4inch Silicon wafer FZ CZ N-Nau'in DSP ko matakin gwajin SSP
Gabatar da akwatin wafer
Silicon wafers wani muhimmin bangare ne na ci gaban fasahar zamani a yau. Kasuwancin kayan semiconductor yana buƙatar wafern siliki tare da takamaiman ƙayyadaddun bayanai don samar da adadi mai yawa na sabbin na'urorin kewayawa. Mun gane cewa yayin da farashin masana'antar semiconductor ke ƙaruwa, haka kuma farashin waɗannan kayan masana'anta, kamar wafern silicon. Mun fahimci mahimmancin inganci da ingancin farashi a cikin samfuran da muke samarwa ga abokan cinikinmu. Muna ba da wafers waɗanda suke da tsada-tasiri kuma masu inganci. Muna samar da wafers na silicon da ingots (CZ), wafers na epitaxial, da wafers na SOI.
Diamita | Diamita | goge | Doped | Gabatarwa | Resistivity/Ω.cm | Kauri/um |
2 inci | 50.8 ± 0.5mm | SSP DSP | P/N | 100 | 1-20 | 200-500 |
3 inci | 76.2 ± 0.5mm | SSP DSP | P/B | 100 | NA | 525± 20 |
4 inci | 101.6 ± 0.2 101.6 ± 0.3 101.6 ± 0.4 | SSP DSP | P/N | 100 | 0.001-10 | 200-2000 |
6 inci | 152.5± 0.3 | SSPDSP | P/N | 100 | 1-10 | 500-650 |
8 inci | 200± 0.3 | DSPSSP | P/N | 100 | 0.1-20 | 625 |
Aikace-aikacen siliki wafers
Substrate: PECVD/LPCVD shafi, magnetron sputtering
Substrate: XRD, SEM, atomic Force infrared spectroscopy, watsawa na lantarki microscopy, fluorescence spectroscopy da sauran gwaje-gwaje na nazari, haɓakar haɓakar ƙwayoyin ƙwayoyin ƙwayoyin cuta, Binciken X-ray na sarrafa microstructure crystal: etching, bonding, MEMS na'urorin, na'urorin wuta, MOS na'urorin da sauran sarrafawa
Tun 2010, Shanghai XKH Material Tech. Co., Ltd da aka sadaukar don samar da abokan ciniki tare da m 4-inch wafer Silicon Wafer mafita, daga debugging matakin wafers Dummy Wafer, gwajin matakin wafers Test Wafer, to samfurin matakin wafers Prime Wafer, kazalika da musamman wafers, Oxide wafers Oxide, Nitride wafers Si3N4, Aluminum plated wafers, Copper plated silicon wafers, SOI Wafer, MEMS Gilashi, na musamman ultra-kauri da ultra-lebur wafers, da dai sauransu, tare da masu girma dabam daga 50mm-300mm, kuma za mu iya samar da semiconductor wafers tare da guda-gefe / biyu-gefe polishing, thinning, dicing, MEMS da sauran aiki da gyare-gyare ayyuka. .