Idan muka yi nazarin wafers na silicon na semiconductor ko substrates da aka yi da wasu kayayyaki, sau da yawa muna cin karo da alamun fasaha kamar: TTV, BOW, WARP, da kuma wataƙila TIR, STIR, LTV, da sauransu. Waɗanne sigogi ne waɗannan ke wakilta?
TTV — Jimlar Bambancin Kauri
KWALLON BAKI — KWANKWASO
WARP - Warp
TIR — Jimillar Karatu da aka Nuna
STIR — Jimillar Karatun da aka Nuna a Shafin
LTV — Bambancin Kauri na Gida
1. Bambancin Kauri Gabaɗaya — TTV
Bambanci tsakanin matsakaicin kauri da mafi ƙarancin wafer idan aka kwatanta da matakin tunani lokacin da wafer ɗin ke mannewa kuma yana cikin kusanci. Gabaɗaya ana bayyana shi a cikin micrometers (μm), galibi ana wakilta shi kamar haka: ≤15 μm.
2. Baka — BAKA
Bambanci tsakanin mafi ƙarancin nisa da mafi girman nisa daga tsakiyar wurin saman wafer zuwa matakin tunani lokacin da wafer ɗin ke cikin yanayin 'yanci (marar lanƙwasa). Wannan ya haɗa da lamura biyu masu lanƙwasa (bakan da ba shi da lanƙwasa) da kuma masu lanƙwasa (masu kyau). Yawanci ana bayyana shi a cikin micrometers (μm), waɗanda galibi ana wakilta su kamar haka: ≤40 μm.
3. Warp — Warp
Bambanci tsakanin mafi ƙarancin nisa da mafi girman nisa daga saman wafer zuwa saman tunani (yawanci saman baya na wafer) lokacin da wafer ɗin ke cikin yanayin 'yanci (marar lanƙwasa). Wannan ya haɗa da duka yanayin concave (mara lanƙwasa mara kyau) da convex (mara lanƙwasa mai kyau). Gabaɗaya ana bayyana shi a cikin micrometers (μm), galibi ana wakilta shi kamar haka: ≤30 μm.
4. Jimillar Karatu da aka Nuna — TIR
Idan aka manne wafer ɗin kuma yana cikin kusanci, ta amfani da jirgin sama mai nuni wanda ke rage jimlar katsewar duk maki a cikin yankin inganci ko wani yanki na musamman akan saman wafer, TIR shine karkacewa tsakanin matsakaicin da mafi ƙarancin nisa daga saman wafer zuwa wannan jirgin sama mai nuni.
An kafa XKH bisa ƙwarewa mai zurfi a cikin ƙayyadaddun kayan semiconductor kamar TTV, BOW, WARP, da TIR, tana ba da sabis na sarrafa wafer na musamman daidai gwargwado wanda aka tsara bisa ƙa'idodin masana'antu masu tsauri. Muna samarwa da tallafawa nau'ikan kayan aiki masu inganci iri-iri, gami da sapphire, silicon carbide (SiC), silicon wafers, SOI, da quartz, tare da tabbatar da daidaiton kauri, daidaiton kauri, da ingancin saman don aikace-aikacen ci gaba a cikin optoelectronics, na'urorin wutar lantarki, da MEMS. Ku amince da mu don samar da ingantattun hanyoyin samar da kayayyaki da injinan daidai gwargwado waɗanda suka dace da buƙatun ƙira mafi wahala.
Lokacin Saƙo: Agusta-29-2025



