Ta yaya za mu iya rage wafer zuwa "matsananciyar siriri"?
Menene ainihin wafer mai siriri sosai?
Matsakaicin kauri (misali wafers 8″/12″)
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Wafer na yau da kullun:600–775 μm
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Wafer mai laushi:150–200 μm
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Wafer mai siriri sosai:ƙasa da 100 μm
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Wafer mai siriri sosai:50 μm, 30 μm, ko ma 10–20 μm
Me yasa wafers ke zama siriri?
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Rage kauri na fakitin gaba ɗaya, rage tsawon TSV, da rage jinkirin RC
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Rage juriya da kuma inganta zubar da zafi
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Cika buƙatun samfurin ƙarshe don abubuwan da suka fi siriri sosai
Babban haɗarin wafers masu siriri sosai
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Ƙarfin injina yana raguwa sosai
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Yaƙi mai tsanani
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Wuya wajen sarrafawa da jigilar kaya
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Tsarin gefen gaba yana da matuƙar rauni; wafers suna da saurin fashewa/karyewa
Ta yaya za mu iya rage kitsen wafer zuwa matsakaicin siriri?
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DBG (Ding kafin niƙa)
A yanka wafer ɗin kaɗan (ba tare da yanke shi gaba ɗaya ba) don haka kowace mayafin ta riga ta bayyana yayin da wafer ɗin ta kasance tana da alaƙa da injina daga bayan. Sannan a niƙa wafer ɗin daga bayan don rage kauri, a hankali a cire sauran silicon ɗin da ba a yanke ba. Daga ƙarshe, za a niƙa siririn layin silicon na ƙarshe, wanda zai kammala singleration. -
Tsarin Taiko
Sai kawai a rage yankin tsakiyar wafer ɗin yayin da ake kiyaye yankin gefen da kauri. Gefen da ya yi kauri yana ba da tallafi na injiniya, yana taimakawa wajen rage yaɗuwar iska da kuma magance haɗarin. -
Haɗin wafer na wucin gadi
Haɗin wucin gadi yana haɗa wafer ɗin a kanmai ɗaukar kaya na wucin gadi, yana mai da wafer mai rauni sosai, mai kama da fim zuwa wani abu mai ƙarfi da za a iya sarrafawa. Mai ɗaukar wafer ɗin yana tallafawa wafer ɗin, yana kare tsarin gefen gaba, kuma yana rage matsin lamba na zafi - yana ba da damar rage gudu zuwadubunnan micronsyayin da har yanzu yana ba da damar aiwatar da ayyuka masu tsauri kamar ƙirƙirar TSV, yin amfani da wutar lantarki, da haɗa kai. Yana ɗaya daga cikin mahimman fasahohin da ke ba da damar yin amfani da marufi na 3D na zamani.
Lokacin Saƙo: Janairu-16-2026