Kayan Aikin Ci Gaban Ingot na Sapphire Hanyar Czochralski CZ don Samar da Wafers ɗin Sapphire mai inci 2-12

Takaitaccen Bayani:

Kayan Aikin Girman Ingot na Sapphire (Hanyar Czochralski) wani tsari ne na zamani wanda aka tsara don girma mai tsarki, ƙarancin lahani na sapphire guda ɗaya. Hanyar Czochralski (CZ) tana ba da damar sarrafa saurin jan lu'ulu'u na iri (0.5-5 mm/h), saurin juyawa (5-30 rpm), da kuma yanayin zafi a cikin ridium crucible, yana samar da lu'ulu'u na axisymmetric har zuwa inci 12 (300 mm) a diamita. Wannan kayan aikin yana tallafawa sarrafa yanayin lu'ulu'u na C/A, yana ba da damar haɓaka yanayin gani, matakin lantarki, da sapphire mai doped (misali, Cr³⁺ ruby, Ti³⁺ star sapphire).

XKH tana ba da mafita daga ƙarshe zuwa ƙarshe, gami da keɓance kayan aiki (samar da wafer inci 2-12), inganta tsari (yawan lahani <100/cm²), da kuma horar da fasaha, tare da fitarwa na wafers 5,000+ a kowane wata don aikace-aikace kamar su LED substrates, GaN epitaxy, da marufi na semiconductor.

Aika mana imel

Siffofi

Ka'idar Aiki

Hanyar CZ tana aiki ta matakai masu zuwa:
1. Narkewar Kayan Danye: Tsafta mai yawa Al₂O₃ (tsarki >99.999%) yana narkewa a cikin wani nau'in iridium crucible a 2050–2100°C.
2. Gabatarwar Gilashin Iri: Ana saukar da gilasan iri zuwa cikin narkewa, sannan a ja shi da sauri don samar da wuya (diamita ƙasa da 1 mm) don kawar da nakasa.
3. Tsarin kafada da Girman Girma: Ana rage saurin jan zuwa 0.2–1 mm/h, a hankali ana faɗaɗa diamita na lu'ulu'u zuwa girman da aka nufa (misali, inci 4–12).
4. Zubar da Ruwa da Sanyaya Ruwa: Ana sanyaya ruwan a 0.1–0.5°C/min domin rage tsagewar da zafin jiki ke haifarwa.
5. Nau'ikan Lu'ulu'u masu jituwa:
Na'urar auna lantarki: Abubuwan da ke cikin semiconductor (TTV <5 μm)
Na'urar hangen nesa: tagogi na laser UV (transmittance > 90% @ 200 nm)
Nau'ikan da aka Doped: Ruby (Cr³⁺ maida hankali 0.01–0.5 wt.%), bututun shuɗi mai shuɗi

Babban Kayan Tsarin

1. Tsarin narkewa
Iridium Crucible: Yana jure wa zafin jiki na 2300°C, yana jure wa tsatsa, kuma yana dacewa da manyan narkewa (kilogiram 100-400).
Tanderu Mai Dumamawa: Kula da zafin jiki mai zaman kansa a yankuna da yawa (±0.5°C), ingantaccen yanayin zafi.

2. Tsarin Ja da Juyawa
Motar Servo Mai Inganci Mai Kyau: Jawo ƙuduri 0.01 mm/h, juyawar daidaici <0.01 mm.
Hatimin Ruwa Mai Magnetic: Watsawa mara hulɗa don ci gaba da girma (> awanni 72).

3. Tsarin Kula da Zafi
Ikon Rufe Madauri na PID: Daidaita wutar lantarki a ainihin lokaci (50-200 kW) don daidaita filin zafi.
Kariyar Iskar Gas Mai Inert: Cakuda Ar/N₂ (tsarki 99.999%) don hana iskar shaka.

4. Aiki da Kai da Kulawa
Kulawa da Diamita na CCD: Ra'ayoyin da aka bayar a ainihin lokaci (daidaitawa ± 0.01 mm).
Infrared Thermography: Yana sa ido kan yanayin haɗin gwiwa mai ƙarfi da ruwa.

Kwatanta Hanyar CZ da KY

Sigogi	Hanyar CZ	Hanyar KY
Girman Lu'ulu'u Mafi Girma	Inci 12 (mm 300)	400 mm (ƙafafun da aka yi da siffar pear)
Yawan Lalacewa	<100/cm²	<50/cm²
Yawan Girma	0.5–5 mm/h	0.1–2 mm/h
Amfani da Makamashi	50–80 kWh/kg	80–120 kWh/kg
Aikace-aikace	Abubuwan LED, GaN epitaxy	Tagogi masu haske, manyan ingots
Kudin	Matsakaici (babban jarin kayan aiki)	Babban tsari (mai rikitarwa)

Manhajoji Masu Mahimmanci

1. Masana'antar Semiconductor
Ƙananan sassan GaN Epitaxial: Wafers mai inci 2–8 (TTV ƙasa da μm 10) don Micro-LEDs da diodes na laser.
Wafers na SOI: Tsananin saman <0.2 nm don kwakwalwan da aka haɗa da 3D.

2. Injin lantarki
Tagogin Laser na UV: Suna jure wa ƙarfin lantarki mai ƙarfin 200 W/cm² don na'urorin gani na lithography.
Abubuwan da ke cikin Infrared: Ma'aunin sha <10⁻³ cm⁻¹ don ɗaukar hoton zafi.

3. Kayan Lantarki na Masu Amfani
Murfin Kyamarar Wayar Salula: Inganta juriyar karce ta Mohs 9, 10×.
Nunin Agogon Wayo: Kauri 0.3-0.5 mm, watsawa > 92%.

4. Tsaro da Tashar Jiragen Sama
Tagogin Reactor na Nukiliya: Jure wa radiation har zuwa 10¹⁶ n/cm².
Madubin Laser Mai Ƙarfi: Nauyin zafi <λ/20@1064 nm.

Ayyukan XKH

1. Keɓance Kayan Aiki
Tsarin Ɗakin da Za a Iya Sauƙaƙawa: Tsarin Φ200–400 mm don samar da wafer mai inci 2–12.
Sauƙin amfani da maganin hana shan ƙwayoyi: Yana tallafawa maganin hana shan ƙwayoyi na rare-earth (Er/Yb) da kuma maganin hana shan ƙwayoyi na transition-metal (Ti/Cr) don keɓance halayen optoelectronic.

2. Tallafi daga ƙarshe zuwa ƙarshe
Inganta Tsarin Aiki: Girke-girke da aka riga aka tabbatar (50+) don LED, na'urorin RF, da abubuwan da aka taurare da radiation.
Cibiyar Sadarwa ta Duniya: Binciken nesa 24/7 da kuma kula da wurin aiki tare da garanti na watanni 24.

3. Sarrafawa a Ƙasa
ƙera Wafer: Yanka, niƙa, da gogewa don wafers masu tsawon inci 2-12 (C/A-plane).
Kayayyakin da aka ƙara masu daraja:
Abubuwan gani: tagogi na UV/IR (kauri 0.5-50 mm).
Kayan Ado na Ado: Ruby mai daraja (wanda GIA ta amince da shi), sapphire mai tauraro na Ti³⁺.

4. Jagorancin Fasaha
Takaddun shaida: Wafers masu bin ka'idar EMI.
Haƙƙin mallaka: Babban haƙƙin mallaka a cikin sabuwar hanyar CZ.

Kammalawa

Kayan aikin hanyar CZ suna ba da jituwa mai girma, ƙarancin lahani, da kwanciyar hankali mai yawa, wanda hakan ya sanya shi ya zama ma'aunin masana'antu don aikace-aikacen LED, semiconductor, da tsaro. XKH yana ba da cikakken tallafi daga tura kayan aiki zuwa sarrafa bayan girma, yana ba abokan ciniki damar cimma samar da lu'ulu'u mai inganci da inganci.