AmfaninTa Gilashin Ta (TGV)da Ta hanyar Silicon Via (TSV) matakai akan TGV sune galibi:
(1) ingantattun halayen lantarki masu ƙarfi. Gilashi abu ne mai insulator, dielectric akai-akai ne kawai game da 1/3 na na silicon abu, da kuma asara factor ne 2-3 umarni na girma kasa da na silicon abu, wanda ya sa substrate asarar da parasitic effects ya ragu sosai da kuma tabbatar da amincin siginar da aka watsa;
(2)babban girman da ultra-bakin ciki gilashin substrateyana da sauƙin samu. Corning, Asahi da SCHOTT da sauran gilashin masana'antun na iya samar da matsananci-manyan size (> 2m × 2m) da matsananci-bakin ciki (<50µm) panel gilashin da matsananci-bakin ciki m gilashin kayan.
3) Karancin farashi. Amfana daga sauƙi mai sauƙi zuwa babban gilashin ultra-bakin ciki, kuma baya buƙatar ƙaddamar da yadudduka masu rufewa, farashin samar da gilashin adaftar farantin shine kawai 1/8 na farantin adaftar na tushen silicon;
4) Tsari mai sauƙi. Babu buƙatar saka wani Layer mai rufewa akan farfajiyar ƙasa da bangon ciki na TGV, kuma ba a buƙatar bakin ciki a cikin farantin adaftan mai bakin ciki;
(5) Ƙarfin ƙarfin inji. Ko da kaurin farantin adaftan bai wuce 100µm ba, har yanzu wargin yana ƙarami;
(6) Wide kewayon aikace-aikace, ne kunno kai a tsaye interconnect fasahar amfani a fagen wafer-matakin marufi, don cimma mafi guntu nisa tsakanin wafer-wafer, da m farar na interconnect samar da wani sabon fasaha hanya, tare da m lantarki, thermal, inji Properties, a cikin RF guntu, high-karshen MEMS na'urori masu auna sigina, high-yawan tsarin shi ne na gaba tsara da kuma sauran G5 tsarin hadewa na gaba tsara, 6. guntu mai girma-girma 3D Yana ɗaya daga cikin zaɓi na farko don marufi na 3D na 5G na gaba da 6G kwakwalwan kwamfuta masu girma.
Tsarin gyare-gyare na TGV ya ƙunshi yashi, hakowa ultrasonic, rigar etching, zurfin reactive ion etching, photosensitive etching, Laser etching, Laser-induced zurfin etching, da mayar da hankali fitarwa rami samu.
Sakamakon bincike da ci gaba na baya-bayan nan ya nuna cewa fasahar na iya shirya ta cikin ramuka da 5: 1 ramukan makafi tare da zurfin zurfin nisa na 20: 1, kuma suna da kyakkyawan ilimin halittar jiki. Laser da aka jawo zurfafa etching, wanda ke haifar da ƙaramin tarkace, ita ce hanyar da aka fi nazari a halin yanzu. Kamar yadda aka nuna a cikin Hoto na 1, akwai tsage-tsalle a fili a kusa da hakowa na Laser na yau da kullun, yayin da kewaye da bangon gefen bangon da ke haifar da zurfafawar laser suna da tsabta da santsi.
Tsarin sarrafawa naTGVAn nuna interposer a cikin hoto na 2. Gabaɗaya makircin shine a fara haƙa ramuka akan gilashin gilashin, sannan a ajiye shingen shinge da layin iri akan bangon gefe da saman. Layer na shinge yana hana yaduwar Cu zuwa gilashin gilashi, yayin da yake ƙara mannewa na biyu, ba shakka, a wasu nazarin kuma an gano cewa shingen shinge ba lallai ba ne. Sa'an nan kuma a ajiye Cu ta hanyar electroplating, sa'an nan kuma annealed, da kuma Cu Layer da CMP. A ƙarshe, RDL rewiring Layer an shirya ta PVD shafi lithography, kuma passivation Layer yana samuwa bayan an cire manne.
(a) Shirye-shiryen wafer, (b) samuwar TGV, (c) electroplating mai gefe biyu - jigo na jan ƙarfe, (d) annealing da CMP sinadarai-kayan aikin injiniya, cirewar saman jan karfe Layer, (e) PVD shafi da lithography, (f) jeri na RDL rewiring Layer, (g) deluing da (Cuvation na Layer etching Layer).
A takaice,gilashin rami (TGV)Hasashen aikace-aikacen yana da faɗi, kuma kasuwar cikin gida na yanzu tana cikin haɓaka, daga kayan aiki zuwa ƙirar samfuri da bincike da haɓaka haɓaka ya fi matsakaicin duniya.
Idan akwai cin zarafi, tuntuɓi sharewa
Lokacin aikawa: Yuli-16-2024