8inch SiC Production sa wafer 4H-N SiC substrate

Takaitaccen Bayani:

8-inch SiC substrates Ana amfani da a high-ikon lantarki na'urorin, kamar ikon MOSFETs (Metal Oxide Semiconductor Field Effect Transistor), Schottky diodes da sauran ikon semiconductor na'urorin.


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Tebur mai zuwa yana nuna ƙayyadaddun ƙayyadaddun wafers ɗin mu na 8inch SiC:

8inch N-type SiC DSP Specs

Lamba Abu Naúrar Production Bincike Dummy
1: ma'auni
1.1 nau'in poly -- 4H 4H 4H
1.2 fuskar fuska ° <11-20>4±0.5 <11-20>4±0.5 <11-20>4±0.5
2:Ma'aunin wutar lantarki
2.1 dopant -- n-nau'in Nitrogen n-nau'in Nitrogen n-nau'in Nitrogen
2.2 resistivity ku · cm 0.015 ~ 0.025 0.01 ~ 0.03 NA
3:Mechanical siga
3.1 diamita mm 200± 0.2 200± 0.2 200± 0.2
3.2 kauri μm 500± 25 500± 25 500± 25
3.3 Matsayin daraja ° [1-100] ± 5 [1-100] ± 5 [1-100] ± 5
3.4 Zurfin Daraja mm 1 ~ 1.5 1 ~ 1.5 1 ~ 1.5
3.5 LTV μm ≤5(10mm*10mm) ≤5(10mm*10mm) ≤10 (10mm*10mm)
3.6 TTV μm ≤10 ≤10 ≤15
3.7 Ruku'u μm -25-25 -45-45 -65-65
3.8 Warp μm ≤30 ≤50 ≤70
3.9 AFM nm ≤0.2 ≤0.2 ≤0.2
4:tsari
4.1 micropipe yawa ku/cm2 ≤2 ≤10 ≤50
4.2 abun ciki na karfe atom/cm2 ≤1E11 ≤1E11 NA
4.3 TSD ku/cm2 ≤500 ≤1000 NA
4.4 BPD ku/cm2 ≤2000 ≤5000 NA
4.5 TED ku/cm2 ≤7000 ≤10000 NA
5.Front quality
5.1 gaba -- Si Si Si
5.2 saman gamawa -- Farashin CMP Farashin CMP Farashin CMP
5.3 barbashi e/wafar ≤100(size≥0.3μm) NA NA
5.4 karce e/wafar ≤5, Jimlar Tsawon≤200mm NA NA
5.5 Gefen
kwakwalwan kwamfuta / indents / fasa / tabo / gurɓatawa
-- Babu Babu NA
5.6 Yankunan Polytype -- Babu Yanki ≤10% Yanki ≤30%
5.7 alamar gaba -- Babu Babu Babu
6:Baya ingancin
6.1 dawo gama -- C-face MP C-face MP C-face MP
6.2 karce mm NA NA NA
6.3 Gefen lahani na baya
kwakwalwan kwamfuta / indents
-- Babu Babu NA
6.4 Baƙar fata nm Ra ≤5 Ra ≤5 Ra ≤5
6.5 Alamar baya -- Daraja Daraja Daraja
7: zuw
7.1 baki -- Chamfer Chamfer Chamfer
8: kunci
8.1 marufi -- Epi-shirye tare da injin
marufi
Epi-shirye tare da injin
marufi
Epi-shirye tare da injin
marufi
8.2 marufi -- Multi-wafer
kaset marufi
Multi-wafer
kaset marufi
Multi-wafer
kaset marufi

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