Biyu tashar square inji monocrystalline silicon sanda sarrafa 6/8/12 inch surface flatness Ra≤0.5μm

Biyu tasha murabba'in inji monocrystalline silicon sanda sarrafa 6/8/12 inch surface flatness Ra≤0.5μm Featured Image

Takaitaccen Bayani:

Monocrystalline silicon biyu tashar murabba'in inji shine ingantaccen kayan aiki don sarrafa sandunan silicon monocrystalline (Ingot). Yana ɗaukar ƙirar aiki tare da tashar ninki biyu kuma yana iya yanke sandunan silicon guda biyu a lokaci guda, yana haɓaka haɓakar samarwa sosai. Na'urar tana aiwatar da sandunan siliki cylindrical zuwa tubalan silicon murabba'i/quasi-square (Grit) ta hanyar fasahar yankan waya ta lu'u-lu'u ko igiyoyin madauwari na ciki, suna shirya don slicing na gaba (kamar yin wafern siliki), kuma ana amfani dashi ko'ina a cikin hanyoyin sarrafa kayan silicon a cikin masana'antar hotovoltaic da semiconductor.

Aika mana imel

Cikakken Bayani

Tags samfurin

Halayen kayan aiki:

(1) sarrafa aiki tare da tashoshi biyu
· Sau biyu yadda ya dace: Yin aiki na lokaci guda na sandunan siliki guda biyu (Ø6"-12") yana ƙara yawan aiki ta hanyar 40% -60% vs. Simplex kayan aiki.

Ikon zaman kanta: Kowane tashoshi na iya daidaita sigogin yanke da kansa (tashin hankali, saurin ciyarwa) don dacewa da ƙayyadaddun sandar silicon daban-daban.

(2) Babban madaidaicin yanke
Daidaitaccen girman: jurewar nesa mai nisa murabba'i ± 0.15mm, kewayo ≤0.20mm.

· Ingancin saman: yankan tsintsiya <0.5mm, rage adadin niƙa na gaba.

(3) Gudanar da hankali
· Yanke mai daidaitawa: saka idanu na gaske na tsarin halittar sandar siliki, daidaitawa mai ƙarfi na hanyar yanke (kamar sarrafa sandar silicon mai lankwasa).

Binciken bayanan: yin rikodin sigogin sarrafawa na kowane sandar silicon don tallafawa docking tsarin MES.

(4) Karancin tsadar kayan amfani
· Amfanin waya na lu'u-lu'u: ≤0.06m/mm (tsawon sandar siliki), diamita na waya ≤0.30mm.

· Coolant wurare dabam dabam: Tsarin tacewa yana tsawaita rayuwar sabis kuma yana rage zubar da ruwa.

Fa'idodin fasaha da haɓakawa:

(1) Yanke haɓaka fasahar fasaha
- Multi-line yankan: 100-200 lu'u-lu'u Lines ana amfani da a layi daya, da kuma yankan gudun ne ≥40mm / min.

- Kula da tashin hankali: Rufe tsarin daidaita madauki (± 1N) don rage haɗarin fashewar waya.

(2) Tsawancin dacewa
- Abun daidaitawa: Taimakawa nau'in P-type / nau'in silicon monocrystalline, mai jituwa tare da TOPCon, HJT da sauran sandunan siliki na baturi mai inganci.

- Girman sassauƙa: tsayin sandar silicon 100-950mm, nisan sandar murabba'i 166-233mm daidaitacce.

(3) Haɓakawa ta atomatik
- Robot Loading da saukewa: atomatik loading / sauke na silicon sanduna, doke ≤3 minutes.

- Bincike na hankali: Kulawa da tsinkaya don rage lokacin da ba a shirya ba.

(4) Jagorancin masana'antu
- Tallafin wafer: na iya aiwatar da ≥100μm silicon ultra-bakin ciki tare da sandunan murabba'i, ƙimar rarrabuwa <0.5%.

- Inganta amfani da makamashi: Amfani da makamashi a kowace naúrar sandar siliki yana raguwa da 30% (kamar kayan aikin gargajiya).

Sigar fasaha:

Sunan siga	Ƙimar fihirisa
Yawan sanduna da aka sarrafa	2 guda / saiti
Tsawon tsayin sandar sarrafawa	100-950 mm
Machining gefe iyaka	166-233 mm
Yanke gudun	≥40mm/min
Gudun waya ta Diamond	0 ~ 35m/s
Diamita na Diamond	0.30 mm ko fiye
Amfani da layi	0.06m/mm ko žasa
Diamita na sanda mai jituwa	Ƙarshen murabba'in sanda diamita +2mm, Tabbatar da ƙimar izinin goge goge
Sarrafa ɓacin rai	Raw baki ≤0.5mm, Babu chipping, high surface quality
Tsawon Arc uniformity	Matsakaicin tsinkaya <1.5mm, Banda murdiya sandar silicon
Girman inji (na'ura ɗaya)	4800×3020×3660mm
Jimlar ƙarfin ƙididdigewa	56 kW
Mataccen nauyin kayan aiki	12t

Teburin daidaiton injina:

Madaidaicin abu	Kewayon haƙuri
Hakuri na bargon square	± 0.15mm
Matsakaicin gefen gefen mashaya	≤0.20mm
Angle a kan dukkan bangarorin square sanda	90°±0.05°
Flatness na square sanda	≤0.15mm
Robot ya maimaita daidaiton matsayi	± 0.05mm

Ayyukan XKH:

XKH yana ba da sabis na cikakken sake zagayowar don injunan tashoshi biyu na silicon mono-crystalline, gami da gyare-gyaren kayan aiki (wanda ya dace da manyan sandunan siliki), ƙaddamar da aiwatarwa (yanke ingantaccen sigar), horo na aiki da goyon bayan tallace-tallace (samar da maɓalli mai mahimmanci, bincike mai nisa), tabbatar da cewa abokan ciniki sun sami babban yawan amfanin ƙasa (> 99%) da ƙananan samar da farashi masu amfani, da kuma samar da haɓakar fasaha (kamar AI). Lokacin bayarwa shine watanni 2-4.