Injin mai kusurwa biyu na tashar mota mai siffar silicon monocrystalline sarrafa sandar silicon mai inci 6/8/12 mai faɗi Ra≤0.5μm
Kayan aiki halaye:
(1) Sarrafa aiki tare da tashoshi biyu
· Inganci biyu: Sarrafa sandunan silicon guda biyu a lokaci guda (Ø6"-12") yana ƙara yawan aiki da kashi 40%-60% idan aka kwatanta da kayan aikin Simplex.
· Kulawa mai zaman kansa: Kowace tasha za ta iya daidaita sigogin yankewa (tashin hankali, saurin ciyarwa) da kanta don daidaitawa da takamaiman sandar silicon daban-daban.
(2) Yankewa mai inganci
· Daidaiton girma: juriyar nisan gefen sandar murabba'i ±0.15mm, kewayon ≤0.20mm.
· Ingancin saman: lalacewar gefen <0.5mm, rage yawan niƙawa daga baya.
(3) Ikon hankali
· Yankewa mai daidaitawa: sa ido kan yanayin sandar silicon a ainihin lokaci, daidaitawa mai ƙarfi na hanyar yankewa (kamar sarrafa sandar silicon mai lanƙwasa).
· Bin diddigin bayanai: yi rikodin sigogin sarrafawa na kowane sandar silicon don tallafawa shigarwar tsarin MES.
(4) Ƙarancin farashin amfani
· Yawan amfani da wayar lu'u-lu'u: ≤0.06m/mm (tsawon sandar silicon), diamita na waya ≤0.30mm.
· Zagayawar sanyaya jiki: Tsarin tacewa yana tsawaita rayuwar sabis kuma yana rage zubar da ruwan shara.
Fa'idodin fasaha da ci gaba:
(1) Inganta fasahar yankewa
- Yanke layi da yawa: Ana amfani da layukan lu'u-lu'u 100-200 a layi ɗaya, kuma saurin yankan shine ≥40mm/min.
- Kula da tashin hankali: Tsarin daidaita madauki mai rufewa (±1N) don rage haɗarin karyewar waya.
(2) Fadada dacewa
- Daidaita kayan aiki: Taimaka wa silicon monocrystalline irin P-type/N, wanda ya dace da TOPCon, HJT da sauran sandunan silicon masu inganci.
- Girman sassauƙa: Tsawon sandar silicon 100-950mm, nisan gefen sandar murabba'i 166-233mm mai daidaitawa.
(3) Haɓaka atomatik
- Lodawa da sauke robot: lodawa/sauke sandunan silicon ta atomatik, ana doke su ≤ mintuna 3.
- Ganowar hankali: Kulawa mai hasashen lokaci don rage lokacin hutu da ba a tsara ba.
(4) Jagorancin masana'antu
- Tallafin Wafer: Ana iya sarrafa silicon mai siriri ≥100μm tare da sandunan murabba'i, ƙimar rarrabuwa <0.5%.
- Inganta amfani da makamashi: Yawan amfani da makamashi ga kowace na'urar sandar silicon ya ragu da kashi 30% (idan aka kwatanta da kayan aikin gargajiya).
Sigogi na fasaha:
| Sunan siga | Darajar fihirisa |
| Adadin sandunan da aka sarrafa | Guda 2/saiti |
| Tsarin tsawon sandar sarrafawa | 100~950mm |
| Tsarin gefuna na injina | 166~233mm |
| Gudun Yankewa | ≥40mm/min |
| Saurin wayar lu'u-lu'u | 0~35m/s |
| Diamita na lu'u-lu'u | 0.30 mm ko ƙasa da haka |
| Amfani da layi | 0.06 m/mm ko ƙasa da haka |
| Mai jituwa diamita na sandar zagaye | Girman sandar murabba'i mai kauri + 2mm, Tabbatar da ƙimar wucewar gogewa |
| Tsarin karyewar gefen da ya fi dacewa | Gefen da ba shi da kyau ≤0.5mm, Babu guntu, ingancin saman yana da kyau |
| Daidaiton tsayin baka | Kewayon hasashen <1.5mm, Banda murƙushe sandar silicon |
| Girman injin (inji ɗaya) | 4800 × 3020 × 3660mm |
| Jimlar ƙarfin da aka ƙima | 56kW |
| Mataccen nauyin kayan aiki | 12t |
Daidaiton injina teburin index:
| Daidaitaccen abu | Tsarin haƙuri |
| Juriyar gefen sandar murabba'i | ±0.15mm |
| Gefen gefen sandar murabba'i | ≤0.20mm |
| Kusurwoyi a dukkan bangarorin sandar murabba'i | 90°±0.05° |
| Faɗin sandar murabba'i | ≤0.15mm |
| Daidaita matsayi na robot mai maimaitawa | ±0.05mm |
Ayyukan XKH:
XKH tana ba da cikakken sabis na injunan silicon guda biyu masu amfani da kristal, gami da keɓance kayan aiki (wanda ya dace da manyan sandunan silicon), aikin sarrafawa (inganta sigogin yankewa), horon aiki da tallafin bayan siyarwa (samar da mahimman sassan, gano cutar daga nesa), tabbatar da cewa abokan ciniki sun sami yawan amfanin ƙasa mai yawa (>99%) da ƙarancin farashin samarwa, da kuma samar da haɓaka fasaha (kamar haɓaka yanke AI). Lokacin isarwa shine watanni 2-4.
Cikakken Zane









