidaitawa (0.1–50 mJ)

· Tsarin kariya daga labulen iska mai sassauƙa yana iyakance yankin da zafi ya shafa zuwa cikin kashi 10% na diamita na ramin

· Tsarin sa ido kan zafin jiki na infrared na ainihin lokaci yana rama sigogin makamashi ta atomatik (±2% kwanciyar hankali)

2. Dandalin Sarrafa Wayo:

· An sanye shi da matakin injin layi mai inganci (sauƙaƙen matsayi mai maimaitawa: ±2 μm)

· Tsarin daidaita gani mai haɗaka (CCD megapixel 5, daidaiton ganewa: ±5 μm)

· Bayanan tsari da aka riga aka ɗora tare da sigogi masu inganci don nau'ikan kayan gilashi sama da 50

3. Tsarin Samarwa Mai Inganci Mai Kyau:

· Yanayin aiki mai sauyawa ta tashoshi biyu tare da lokacin canza kayan aiki ≤ daƙiƙa 3

· Tsarin sarrafawa na yau da kullun na rami 1/daƙiƙa 0.5 (Φ0.5 mm ta cikin rami)

· Tsarin zamani yana ba da damar musayar ruwan tabarau cikin sauri (zagayen sarrafawa: Φ0.1–10 mm)

Aikace-aikacen Sarrafa Kayan Abu Mai Tauri

Nau'in Kayan Aiki	Yanayin Aikace-aikace	Sarrafa Abun Ciki
Gilashin Soda-lemun tsami	Ƙofofin shawa	Ramin hawa da hanyoyin magudanar ruwa
Gilashin Soda-lemun tsami	Allon sarrafa kayan aiki	Jerin ramukan magudanar ruwa
Gilashin Mai Zafi	Tagogi masu kallon murhu	Jerin ramukan iska
Gilashin Mai Zafi	Tafukan girki na induction	Tashoshin sanyaya masu kusurwa
Gilashin Borosilicate	Allon hasken rana	Ramukan hawa
Gilashin Borosilicate	Gilashin dakin gwaje-gwaje	Tashoshin magudanar ruwa na musamman
Gilashi-yumbu	Saman girki	Ramukan sakawa na ƙona wuta
Gilashi-yumbu	Masu dafa abinci na induction	Jerin ramukan firikwensin da aka ɗora
Saffir	Murfin na'urar wayo	Ramukan samun iska
Saffir	Tashoshin kallon masana'antu	Ramukan da aka ƙarfafa
Gilashin da aka Rufe	Madubin bandaki	Ramin hawa (cire shafi + haƙa rami)
Gilashin da aka Rufe	Bangon labule	Ramukan magudanar ruwa na gilashin ƙasa-E da aka ɓoye
Gilashin da aka yi da yumbu	Murfin Maɓalli/Sokewa	Ramukan aminci + ramukan waya
Gilashin da aka yi da yumbu	Shimfidar wuta	Ramin gaggawa na rage matsin lamba

XKH tana ba da cikakken tallafin fasaha da ayyukan ƙara daraja ga kayan aikin haƙa gilashin laser nanosecond na infrared don tabbatar da ingantaccen aiki a duk tsawon lokacin aikin kayan aiki. Muna ba da ayyukan haɓaka tsari na musamman inda ƙungiyar injiniyanmu ke haɗin gwiwa da abokan ciniki don kafa ɗakunan karatu na sigogi na musamman na kayan aiki, gami da shirye-shiryen haƙa na musamman don kayan aiki masu ƙalubale kamar sapphire da gilashin da aka sanyaya tare da bambancin kauri daga 0.1mm zuwa 20mm. Don inganta samarwa, muna gudanar da gwaje-gwajen daidaita kayan aiki a wurin da kuma tabbatar da aiki, muna tabbatar da ma'auni masu mahimmanci kamar haƙurin diamita na rami (±5μm) da ingancin gefen (Ra<0.5μm) sun cika ƙa'idodin masana'antu.

Na baya: Kayan aikin fasahar laser Microjet kayan aikin yanke wafer SiC sarrafa kayan aiki

Na gaba: Substrate Mai Inci 6 Mai Raɗaɗin SiC Mai Haɗaka 4H Diamita 150mm Ra≤0.2nm Warp≤35μm