English

Menene Wafer TTV, Bow, Warp, kuma Ta Yaya Ake Auna Su?

;Jagorar Bayani

1. Manyan Ma'anoni da Ma'auni

2. Dabaru na Aunawa

3. Sarrafa Bayanai da Kurakurai

4. Tasirin Tsarin

A cikin masana'antar semiconductor, daidaiton kauri da kuma lanƙwasa saman wafers sune muhimman abubuwan da ke shafar yawan amfanin samfur. Mahimman sigogi kamar Jumlar Kauri Bambanci (TTV), Bow (arcuate warpage), Warp (global warpage), da Microwarp (nano-topography) suna tasiri kai tsaye ga daidaito da kwanciyar hankali na manyan hanyoyin kamar mayar da hankali kan photolithography, polishing na injiniyanci (CMP), da kuma adana siraran fim.

 

Manyan Ma'anoni da Ma'auni

TTV (Bambancin Kauri Gabaɗaya)

TTV tana nufin babban bambancin kauri a duk faɗin saman wafer a cikin yankin aunawa da aka ƙayyade Ω (yawanci ban da yankunan da ba a cire gefuna da yankuna kusa da ginshiƙai ko filaye). A lissafi, TTV = max(t(x,y)) - min(t(x,y)). Yana mai da hankali kan daidaiton kauri na ciki na substrate na wafer, wanda ya bambanta da tsatsa ko daidaiton siririn fim.
Baka

Baka yana bayyana karkacewar tsaye ta tsakiyar wurin wafer daga matakin tunani mai dacewa da mafi ƙarancin murabba'i. Ƙimar da ta dace ko mara kyau tana nuna lanƙwasa ta duniya sama ko ƙasa.

Warp

Warp yana ƙididdige matsakaicin bambancin kololuwa-zuwa-kwari a duk wuraren saman idan aka kwatanta da matakin tunani, yana kimanta daidaiton jimlar wafer ɗin a cikin yanayin 'yanci.

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Microwarp
Microwarp (ko nanotopography) yana bincika ƙananan ƙananan undulations na saman a cikin takamaiman kewayon tsawon sarari (misali, 0.5–20 mm). Duk da ƙananan girma, waɗannan bambance-bambancen suna da tasiri sosai ga zurfin mayar da hankali na lithography (DOF) da daidaiton CMP.
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Tsarin Ma'auni na Ma'auni
Ana ƙididdige duk ma'auni ta amfani da tushen lissafi na geometric, yawanci ƙaramin murabba'i mai dacewa (LSQ plane). Ma'aunin kauri yana buƙatar daidaita bayanan saman gaba da baya ta hanyar gefuna, maƙallan, ko alamun daidaitawa. Binciken Microwarp ya ƙunshi tace sarari don cire abubuwan da suka shafi tsawon rai.

 

Dabaru na Aunawa

1. Hanyoyin aunawa na TTV

  • Tsarin Profilometry na Surface Biyu
  • Tsarin Haɗakar Fizeau:Yana amfani da gefuna masu tsangwama tsakanin layin tunani da saman wafer. Ya dace da saman santsi amma an iyakance shi da manyan wafers masu lanƙwasa.
  • Tsarin Binciken Hasken Fari (SWLI):Yana auna tsayin daka ta hanyar amfani da ambulan haske marasa daidaituwa. Yana da tasiri ga saman da ke kama da mataki amma saurin na'urar daukar hoto ta takaita.
  • Hanyoyin Confocal:Cimma ƙudurin sub-micron ta hanyar ramin rami ko ƙa'idodin watsawa. Ya dace da saman da ke da kaifi ko haske amma a hankali saboda na'urar duba wuri-wuri.
  • Triangulation na Laser:Amsa mai sauri amma yana iya haifar da asarar daidaito sakamakon bambancin hasken da ke fitowa daga saman.

 

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  • Haɗin Watsawa/Nunawa
  • Na'urori Masu Ƙarfin Kai Biyu: Sanya na'urori masu daidaitawa a ɓangarorin biyu yana auna kauri kamar T = L – d₁ – d₂ (L = nisan tushe). Mai sauri amma mai saurin amsawa ga halayen abu.
  • Ellipsometry/Spectroscopic Reflectometry: Yana nazarin hulɗar haske da abubuwa don kauri mai siriri amma bai dace da babban TV ba.

 

2. Ma'aunin Baka da Yankewa

  • Jerin Ƙarfin Bincike Mai Yawa: Kama bayanan tsayin filin gaba ɗaya a kan matakin ɗaukar iska don sake gina 3D cikin sauri.
  • Tsarin Haske Mai Tsari: Tsarin bayanin martaba na 3D mai sauri ta amfani da tsarin gani.
  • Interferometry Mai Ƙanƙanta: Taswirar saman da ke da ƙuduri mai girma amma mai saurin girgiza.

 

3. Auna Microwarp

  • Binciken Mitar Sarari:
  1. Sami hoton saman da ke da ƙuduri mai girma.
  2. Lissafi yawan ƙarfin hasken wutar lantarki (PSD) ta hanyar 2D FFT.
  3. A shafa matatun bandepass (misali, 0.5–20 mm) don ware mahimman raƙuman ruwa.
  4. Lissafa ƙimar RMS ko PV daga bayanan da aka tace.
  • Kwaikwayon Vacuum Chuck:Tasirin mannewa na gaske yayin lithography.

 

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Sarrafa Bayanai da Tushen Kuskure

Tsarin aikin sarrafawa

  • Tashar Talabijin ta TTV:Daidaita daidaiton saman gaba/baya, ƙididdige bambancin kauri, sannan a cire kurakuran tsarin (misali, karkatar da zafi).
  • ;Baka/Ƙarfe:Sanya bayanai na LSQ zuwa tsayi; Baka = ragowar wurin tsakiya, Warp = ragowar kololuwa zuwa kwarin.
  • ;Na'urar Microwarp:Tace mitoci na sarari, ƙididdige ƙididdiga (RMS/PV).

Maɓallan Kuskuren Maɓalli

  • Abubuwan da suka shafi Muhalli:Girgiza (mahimmanci ga interferometry), girgizar iska, da kuma yanayin zafi.
  • Iyakokin Firikwensin:Hayaniyar lokaci (interferometry), kurakuran daidaita tsawon rai (confocal), martanin da ya dogara da abu (capacitance).
  • Gudanar da Wafer:Rashin daidaituwar gefen da aka cire, rashin daidaiton matakin motsi a cikin dinki.

 

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Tasiri kan Muhimmancin Tsarin Aiki

  • Litography:Na'urar microwarp ta gida tana rage DOF, tana haifar da bambancin CD da kurakurai masu rufewa.
  • CMP:Rashin daidaiton TTV na farko yana haifar da matsin lamba mara tsari.
  • Binciken Damuwa:Juyin halittar Bow/Warp yana nuna halayen damuwa na zafi/inji.
  • Marufi:TTV mai yawa yana haifar da gurɓataccen tsari a cikin hanyoyin haɗin kai.

 

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Wafer ɗin Sapphire na XKH

 

Lokacin Saƙo: Satumba-28-2025
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