Infrared Nanosecond Laser Drilling kayan aikin don Gilashin hakowa kauri≤20mm

Takaitaccen Bayani:

Takaitaccen Bayani:
Infrared Nanosecond Laser Gilashin Drilling System shine tsarin sarrafa matakin masana'antu wanda aka haɓaka musamman don hakowa na kayan gilashi. Amfani da 1064nm infrared nanosecond Laser tushen ( bugun jini nisa: 10-300ns), wannan tsarin cimma high-madaidaicin hakowa a daban-daban gilashin substrates tare da kauri ≤20mm ta daidai makamashi iko da katako siffata fasahar.
A cikin aikace-aikacen layin samarwa masu amfani, Infrared Nanosecond Laser Gilashin hakowa System yana nuna fa'idodin tsari na musamman. Idan aka kwatanta da na al'ada inji hakowa ko CO₂ Laser aiki, da tsarin ta inganta thermal sakamako sarrafa inji sa madaidaicin hakowa tare da rami diamita jere daga Φ0.1-5mm a misali soda-lemun tsami gilashin, yayin da rike rami bango taper a cikin ± 0.5 °. Musamman a cikin sarrafa ruwan tabarau na sapphire na kyamarar wayar hannu, tsarin na iya ci gaba da samar da Φ0.3mm micro-rami tsararru tare da daidaiton matsayi na ± 10μm, saduwa da stringent miniaturization bukatun a cikin kayan lantarki na mabukaci. Tsarin ya zo daidaitaccen tsari tare da musaya masu ɗaukar nauyi / saukarwa ta atomatik don haɗawa mara kyau tare da layukan samarwa da ake da su.

Aika mana imel

Cikakken Bayani

Tags samfurin

Babban siga

Nau'in Laser	Infrared nanosecond
Girman dandamali	*800600(mm)**
	*20001200(mm)**
Kaurin hakowa	≤20 (mm)
Gudun hakowa	0-5000(mm/s)
Karye gefen hakowa	<0.5 (mm)
Lura: Girman dandali na iya musamman.

Ka'idar hakowa Laser

Laser katako yana mai da hankali a wuri mafi kyau dangane da kauri na workpiece, sa'an nan kuma bincika tare da ƙayyadaddun hanyoyin da aka ƙayyade a babban gudun. Ta hanyar hulɗa tare da katako mai ƙarfi na Laser, an cire kayan da aka yi niyya Layer-by-Layer don samar da tashoshi na yanke, cimma madaidaicin perforation ( madauwari, murabba'i, ko hadaddun geometries) tare da rarraba kayan sarrafawa.

Amfanin Hakowa Laser

Babban haɗin kai ta atomatik tare da ƙarancin amfani da wutar lantarki da sauƙaƙe aiki;

Ba a tuntuɓar aiki ba yana ba da damar ƙirar geometries mara iyaka fiye da hanyoyin al'ada;

· Aiki mara amfani yana rage farashin aiki kuma yana haɓaka dorewar muhalli;

· Madaidaicin madaidaici tare da ɗan guntun gefuna da kawar da lalacewar kayan aiki na biyu;

Infrared nanosecond gilashin Laser hako kayan aiki 2

Samfurin nuni

Tsari Aikace-aikace

An ƙirƙira tsarin don daidaitaccen aiki na gaggautsa / kayan aiki masu wuya ciki har da hakowa, tsagi, cire fim, da rubutun saman. Aikace-aikace na yau da kullun sun haɗa da:

1. Hakowa da lura da abubuwan haɗin ƙofar shawa

2. Daidaitaccen perforation na kayan gilashin gilashi

3. Solar panel ta hanyar hakowa

4. Canjawa / soket murfin farantin karfe

5. Mirror shafi cire tare da hakowa

6. Custom surface texturing da tsagi ga na musamman kayayyakin

Amfanin Gudanarwa

1. Babban tsarin dandamali yana ɗaukar nau'ikan samfura daban-daban a cikin masana'antu

2. Complex contour hakowa samu a guda-wuce aiki

3. Karamin gefen chipping tare da m saman gama (Ra <0.8μm)

4. Sauye-sauye mara kyau tsakanin ƙayyadaddun samfurin tare da aiki mai mahimmanci

5. Aiki mai inganci mai fa'ida:

Yawan yawan amfanin ƙasa (>99.2%)

· sarrafawa mara amfani

· Rashin fitar da gurbataccen iska

6.Non-lamba aiki aiki tabbatar da surface mutunci adana

Mabuɗin Siffofin

1. Daidaitaccen Fasahar Gudanar da Zazzabi:

Yana amfani da tsarin hakowa mai ci gaba da yawa tare da daidaitacce kuzarin bugun jini guda (0.1-50mJ)

Sabbin tsarin kariya na labulen iska na gefe yana iyakance yankin da zafi ya shafa zuwa tsakanin 10% na diamita

* Tsarin sa ido kan zafin jiki na infrared na ainihi yana rama sigogin makamashi ta atomatik (± 2% kwanciyar hankali)

2. Dandalin Gudanarwa na Hankali:

An sanye shi da babban matakin motar linzamin kwamfuta (maimaita daidaiton matsayi: ± 2 μm)

Haɗin tsarin daidaita hangen nesa (5-megapixel CCD, daidaiton ganewa: ± 5 μm)

Bayanan bayanai da aka riga aka ɗora tare da ingantattun sigogi don nau'ikan kayan gilashin 50+

3. Ƙirar Ƙirƙirar Ƙarfafa Ƙarfafawa:

Yanayin musanya ta tasha biyu tare da canjin lokaci ≤3 seconds

· Daidaitaccen zagayowar sarrafawa na rami 1/0.5 (Φ0.5 mm ta rami)

Zane na zamani yana ba da damar musanyawa cikin sauri na taron ruwan tabarau mai mai da hankali (kewayon sarrafawa: Φ0.1-10 mm)

Brittle Hard Material Processing Applications

Nau'in Abu	Yanayin aikace-aikace	Abubuwan Gudanarwa
Gilashin soda-lime	Ƙofofin shawa	Ramin hawa & tashoshi na magudanar ruwa
Gilashin soda-lime	Na'urorin sarrafa kayan aiki	Tsare-tsaren ramin magudanar ruwa
Gilashin zafi	Tanda duba windows	Tsarukan ramin numfashi
Gilashin zafi	Induction girki	Tashoshi masu kwantar da hankali
Borosilicate Glass	Solar panels	Ramin hawa
Borosilicate Glass	Kayan gilashin dakin gwaje-gwaje	Tashoshin magudanar ruwa na al'ada
Gilashi- yumbura	Wuraren dafa abinci	Ramukan sanya masu ƙonewa
Gilashi- yumbura	Induction cookers	Tsarukan hawan ramin firikwensin
Sapphire	Smart na'urar rufewa	Ramin iska
Sapphire	Abubuwan kallon masana'antu	Ƙarfafa ramuka
Gilashin mai rufi	madubin wanka	Ramin hawa (cire mai rufi + hakowa)
Gilashin mai rufi	Ganuwar labule	Low-E gilashin boye ramukan magudanar ruwa
Gilashin yumbura	Murfin juyawa/ soket	Ramin tsaro + ramukan waya
Gilashin yumbura	Katangar wuta	Ramukan taimakon matsa lamba na gaggawa

XKH yana ba da cikakkiyar goyon bayan fasaha da sabis na ƙima don infrared nanosecond Laser hako kayan aikin hakowa don tabbatar da kyakkyawan aiki a duk tsawon rayuwar kayan aiki. Muna ba da sabis na haɓaka tsari na musamman inda ƙungiyar injiniyoyinmu ke haɗin gwiwa tare da abokan ciniki don kafa takamaiman ɗakunan karatu na siga, gami da shirye-shiryen hakowa na musamman don kayan ƙalubale kamar sapphire da gilashin zafi tare da bambancin kauri daga 0.1mm zuwa 20mm. Don inganta haɓakawa, muna gudanar da ƙirar kayan aiki a kan kayan aiki da gwaje-gwajen tabbatar da aiki, tabbatar da ma'auni mai mahimmanci kamar haƙuri na diamita (± 5μm) da ingancin gefen (Ra <0.5μm) sun hadu da ka'idojin masana'antu.

Na baya: Microjet Laser fasahar kayan aiki wafer yankan SiC kayan aiki

Na gaba: 6 inch Conductive SiC Composite Substrate 4H Diamita 150mm Ra≤0.2nm Warp≤35μm

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