Teburin Abubuwan da ke Ciki
1. Kwalbawar Watsa Zafi a cikin Kwalbarorin AI da Nasarar Kayan Silicon Carbide
2. Halaye da Fa'idodin Fasaha na Abubuwan da ke cikin Silicon Carbide
3. Tsarin Dabaru da Haɓaka Haɗin gwiwa ta NVIDIA da TSMC
4. Hanyar Aiwatarwa da Manyan Kalubalen Fasaha
5. Hanyoyin Kasuwa da Faɗaɗa Ƙarfin Aiki
6. Tasirin da ke kan Tsarin Samar da Kayayyaki da Ayyukan Kamfanoni Masu Alaƙa
7. Faɗin Aikace-aikace da Girman Kasuwa Gabaɗaya na Silicon Carbide
8. Mafita na Musamman na XKH da Tallafin Samfura
Ana shawo kan matsalar wargaza zafi na kwakwalwan AI na gaba ta hanyar amfani da kayan silicon carbide (SiC).
A cewar rahotannin kafofin watsa labarai na ƙasashen waje, NVIDIA na shirin maye gurbin kayan substrate na tsakiya a cikin tsarin marufi na CoWoS na masu sarrafa shi na zamani da silicon carbide. TSMC ta gayyaci manyan masana'antun su haɗu don haɓaka fasahar kera don substrates na tsakiya na SiC.
Babban dalili shi ne cewa inganta aikin kwakwalwan AI na yanzu ya fuskanci ƙuntatawa ta zahiri. Yayin da ƙarfin GPU ke ƙaruwa, haɗa kwakwalwan kwamfuta da yawa cikin masu haɗa silicon yana haifar da buƙatar watsa zafi mai yawa. Zafin da ake samarwa a cikin kwakwalwan kwamfuta yana gab da ƙarewa, kuma masu haɗa silicon na gargajiya ba za su iya magance wannan ƙalubalen yadda ya kamata ba.
Kayan Aikin Nunin Zafi na NVIDIA! Buƙatar Sinadarin Silicon Carbide Ya Yi Fashewa! Silicon carbide wani sinadari ne mai faɗi da yawa, kuma halayensa na musamman suna ba shi fa'idodi masu yawa a cikin yanayi mai tsauri tare da babban ƙarfi da yawan zafin da ke kwarara. A cikin marufi na ci gaba na GPU, yana ba da fa'idodi guda biyu masu mahimmanci:
1. Ƙarfin Watsa Zafi: Sauya masu haɗa silicon da masu haɗa SiC zai iya rage juriyar zafi da kusan kashi 70%.
2. Tsarin Inganci na Wutar Lantarki: SiC yana ba da damar ƙirƙirar ƙananan na'urori masu sarrafa wutar lantarki mafi inganci, rage hanyoyin isar da wutar lantarki sosai, rage asarar da'ira, da kuma samar da amsoshin wutar lantarki masu sauri da kwanciyar hankali don nauyin kwamfuta na AI.
Wannan sauyi yana da nufin magance ƙalubalen wargaza zafi da ke tattare da ƙara ƙarfin GPU akai-akai, yana samar da mafita mafi inganci ga guntu-guntu masu aiki sosai.
Tsarin watsa zafi na silicon carbide ya ninka na silicon sau 2-3, wanda hakan ke inganta ingancin sarrafa zafi da kuma magance matsalolin watsa zafi a cikin kwakwalwan kwamfuta masu ƙarfi. Kyakkyawan aikinta na zafi zai iya rage zafin haɗin kwakwalwan GPU da 20-30°C, wanda hakan ke ƙara kwanciyar hankali a yanayin kwamfuta mai ƙarfi.
Hanyar Aiwatarwa da Kalubale
A cewar majiyoyin sarkar samar da kayayyaki, NVIDIA za ta aiwatar da wannan sauyi a matakai biyu:
•2025-2026Rubin GPU na ƙarni na farko zai ci gaba da amfani da masu haɗa silicon. TSMC ta gayyaci manyan masana'antun don haɗa fasahar kera masu haɗa SiC.
•2027: Za a haɗa masu shiga SiC a hukumance cikin tsarin marufi na zamani.
Duk da haka, wannan shirin yana fuskantar ƙalubale da yawa, musamman a cikin hanyoyin kera. Taurin silicon carbide yana kama da na lu'u-lu'u, wanda ke buƙatar fasahar yankewa mai matuƙar girma. Idan fasahar yankewa ba ta isa ba, saman SiC na iya zama mai lanƙwasa, wanda hakan zai sa ba za a iya amfani da shi don marufi na zamani ba. Masu kera kayan aiki kamar DISCO na Japan suna aiki don ƙirƙirar sabbin kayan aikin yanke laser don magance wannan ƙalubalen.
Masu Sa ran Nan gaba
A halin yanzu, fasahar interposer ta SiC za a fara amfani da ita a cikin mafi ci gaban kwakwalwan AI. TSMC na shirin ƙaddamar da 7x reticle CoWoS a cikin 2027 don haɗa ƙarin na'urori masu sarrafawa da ƙwaƙwalwa, wanda ke ƙara yankin interposer zuwa 14,400 mm², wanda zai haifar da ƙarin buƙata ga substrates.
Morgan Stanley ya yi hasashen cewa ƙarfin marufi na CoWoS na wata-wata zai ƙaru daga wafers 38,000 masu inci 12 a cikin 2024 zuwa 83,000 a cikin 2025 da kuma 112,000 a cikin 2026. Wannan ci gaban zai ƙara buƙatar masu shiga tsakani na SiC kai tsaye.
Duk da cewa ƙananan SiC masu inci 12 suna da tsada a halin yanzu, ana sa ran farashin zai ragu a hankali zuwa matakan da suka dace yayin da yawan samar da kayayyaki ke ƙaruwa kuma fasaha ke girma, wanda ke haifar da yanayi don manyan aikace-aikace.
Masu haɗa SiC ba wai kawai suna magance matsalolin watsa zafi ba, har ma suna inganta yawan haɗin kai sosai. Yankin substrates SiC mai inci 12 ya fi na substrates mai inci 8 girma da kusan kashi 90%, wanda ke ba da damar mai haɗa guda ɗaya ya haɗa ƙarin na'urorin Chiplet, wanda ke tallafawa buƙatun marufi na 7x reticle CoWoS na NVIDIA.
TSMC tana haɗin gwiwa da kamfanonin Japan kamar DISCO don haɓaka fasahar kera masu haɗa SiC. Da zarar an samar da sabbin kayan aiki, kera masu haɗa SiC zai ci gaba cikin sauƙi, tare da sa ran fara shiga cikin marufi na zamani a shekarar 2027.
Sakamakon wannan labarin, hannun jarin da ke da alaƙa da SiC sun yi tasiri sosai a ranar 5 ga Satumba, inda ma'aunin ya karu da kashi 5.76%. Kamfanoni kamar Tianyue Advanced, Luxshare Precision, da Tiantong Co. sun kai ga ƙayyadadden ƙimar yau da kullun, yayin da Jingsheng Mechanical & Electrical da Yintang Intelligent Control suka karu da sama da kashi 10%.
A cewar jaridar Daily Economic News, domin inganta aiki, NVIDIA na shirin maye gurbin kayan substrate na tsakiya a cikin tsarin marufi na ci gaba na CoWoS da silicon carbide a cikin tsarin haɓaka na'urar sarrafa Rubin na gaba.
Bayanan jama'a sun nuna cewa silicon carbide yana da kyawawan halaye na zahiri. Idan aka kwatanta da na'urorin silicon, na'urorin SiC suna ba da fa'idodi kamar yawan wutar lantarki mai yawa, ƙarancin asarar wutar lantarki, da kuma kwanciyar hankali mai zafi sosai. A cewar Tianfeng Securities, sarkar masana'antar SiC da ke sama ta ƙunshi shirya abubuwan SiC da wafers na epitaxial; tsakiyar ya haɗa da ƙira, ƙera, da marufi/gwaji na na'urorin wutar lantarki na SiC da na'urorin RF.
A ƙasa, aikace-aikacen SiC sun yi yawa, sun shafi masana'antu sama da goma, ciki har da sabbin motocin makamashi, na'urorin ɗaukar hoto, masana'antu, sufuri, tashoshin sadarwa, da radar. Daga cikin waɗannan, motocin za su zama babban filin aikace-aikacen SiC. A cewar Aijian Securities, nan da shekarar 2028, ɓangaren motoci zai ɗauki kashi 74% na kasuwar na'urorin SiC masu ƙarfi a duniya.
Dangane da girman kasuwa gabaɗaya, a cewar Yole Intelligence, girman kasuwar substrate SiC mai watsawa da mai rufewa ta duniya ya kasance miliyan 512 da miliyan 242, bi da bi, a cikin 2022. Ana hasashen cewa nan da 2026, girman kasuwar SiC ta duniya zai kai biliyan 2.053, tare da kasuwannin substrate SiC mai watsawa da mai rufewa ta tsakiya wanda ya kai biliyan 1.62 da dala miliyan 433, bi da bi. Ana sa ran yawan ci gaban kowace shekara (CAGRs) na substrate SiC mai watsawa da mai rufewa daga 2022 zuwa 2026 zai kasance 33.37% da 15.66%, bi da bi.
XKH ta ƙware a fannin ci gaba na musamman da kuma tallace-tallace na Kayayyakin Silicon Carbide (SiC) na duniya, tana ba da cikakken girman inci 2 zuwa 12 don duka abubuwan da ke ɗauke da silicon carbide mai aiki da kuma waɗanda ke rufewa. Muna tallafawa keɓancewa na musamman na sigogi kamar yanayin lu'ulu'u, juriya (10⁻³–10¹⁰ Ω·cm), da kauri (350–2000μm). Ana amfani da samfuranmu sosai a fannoni masu inganci, gami da sabbin motocin makamashi, inverters na photovoltaic, da injunan masana'antu. Ta hanyar amfani da tsarin sarkar samar da kayayyaki mai ƙarfi da ƙungiyar tallafawa fasaha, muna tabbatar da saurin amsawa da isarwa daidai, muna taimaka wa abokan ciniki haɓaka aikin na'ura da inganta farashin tsarin.
Lokacin Saƙo: Satumba-12-2025