150mm 6 inch 0.7mm 0.5mm Sapphire Wafer Substrate Carrier C-Plane SSP/DSP
Aikace-aikace
Aikace-aikace don wafer sapphire mai inci 6 sun haɗa da:
1. LED masana'antu: sapphire wafer za a iya amfani da a matsayin substrate na LED kwakwalwan kwamfuta, da taurin da thermal watsin iya inganta kwanciyar hankali da kuma sabis rayuwa na LED kwakwalwan kwamfuta.
2. Laser masana'antu: Sapphire wafer kuma za a iya amfani da a matsayin substrate na Laser, don taimaka inganta yi na Laser da tsawaita rayuwar sabis.
3. Semiconductor masana'antu: Sapphire wafers ana amfani da ko'ina wajen kera na'urorin lantarki da na optoelectronic, ciki har da kira na gani, hasken rana, high-mita lantarki na'urorin, da dai sauransu.
4. Sauran aikace-aikace: Sapphire wafer kuma za a iya amfani dashi don kera allon taɓawa, na'urorin gani, siraran fim ɗin hasken rana da sauran samfuran fasaha.
Ƙayyadaddun bayanai
Kayan abu | Babban tsarki guda kristal Al2O3, wafer sapphire. |
Girma | 150 mm +/- 0.05 mm, 6 inci |
Kauri | 1300 +/- 25 um |
Gabatarwa | C jirgin sama (0001) kashe M (1-100) jirgin sama 0.2 +/- 0.05 digiri |
Matsakaicin matakin farko | Jirgin sama +/- 1 digiri |
Tsawon lebur na farko | 47.5 mm +/- 1 mm |
Jimlar Bambancin Kauri (TTV) | <20 ku |
Ruku'u | <25 ku |
Warp | <25 ku |
Thermal Expansion Coefficient | 6.66 x 10-6 / °C daidai da axis C, 5 x 10-6 /°C daidai da axis C |
Ƙarfin Dielectric | 4.8 x 105 V/cm |
Dielectric Constant | 11.5 (1 MHz) tare da axis C, 9.3 (1 MHz) daidai da axis C |
Dielectric Loss Tangent (aka dissipation factor) | kasa da 1 x 10-4 |
Thermal Conductivity | 40 W/(mK) a 20 ℃ |
goge baki | Goge gefe guda (SSP) ko goge gefe biyu (DSP) Ra <0.5 nm (ta AFM). Gefen baya na wafer SSP ya kasance ƙasa mai kyau zuwa Ra = 0.8 - 1.2 um. |
watsawa | 88% +/-1% @460 nm |