Injin yanka Diamond Mai Waya Mai Yawa don SiC Sapphire Mai Tauri Mai Tauri

Injin yanka Diamond Mai Waya da yawa don SiC Sapphire Kayan Gaggawa Masu Tauri da Tauri Hoton da aka Fito

Takaitaccen Bayani:

Injin yanka lu'u-lu'u mai waya da yawa tsarin yankawa ne na zamani wanda aka tsara don sarrafa kayan aiki masu tauri da karyewa. Ta hanyar amfani da wayoyi masu lu'u-lu'u da yawa a jere, injin zai iya yanke wafers da yawa a lokaci guda a cikin zagaye ɗaya, wanda zai cimma babban aiki da daidaito.

Aika mana imel

Siffofi

Gabatarwa ga Injin Yanke Lu'u-lu'u Mai Wayoyi Da Yawa

Injin yanka lu'u-lu'u mai waya da yawa tsarin yankawa ne na zamani wanda aka tsara don sarrafa kayan aiki masu tauri da karyewa. Ta hanyar amfani da wayoyi masu launi iri ɗaya da lu'u-lu'u, injin zai iya yanke wafers da yawa a lokaci guda a cikin zagaye ɗaya, wanda zai cimma babban aiki da daidaito. Wannan fasaha ta zama kayan aiki mai mahimmanci a masana'antu kamar semiconductors, hasken rana photovoltaics, LEDs, da yumbu na zamani, musamman ga kayan aiki kamar SiC, sapphire, GaN, quartz, da alumina.

Idan aka kwatanta da yanke waya ɗaya ta al'ada, tsarin wayoyi da yawa yana isar da yanka da dama zuwa ɗaruruwan yanka a kowane rukuni, wanda hakan ke rage lokacin zagayowar sosai yayin da yake kiyaye kyakkyawan lanƙwasa (Ra < 0.5 μm) da daidaiton girma (± 0.02 mm). Tsarin sa na zamani ya haɗa da haɗa waya ta atomatik, tsarin sarrafa kayan aiki, da sa ido kan layi, yana tabbatar da samarwa na dogon lokaci, kwanciyar hankali, da cikakken sarrafa kansa.

Sigogi na Fasaha na Injin Sake Zane-zane Mai Wayoyi da yawa

Abu	Ƙayyadewa	Abu	Ƙayyadewa
Matsakaicin girman aikin (Murabba'i)	220 × 200 × 350 mm	Injin tuƙi	17.8 kW × 2
Matsakaicin girman aiki (Zagaye)	Φ205 × 350 mm	Injin tuƙi mai waya	11.86 kW × 2
Tazarar dogaran sanda	Φ250 ±10 × 370 × 2 axis (mm)	Injin ɗaga tebur na aiki	2.42 kW × 1
Babban ginshiƙi	650 mm	Injin juyawa	0.8 kW × 1
Gudun gudu na waya	1500 m/min	Injin shiryawa	0.45 kW × 2
Diamita na waya	Φ0.12–0.25 mm	Injin tashin hankali	4.15 kW × 2
Gudun ɗagawa	225 mm/min	Motar slurry	7.5 kW × 1
Matsakaicin juyawar tebur	±12°	Yawan tankin ruwa	Lita 300
Kusurwar lilo	±3°	Gudun sanyaya	Lita 200/minti
Mitar juyawa	~Sau 30/minti	Daidaiton yanayi	±2°C
Yawan ciyarwa	0.01–9.99 mm/min	Tushen wutan lantarki	335+210 (mm²)
Yawan ciyar da waya	0.01–300 mm/min	Iska mai matsewa	0.4–0.6 MPa
Girman injin	3550 × 2200 × 3000 mm	Nauyi	13,500 kg

Tsarin Aiki na Injin Yanke Diamond Mai Wayoyi Da Yawa

Motsin Yanke Wayoyi Da Yawa
Wayoyi masu yawa na lu'u-lu'u suna motsawa a cikin saurin daidaitawa har zuwa 1500 m/min. Pulleys masu jagora daidai gwargwado da kuma tsarin rage tashin hankali (15-130 N) suna sa wayoyi su kasance a kwance, suna rage yiwuwar karkacewa ko karyewa.
Ciyarwa da Matsayi Mai Daidaito
Matsayin da aka yi amfani da shi ta hanyar servo yana cimma daidaiton ±0.005 mm. Daidaitawar laser ko ta hanyar hangen nesa ta zaɓi yana ƙara sakamako ga siffofi masu rikitarwa.
Sanyaya da Cire Sharar Gida
Na'urar sanyaya iska mai ƙarfi tana ci gaba da cire guntu kuma tana sanyaya wurin aiki, tana hana lalacewar zafi. Tacewar matakai da yawa tana ƙara tsawon rayuwar na'urar sanyaya iska kuma tana rage lokacin aiki.
Dandalin Sarrafa Wayo
Direbobin servo masu amsawa mai ƙarfi (<1 ms) suna daidaita ciyarwa, tashin hankali, da saurin waya cikin sauƙi. Haɗaɗɗen tsarin girke-girke da sauya sigogi na dannawa ɗaya suna sauƙaƙa samar da taro.

Babban Amfanin Injin Sake Gilashin Diamond Mai Waya Da Yawa

Babban Yawan Aiki
Yana da ikon yanke wafers 50-200 a kowace gudu, tare da asarar kerf <100 μm, yana inganta amfani da kayan har zuwa 40%. Yawan aiki shine 5-10x na tsarin waya ɗaya na gargajiya.
Daidaitaccen Ikon Sarrafa
Daidaiton matsin lamba a cikin ±0.5 N yana tabbatar da daidaiton sakamako akan kayan aiki daban-daban masu rauni. Sa ido a ainihin lokaci akan hanyar sadarwa ta HMI mai inci 10 yana tallafawa adana girke-girke da aiki daga nesa.
Gina Mai Sauƙi, Mai Sauƙi
Ya dace da diamita na waya daga 0.12–0.45 mm don hanyoyin yankewa daban-daban. Ikon sarrafa robot na zaɓi yana ba da damar yin amfani da layukan samarwa ta atomatik gaba ɗaya.
Amincin Masana'antu
Firam ɗin siminti/ƙirƙira masu nauyi suna rage lalacewar nakasa (<0.01 mm). Pulleys masu jagora tare da murfin yumbu ko carbide suna ba da tsawon rai na sama da sa'o'i 8000 na aiki.

Tsarin Rage Lu'u-lu'u Mai Waya da Yawa don SiC Sapphire Kayan Gaggawa Masu Tauri 2

Filayen Aikace-aikace na Multi-Waya Diamond sawing Machine

Semiconductors: Yanke SiC don na'urorin wutar lantarki na EV, abubuwan GaN don na'urorin 5G.
Na'urorin ɗaukar hoto: Yanka wafer ɗin silicon mai sauri mai girman ±10 μm.
LED & Na'urorin gani: Abubuwan da aka yi da saffir don abubuwan gani na epitaxy da daidaito tare da guntun gefen ƙasa da μ20 μm.
Gilashin Ci-gaba: Sarrafa alumina, AlN, da makamantansu don abubuwan sarrafa sararin samaniya da zafi.

Tsarin Rage Lu'u-lu'u Mai Wayoyi Da Dama don SiC Sapphire Kayan Gaggawa Masu Tauri 3

Tsarin Rage Lu'u-lu'u Mai Wayoyi Da Dama don SiC Sapphire Kayan Gaggawa Masu Tauri 5

Tsarin Rage Lu'u-lu'u Mai Wayoyi Da Dama don SiC Sapphire Kayan Gaggawa Masu Tauri 6

Tambayoyin da ake yawan yi - Injin yanka Diamond Mai Waya da yawa

T1: Menene fa'idodin yanka waya mai waya da yawa idan aka kwatanta da injunan waya ɗaya?
A: Tsarin waya da yawa na iya raba dozin zuwa ɗaruruwan wafers a lokaci guda, wanda ke ƙara inganci da 5-10×. Amfani da kayan aiki kuma ya fi girma idan asarar kerf ta ƙasa da 100 μm, wanda hakan ya sa ya dace da samar da kayan da yawa.

Q2: Waɗanne nau'ikan kayan aiki ne za a iya sarrafa su?
A: An ƙera injin ɗin don kayan aiki masu tauri da karyewa, waɗanda suka haɗa da silicon carbide (SiC), saffir, gallium nitride (GaN), quartz, alumina (Al₂O₃), da aluminum nitride (AlN).

Q3: Menene daidaito da ingancin saman da za a iya cimmawa?
A: Rashin kyawun saman zai iya kaiwa Ra <0.5 μm, tare da daidaiton girma na ±0.02 mm. Ana iya sarrafa guntun gefuna zuwa <20 μm, wanda ya cika ka'idodin masana'antar semiconductor da optoelectronic.

T4: Shin tsarin yankewa yana haifar da tsagewa ko lalacewa?
A: Tare da na'urar sanyaya iska mai ƙarfi da kuma tsarin rage tashin hankali, haɗarin ƙananan fasa da lalacewar damuwa yana raguwa, wanda ke tabbatar da kyakkyawan ingancin wafer.

Na baya: SICOI (Silicon Carbide akan Insulator) Wafers SiC Film ON Silicon

Na gaba: Injin Nika Mai Gefe Biyu Mai Daidaito don SiC Sapphire Si Wafer