Fa'idodinTa Gilashi Ta Hanyar (TGV)kuma hanyoyin Ta hanyar Silicon Via (TSV) akan TGV sune galibi:
(1) kyawawan halaye na lantarki masu yawan mita. Kayan gilashi kayan rufi ne, ma'aunin dielectric kusan 1/3 ne kawai na kayan silicon, kuma ma'aunin asarar yana ƙasa da na kayan silicon sau 2-3, wanda ke sa asarar substrate da tasirin ƙwayoyin cuta suka ragu sosai kuma yana tabbatar da ingancin siginar da aka watsa;
(2)babban girma da kuma ƙaramin gilashin da aka yi da bakin cikiyana da sauƙin samu. Corning, Asahi da SCHOTT da sauran masana'antun gilashi na iya samar da gilashin allo mai girma (>2m × 2m) da kuma siriri (<50µm) da kuma kayan gilashi masu sassauƙa sosai.
3) Ƙarancin farashi. Amfana daga sauƙin samun gilashin allo mai girman sirara, kuma baya buƙatar ajiye yadudduka masu rufi, farashin samar da farantin adaftar gilashi kusan kashi 1/8 ne kawai na farantin adaftar da aka yi da silicon;
4) Tsarin aiki mai sauƙi. Babu buƙatar saka wani Layer mai rufi a saman substrate da bangon ciki na TGV, kuma ba a buƙatar siriri a cikin farantin adaftar mai siriri sosai ba;
(5) Ƙarfin kwanciyar hankali na injiniya. Ko da lokacin da kauri na farantin adaftar ya ƙasa da 100µm, har yanzu yana da ƙarami;
(6) Faɗin aikace-aikace, wata sabuwar fasahar haɗin gwiwa mai tsayi da ake amfani da ita a fannin marufi na matakin wafer, don cimma mafi ƙarancin nisa tsakanin wafer-wafer, mafi ƙarancin matakin haɗin yana ba da sabuwar hanyar fasaha, tare da kyawawan halayen lantarki, zafi, na inji, a cikin guntu na RF, firikwensin MEMS masu ƙarfi, haɗakar tsarin mai yawa da sauran yankuna masu fa'idodi na musamman, shine ƙarni na gaba na guntu mai tsayi na 5G, 6G 3D Yana ɗaya daga cikin zaɓuɓɓuka na farko don marufi na 3D na guntu mai tsayi na 5G da 6G na gaba.
Tsarin gyaran TGV ya haɗa da amfani da yashi, haƙoran ultrasonic, etching mai laushi, etching mai amsawa da ion mai zurfi, etching mai sauƙin ɗaukar hoto, etching na laser, etching mai zurfi da laser ke haifarwa, da kuma samar da ramukan fitarwa masu mayar da hankali.
Sakamakon bincike da ci gaba na baya-bayan nan ya nuna cewa fasahar na iya shiryawa ta cikin ramuka da ramukan makafi na 5:1 tare da rabon zurfin zuwa faɗi na 20:1, kuma tana da kyakkyawan yanayin halitta. Zane mai zurfi da Laser ke haifarwa, wanda ke haifar da ƙaramin rashin ƙarfi a saman, shine hanyar da aka fi nazari a kai a halin yanzu. Kamar yadda aka nuna a Hoto na 1, akwai tsage-tsage a bayyane a kusa da haƙa laser na yau da kullun, yayin da bangon da ke kewaye da bangon zane mai zurfi da Laser ke haifarwa suna da tsabta kuma santsi.
Tsarin sarrafawa naTGVAn nuna mai haɗa maƙallan a Hoto na 2. Tsarin gabaɗaya shine a fara haƙa ramuka a kan gilashin, sannan a ajiye layin shinge da layin iri a bangon gefe da saman. Layer ɗin shingen yana hana yaɗuwar Cu zuwa ga gilashin, yayin da yake ƙara mannewar biyun, ba shakka, a wasu bincike kuma an gano cewa Layer ɗin shingen ba lallai bane. Sannan ana ajiye Cu ta hanyar amfani da electroplating, sannan a rufe shi, kuma CMP ta cire Layer ɗin Cu. A ƙarshe, ana shirya Layer ɗin sake haɗawa na RDL ta hanyar lithography na shafi na PVD, kuma ana samar da Layer ɗin passivation bayan an cire manne.
(a) Shirya wafer, (b) ƙirƙirar TGV, (c) electroplating mai gefe biyu - ajiye jan ƙarfe, (d) gogewa da kuma goge sinadarai na CMP, cire saman jan ƙarfe, (e) shafi na PVD da lithography, (f) sanya layin sake haɗawa na RDL, (g) cire gluing da Cu/Ti etching, (h) ƙirƙirar layin passivation.
A taƙaice,ramin da ke ratsa gilashi (TGV)Fa'idodin aikace-aikacen suna da faɗi, kuma kasuwar cikin gida ta yanzu tana cikin matakin haɓakawa, daga kayan aiki zuwa ƙirar samfura kuma ƙimar ci gaban bincike da haɓakawa ta fi matsakaicin duniya girma.
Idan akwai keta doka, tuntuɓi share
Lokacin Saƙo: Yuli-16-2024