SiC Substrate N Nau'in 12 Babban Girman Aikace-aikacen RF Mai Aiki
Sigogi na fasaha
| Bayanin Silinda Mai Inci 12 (SiC) | |||||
| Matsayi | Samar da ZeroMPD Maki (Maki Z) | Tsarin Samarwa na Daidaitacce Maki (Maki na P) | Daraja ta Karya (Mataki na D) | ||
| diamita | 30 0 mm ~ 1305mm | ||||
| Kauri | 4H-N | 750μm±15 μm | 750μm±25 μm | ||
| 4H-SI | 750μm±15 μm | 750μm±25 μm | |||
| Tsarin Wafer | A gefen axis: 4.0° zuwa <1120 >±0.5° don 4H-N, A kan axis: <0001>±0.5° don 4H-SI | ||||
| Yawan bututun micropipe | 4H-N | ≤0.4cm-2 | ≤4cm-2 | ≤25cm-2 | |
| 4H-SI | ≤5cm-2 | ≤10cm-2 | ≤25cm-2 | ||
| Juriya | 4H-N | 0.015~0.024 Ω·cm | 0.015~0.028 Ω·cm | ||
| 4H-SI | ≥1E10 Ω·cm | ≥1E5 Ω·cm | |||
| Babban Tsarin Faɗi | {10-10} ±5.0° | ||||
| Babban Tsawon Lebur | 4H-N | Ba a Samu Ba | |||
| 4H-SI | Notch | ||||
| Keɓewa a Gefen | 3 mm | ||||
| LTV/TTV/Bow/Warp | ≤5μm/≤15μm/≤35 μm/≤55 μm | ≤5μm/≤15μm/≤35 □ μm/≤55 □ μm | |||
| Taurin kai | Yaren mutanen Poland Ra≤1 nm | ||||
| CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
| Fashewar Gefen Ta Hanyar Haske Mai Tsanani Faranti na Hex ta Haske Mai Tsanani Yankunan da aka yi amfani da su ta hanyar haske mai ƙarfi Abubuwan da ke tattare da Carbon na gani Ƙirƙirar saman Silicon ta hanyar Haske Mai Tsanani | Babu Yankin da aka tara ≤0.05% Babu Yankin da aka tara ≤0.05% Babu | Tsawon jimilla ≤ 20 mm, tsawonsa ɗaya ≤ 2 mm Yankin da aka tara ≤0.1% Yankin da aka tara≤3% Yankin da aka tara ≤3% Tsawon jimla ≤1 × diamita na wafer | |||
| Ƙwayoyin Gefen Ta Haske Mai Tsanani | Babu wanda aka yarda da faɗin da zurfin ≥0.2mm | An yarda da 7, ≤1 mm kowanne | |||
| (TSD) Rushewar sukurori mai zare | ≤500 cm-2 | Ba a Samu Ba | |||
| (BPD) Rushewar jirgin sama na tushe | ≤1000 cm-2 | Ba a Samu Ba | |||
| Gurɓatar Fuskar Silicon Ta Hanyar Haske Mai Tsanani | Babu | ||||
| Marufi | Akwatin Wafer Mai Yawa Ko Akwatin Wafer Guda Ɗaya | ||||
| Bayanan kula: | |||||
| 1 Iyakokin lahani sun shafi dukkan saman wafer sai dai yankin da aka ware gefen. 2Ya kamata a duba ƙurajen a fuskar Si kawai. 3 Bayanan rabuwar wuri daga wafers ɗin KOH ne kawai. | |||||
Mahimman Sifofi
1. Babban Fa'ida: Tsarin SiC mai inci 12 (silicon carbide substrate mai inci 12) yana ba da babban yanki mai wafer guda ɗaya, yana ba da damar samar da ƙarin guntu a kowace wafer, ta haka rage farashin masana'antu da ƙara yawan amfanin ƙasa.
2. Kayan Aiki Mai Kyau: Juriyar zafin jiki mai yawa da ƙarfin filin lalacewa mai yawa na silicon carbide sun sa substrate mai inci 12 ya dace da aikace-aikacen wutar lantarki mai yawa da yawan mita, kamar inverters na EV da tsarin caji mai sauri.
3. Dacewar Sarrafawa: Duk da ƙalubalen da SiC ke fuskanta na tauri da sarrafawa, siC mai inci 12 yana samun ƙananan lahani a saman ta hanyar dabarun yankewa da gogewa, wanda ke inganta yawan amfanin na'urori.
4. Ingantaccen Tsarin Kula da Zafi: Tare da ingantaccen tsarin watsa zafi fiye da kayan da aka yi da silicon, substrate mai inci 12 yana magance zubar zafi a cikin na'urori masu ƙarfi, yana tsawaita tsawon rayuwar kayan aiki.
Babban Aikace-aikace
1. Motocin Lantarki: SiC substrate mai inci 12 (silicon carbide substrate mai inci 12) babban ɓangare ne na tsarin tuƙi na lantarki na zamani, wanda ke ba da damar inverters masu inganci waɗanda ke haɓaka kewayon aiki da rage lokacin caji.
2. Tashoshin Tushe na 5G: Manyan SiC substrates suna tallafawa na'urorin RF masu yawan mita, suna biyan buƙatun tashoshin tushe na 5G don babban iko da ƙarancin asara.
3. Kayayyakin Wutar Lantarki na Masana'antu: A cikin inverters na hasken rana da grid mai wayo, substrate mai inci 12 zai iya jure wa wutar lantarki mai girma yayin da yake rage asarar makamashi.
4. Lantarki na Masu Amfani: Na'urorin caji masu sauri na gaba da kuma samar da wutar lantarki na cibiyar bayanai na iya ɗaukar ƙananan SiC guda 12 don cimma ƙaramin girma da inganci mafi girma.
Ayyukan XKH
Mun ƙware a ayyukan sarrafawa na musamman don substrates SiC inci 12 (substrates silicon carbide inci 12), gami da:
1. Ragewa da Gogewa: Tsarin substrate mai ƙarancin lalacewa, mai faɗi sosai wanda aka tsara shi bisa ga buƙatun abokin ciniki, yana tabbatar da ingantaccen aikin na'urar.
2. Tallafin Ci gaban Epitaxial: Ayyukan wafer na epitaxial masu inganci don hanzarta kera guntu.
3. Tsarin Samfurin Ƙananan Rukuni: Yana tallafawa tabbatar da bincike da ci gaban fasaha ga cibiyoyin bincike da kamfanoni, yana rage zagayowar ci gaba.
4. Shawarwari kan Fasaha: Magani daga ƙarshe zuwa ƙarshe daga zaɓin kayan aiki zuwa inganta tsarin aiki, yana taimaka wa abokan ciniki su shawo kan ƙalubalen sarrafa SiC.
Ko don samar da kayayyaki da yawa ko kuma keɓancewa na musamman, ayyukanmu na SiC mai inci 12 sun dace da buƙatun aikinku, suna ƙarfafa ci gaban fasaha.









