Babban madaidaicin lasisi na Laser ya dace da Shafar yumɓu Sumari

A takaice bayanin:

Injin ya samu mafi karancin tabo ta hanyar fadada da fadi da kuma mai da hankali, da kuma amfani da tsarin sarrafawa don gano tsarin laser, laser hako da yankan laser, Laser hako da yankan laser, Laser Wering da Laser. Duk na'urorin da aka sanye take da kwamfutar sarrafawa, software na musamman don injin laser da software na musamman don yankan katako na Laser. Kyakkyawan Software Software, na iya saita cirewar hannu, lokacin hakowar hako da kusurwa, da sauri sauri, da kuma wasu sigogi; Tare da nunin hoto mai hoto, aiwatar da aikin bin diddigin; Akwai shirye-shiryen g code ko CAD zane-zane na atomatik shirye-shirye na atomatik, mai sauƙin aiki. Babban fasali na injin suna da babban daidaitaccen hako-h hiting, babban aikin zafi, aikin software, wanda zai iya haɗuwa da sarrafa laser michole na yawancin kayan. Duk na'urar da ta hada da teburin X, Y, z, zan yi amfani da daidaitaccen ball dunƙule, layin dogo. X, y shugabanci bugun jini: 50mm, Z shugabanci mai bugun jini: 50mm, maimaitawa daidaito <± 2 microns.


Cikakken Bayani

Tags samfurin

Gabatarwar Samfurin

Kayan kayan aiki: Ya dace da ƙarfe na halitta, baƙin ƙarfe polycrystalline, jan ƙarfe, ƙirbura, diamita, zurfin huhun.

Yanayin aiki

1. Ya dace da aiki a karkashin zafin jiki na yanayi na 18 ℃ -28 ℃ da dangi zafi na 30% -60%.

2. Ya dace da wadataccen wutar lantarki na lokaci-lokaci / 220v / 50Hz / 10a.

3. Sanya matattara da zasu cika bukatun na ƙa'idodin Sinawa masu dacewa. Idan babu irin wannan toshe, ya kamata a samar da adaftar da ta dace.

4. An yi amfani da su a zane mai zane na lu'u-lu'u mutu, da waya ta mutu, muffler rami, mai ɗaukar hoto, bututun ƙarfe da sauran masana'antu.

Sigogi na fasaha

Suna Labari Aiki
Eptical Maser 354.7nm ko 355nm Kayyade rarraba makamashi da ƙarfin shigar da kwanciyar hankali na katako na Laser, kuma yana shafar ƙimar shaye-shaye da sakamako mai aiki.
Matsakaita fitarwa 10.0 / 12.0 / 15.0 W @. 40khz Shafi sarrafa aiki da kuma saurin gudu, mafi girman iko, saurin sarrafawa.
Bugun jini Kasa da 20ns @ 40khz Takaicewar ɗan gajeren famare yana rage yankin zafi wanda ya shafi zafin, yana inganta daidaito na inji, kuma yana nisanta lalacewar kayan.
Bugun fanareti na bugun jini 10 ~ 200khz Eterayyade mitar mai watsa hankali da haɓakar haɓakar katako, mafi girma mitar, da sauri saurin gudu.
Entical Stodical M² <1.2 Babban katako mai inganci yana tabbatar da ingancin hakoma da ingancin inganci, yana rage asarar kuzari.
Tabo diamita 0.8 ± 0.1mm Eterayyade ƙarancin ciyarwa da daidaito, ƙaramin tabo, ƙaramin a ci gaba, mafi girman daidaito.
dutsen-rarrabuwa kwana Mafi girma sama da 90% Mayar da hankali da zurfin ƙwanƙwasa na katako ana shafawa. Karamin juzu'in da ya fi karfi, da karfi mai dogaro da iko.
Dabbobi Ellipticity Kasa da kashi 3% na RMS Karamin Ellipticity, kusa da siffar rami shine ga da'irar, mafi girman daidaito daidai.

Ikon sarrafawa

Motocin lasisin Laser na Laser suna da damar sarrafa kayan aiki da ƙarfi daga 'yan microns zuwa wasu' yan miliyoyin za a iya sarrafawa daidai. A lokaci guda, kayan aikin yana goyan bayan 360-zagaye-zagaye hakar, wanda zai iya saduwa da hakowar hakowar sifofi da tsari masu hadaddun abubuwa. Bugu da kari, madaidaicin madaidaicin na'urar injin din shima yana da kyakkyawan inganci da gama gari, an sarrafa ramuka da aka sarrafa, babu gefen narkewa, kuma farfajiya ta narke, kuma farfajiya ta narke, kuma farfajiya ta narke, kuma farfajiya ta narke, kuma farfajiya ta narke, kuma farfajiya ta narke da lebur.
Aikace-aikacen babban daidaitaccen layin laser:
1. Masana'antar lantarki:
Buga Circuit Board (PCB): An yi amfani da shi don sarrafa microchole don biyan bukatun mai haɗa gwiwa na haɓaka.

Wakilin Kayan SeMemictor: Ramuka na Semica a Wafers da kayan marufi don inganta yawan kunshin da aiki.

2. Aerospace:
A sanyayawar injiniyan: ramuka masu sanyaya suna kan jakunkuna don haɓaka haɓaka injin don haɓaka haɓaka injin.

Gudanar da aiki: Don babban abin da ke haifar da fashewar carbon fiber don tabbatar da ƙarfin tsarin.

3. Kayan aikin likita:
Minisallan na'ura masu ba da gudummawa: inji microcholes a cikin kayan masarufi don inganta daidaito da aminci.

Tsarin isar da magani: ramuka na punch a cikin na'urar bayar da magani don sarrafa darajar sakin magani.

4. Masana'antar masana'antar motoci:
Tsarin allura: Murfining micro-ramuka akan allurar mai taushi don inganta tasirin da atomization mai.

Masana'antar firikwenor: ramuka na hako a cikin abubuwan da aka firika don inganta tunaninta da saurin mayar da martani.

5. Na'urorin Optical:
Mai haɗa Entical: microinting michololes haɗin haɗin haɗin fiber na gani don tabbatar da ingancin watsa siginar.

Pictical tace: Punch ramuka a cikin tottical tace don cimma takamaiman zaɓi na raƙuman ruwa.

6. Matsakaicin kayan masarufi:
Daidaici mold: inji micropholes akan mold don inganta aikin da rayuwar sabis na mold.

Micro sassa: ramuka na punch akan sassan labarun don biyan bukatun babban taron taron.

Xkh yana samar da cikakken ayyukan babban aikin laserin lasisi, gami da tallace-tallace na fasaha, da sauransu, don tabbatar da cewa abokan ciniki a cikin amfani da ƙwararru, ingantaccen aiki da kuma cikakkiyar goyon baya.

Cikakken zane

Babban daidaitaccen Laser Post-inji 4
Babban daidaitaccen Laser Postching inji 5
Babban daidaito Laser Postcing inji 6

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