Teburin Abubuwan da ke Ciki
1. Manyan Manufofi da Muhimmancin Tsaftace Wafer
2. Kimanta Gurɓatawa da Dabaru Masu Ci Gaba na Nazari
3. Hanyoyin Tsaftacewa Masu Ci gaba da Ka'idojin Fasaha
4. Muhimman Abubuwan Aiwatar da Fasaha da Kula da Tsarin Aiki
5. Abubuwan da ke Faruwa a Nan Gaba da Umarnin Kirkire-kirkire
6.Mafita daga Ƙarshe zuwa Ƙarshen XKH da Tsarin Sabis
Tsaftace Wafer muhimmin tsari ne a masana'antar semiconductor, domin ko da gurɓatattun abubuwa na matakin atomic na iya lalata aikin na'urar ko yawan amfanin ƙasa. Tsarin tsaftacewa yawanci ya ƙunshi matakai da yawa don cire gurɓatattun abubuwa daban-daban, kamar ragowar halitta, ƙazanta na ƙarfe, barbashi, da oxides na asali.
1. Manufofin Tsaftace Wafer
- Cire gurɓatattun abubuwa na halitta (misali, ragowar masu hana hasken rana, zanen yatsa).
- Kawar da ƙazantar ƙarfe (misali, Fe, Cu, Ni).
- Cire gurɓataccen ƙwayoyin cuta (misali, ƙura, gutsuttsuran silicon).
- Cire oxides na asali (misali, yadudduka na SiO₂ da aka samar yayin fallasa iska).
2. Muhimmancin Tsaftace Wafer Mai Tsauri
- Yana tabbatar da yawan amfanin ƙasa da kuma aikin na'urar.
- Yana rage lahani da kuma yawan tarkacen wafer.
- Yana inganta ingancin saman da daidaito.
Kafin a tsaftace sosai, yana da mahimmanci a tantance gurɓatar saman da ke akwai. Fahimtar nau'in, girman da aka rarraba, da kuma tsarin sarari na gurɓatattun abubuwa a saman wafer yana inganta sinadaran tsaftacewa da shigar da makamashin injiniya.
3. Dabaru Masu Ci Gaba na Nazari don Kimanta Gurɓatawa
3.1 Binciken Ƙwayoyin Sama
- Ƙwararrun na'urorin ƙirga barbashi suna amfani da na'urar watsa laser ko hangen nesa ta kwamfuta don ƙirgawa, girma, da kuma taswirar tarkacen saman.
- Ƙarfin watsawa na haske yana da alaƙa da girman barbashi kamar goma na nanometers da yawan da ya kai ƙasa da barbashi 0.1/cm².
- Daidaita ƙa'idodi yana tabbatar da ingancin kayan aiki. Dubawa kafin da bayan tsaftacewa yana tabbatar da ingancin cirewa, yana kuma inganta tsarin aiki.
3.2 Nazarin Fuskar Abubuwa
- Dabaru masu la'akari da saman suna gano abubuwan da ke cikin sinadaran.
- X-ray Photoelectron Spectroscopy (XPS/ESCA): Yana nazarin yanayin sinadarai a saman ta hanyar haskaka wafer ɗin da hasken X-ray da kuma auna electrons da aka fitar.
- Glow Discharge Optical Emission Spectroscopy (GD-OES): Yana fitar da siraran saman da suka yi kauri sosai a jere yayin da yake nazarin siraran da aka fitar don tantance abubuwan da suka dogara da zurfin.
- Iyakokin ganowa sun kai ga sassa a kowace miliyan (ppm), wanda ke jagorantar zaɓin sinadarai mafi kyau na tsaftacewa.
3.3 Nazarin Gurɓatar Halittu
- Scanning Electron Microscopy (SEM): Yana ɗaukar hotuna masu ƙuduri mai girma don bayyana siffofi da rabon gurɓatattun abubuwa, yana nuna hanyoyin mannewa (kimiyya da na inji).
- Na'urar Duban Ƙarfin Atomic (AFM): Taswirar yanayin nanoscale don auna tsayin barbashi da halayen injina.
- Na'urar Niƙa Ion Beam (FIB) + Na'urar Duban Ƙarƙashin ...
4. Hanyoyin Tsaftacewa Na Ci Gaba
Duk da cewa tsaftace sinadarai yana kawar da gurɓatattun abubuwa na halitta yadda ya kamata, ana buƙatar ƙarin dabarun ci gaba don barbashi marasa tsari, ragowar ƙarfe, da gurɓatattun abubuwa na ionic:
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4.1 Tsaftace RCA
- An ƙirƙiro wannan hanyar ne ta hanyar dakunan gwaje-gwaje na RCA, kuma tana amfani da tsarin wanka biyu don cire gurɓatattun abubuwa a cikin polar.
- SC-1 (Tsaftace na Daidaitacce-1): Yana cire gurɓatattun abubuwa da ƙwayoyin halitta ta amfani da cakuda NH₄OH, H₂O₂, da H₂O₂ (misali, rabon 1:1:5 a ~20°C). Yana samar da siraran silicon dioxide.
- SC-2 (Tsaftace na yau da kullun-2): Yana cire ƙazanta na ƙarfe ta amfani da HCl, H₂O₂, da H₂O₂ (misali, rabon 1:1:6 a ~80°C). Yana barin saman da ba shi da amfani.
- Yana daidaita tsafta tare da kariyar saman.
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4.2 Tsarkakewar Ozone
- Yana nutsar da wafers a cikin ruwan deionized mai cike da ozone (O₃/H₂O).
- Yana yin oxidizes da kuma cire abubuwa masu rai ba tare da lalata wafer ɗin ba, yana barin saman da ke da sinadarai masu guba.
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4.3 Tsaftacewa Mai Kyau;
- Yana amfani da makamashin ultrasonic mai yawan mita (yawanci 750-900 kHz) tare da maganin tsaftacewa.
- Yana haifar da kumfa mai narkewa wanda ke fitar da gurɓatattun abubuwa. Yana shiga cikin yanayin ƙasa mai rikitarwa yayin da yake rage lalacewar gine-gine masu laushi.
4.4 Tsaftacewa Mai Tsafta
- Yana sanyaya wafers cikin sauri zuwa yanayin zafi mai zafi, yana lalata gurɓatattun abubuwa.
- Kurkurawa ko gogewa a hankali yana cire barbashi da suka sassauta. Yana hana sake gurɓatawa da yaɗuwa a saman fata.
- Tsarin aiki mai sauri da bushewa tare da ƙarancin amfani da sinadarai.
Kammalawa:
A matsayinmu na babban mai samar da mafita na semiconductor mai cikakken sarka, XKH tana da ƙwarewa ta hanyar kirkire-kirkire na fasaha kuma abokan ciniki suna buƙatar samar da yanayin sabis na ƙarshe zuwa ƙarshe wanda ya ƙunshi samar da kayan aiki masu inganci, ƙera wafer, da tsaftacewa daidai. Ba wai kawai muna samar da kayan aikin semiconductor da aka sani a duniya ba (misali, injunan lithography, tsarin etching) tare da mafita na musamman, har ma muna fara fasahar mallakar ƙasa - gami da tsaftacewar RCA, tsarkakewar ozone, da tsaftacewa mai yawa - don tabbatar da tsaftar matakin atomic don ƙera wafer, yana haɓaka yawan amfanin abokin ciniki da ingancin samarwa sosai. Yin amfani da ƙungiyoyin amsawa da sauri na gida da hanyoyin sadarwa na sabis na fasaha, muna ba da cikakken tallafi tun daga shigar da kayan aiki da inganta tsari zuwa kula da hasashen lokaci, yana ƙarfafa abokan ciniki su shawo kan ƙalubalen fasaha da ci gaba zuwa ga daidaito mafi girma da ci gaban semiconductor mai ɗorewa. Zaɓe mu don haɗin gwiwa mai nasara biyu na ƙwarewar fasaha da ƙimar kasuwanci.
Lokacin Saƙo: Satumba-02-2025