Gilashi Ya Zama Sabon Dandalin Marufi

Gilashi yana zama da saurikayan dandamaliga kasuwannin tashoshi da jagorancincibiyoyin bayanaikumasadarwaA cikin cibiyoyin bayanai, yana da ma'auni guda biyu masu ɗaukar marufi:Tsarin gine-ginen guntukumashigarwa/fitarwa ta gani (I/O).

Nasaƙarancin faɗaɗawar zafi (CTE)kumamasu ɗaukar gilashi masu jituwa da hasken ultraviolet mai zurfi (DUV)sun kunnahaɗin gaurayekumaAikin bayan wafer mai sirara 300 mmdon zama daidaitattun hanyoyin samar da kayayyaki.

Yayin da na'urorin sauyawa da masu hanzarta haɓaka ke girma fiye da girman wafer-stepper,masu ɗaukar allosuna zama ba makawa. Kasuwa donƙananan gilasan gilashi (GCS)ana sa ran zai isaDala miliyan 460 nan da shekarar 2030, tare da hasashen da ke nuna cewa za a iya ɗaukar nauyin al'ada a kusa da2027–2028A halin yanzu,masu shiga gilashiana sa ran za su wuce gona da iridala miliyan 400ko da a ƙarƙashin hasashen masu ra'ayin mazan jiya, da kumasashin ɗaukar gilashin tsayayyeyana wakiltar kasuwa a kusadala miliyan 500.

In marufi na ci gaba, gilashi ya samo asali daga zama abu mai sauƙi zuwa zamakasuwancin dandamaliDominmasu ɗaukar gilashi, samar da kudaden shiga yana canzawa dagafarashin kowace kwamfuta to tattalin arziki a kowace zagaye, inda riba ta dogara dasake amfani da zagaye, Fitar da laser/UV daga fata, yawan amfanin aiki, kumarage lalacewar gefenWannan yanayin yana amfanar masu samar da kayayyaki da ke bayarwaFayilolin da aka yiwa maki na CTE, masu samar da fakitisayar da tarin abubuwan da aka haɗa namai ɗaukar kaya + manne/LTHC + debond, kumamasu sayar da kayan sake kwatowa na yankiƙwararre kan tabbatar da ingancin gani.

Kamfanoni masu ƙwarewa a fannin gilashi mai zurfi—kamarTsarin Zane-zane, wanda aka sani damasu ɗaukar kaya masu tsayitare dayanayin ƙasa mai ingancikumawatsawa mai sarrafawa- an sanya su cikin wannan sarkar darajar da kyau.

Ƙananan gilasan gilashi yanzu suna buɗe ƙarfin kera allon nuni zuwa riba ta hanyarTGV (Ta Gilashi Ta Hanyar), Layer ɗin Rarraba Rarrabawa Mai Kyau (RDL), kumahanyoyin ginawaShugabannin kasuwa su ne waɗanda suka ƙware a fannoni masu mahimmanci:

• Hakowa/ƙwanƙwasa TGV mai yawan amfanin ƙasa

• Cika jan ƙarfe mara wofi

• Lithography na panel tare da daidaitawa mai daidaitawa

• 2/2 µm L/S (layi/sarari)zane-zane

• Fasahar sarrafa panel mai sarrafawa ta hanyar warp

Masu sayar da substrate da OSAT waɗanda ke haɗin gwiwa da masana'antun gilashin nuni suna canzawababban yankicikinfa'idodin farashi don marufi na sikelin allo.

Daga Mai Jigilar Kaya zuwa Cikakken Kayan Dandalin Fasaha

Gilashi ya canza daga wanimai ɗaukar kaya na wucin gadicikin wanicikakken dandamalin kayan aikidonmarufi na ci gaba, daidaitawa da manyan canje-canje kamarhaɗin chiplet, panelization, tarawa a tsaye, kumahaɗin gauraye- yayin da a lokaci guda ake ƙara tsaurara kasafin kuɗi doninjina, yanayin zafi, kumaɗakin tsaftacewaaiki.

A matsayinmai ɗaukar kaya(duka wafer da panel),gilashin CTE mai haske, mai ƙarancin CTEyana ba da damardaidaitawa mai rage damuwakumacire haɗin laser/UV, inganta yawan amfanin ƙasa donwafers na ƙasa da µm, kwararar tsarin baya, kumabangarorin da aka sake gyarawa, don haka cimma ingantaccen amfani da farashi mai yawa.

A matsayinbabban gilashin substrate, yana maye gurbin ƙwayoyin halitta da tallafiƙera matakin panel.

• TGVssamar da wutar lantarki mai yawa a tsaye da kuma hanyar sadarwa ta sigina.

• SAP RDLyana tura iyakokin wayoyi zuwa2/2 µm.

• Falo mai faɗi, wanda za a iya daidaita shi da CTErage yawan yaƙi.

• Bayyanar ganiyana shirya substrate donna'urorin gani masu haɗawa (CPO).
  A halin yanzu,wargaza zafiAna magance matsalolin ta hanyarJiragen jan ƙarfe, hanyoyin dinka, hanyoyin sadarwar isar da wutar lantarki na baya (BSPDN), kumasanyaya mai gefe biyu.

A matsayinmai shiga gilashi, kayan ya yi nasara a ƙarƙashin siffofi guda biyu daban-daban:

• Yanayin aiki mara aiki, yana ba da damar manyan tsarin AI/HPC na 2.5D da kuma tsarin sauyawa waɗanda ke cimma yawan wayoyi da ƙididdigewar kumbura waɗanda silicon ba zai iya kaiwa ba a farashi da yanki iri ɗaya.

• Yanayin aiki, haɗa kaiSIW/matattara/antenakumaramukan ƙarfe ko jagororin raƙuman ruwa da aka rubuta da lasera cikin substrate, hanyoyin RF masu naɗewa da kuma tura I/O na gani zuwa ga gefen ba tare da asara mai yawa ba.

Hasashen Kasuwa da Sauyin Masana'antu

A cewar sabon bincike da aka yi ta hanyarƘungiyar Yole, kayan gilashi sun zamatsakiya ga juyin juya halin shirya kayan semiconductor, wanda manyan abubuwan da ke faruwa a cikinfasahar kere-kere ta wucin gadi (AI), babban aikin kwamfuta (HPC), Haɗin 5G/6G, kumana'urorin gani masu haɗawa (CPO).

Masu sharhi sun jaddada cewa gilashinkadarori na musamman-ciki har da shiƙarancin CTE, kwanciyar hankali mai girma, kumabayyana gaskiya ta gani- sanya shi ya zama dole don cimma burinbuƙatun injina, lantarki, da zafina fakitin tsara na gaba.

Yole ya ƙara da cewacibiyoyin bayanaikumakamfanonin sadarwakasance har abadainjunan girma na farkodon ɗaukar gilashi a cikin marufi, yayin damota, tsaro, kumakayan lantarki masu amfani masu ingancisuna ƙara dogaro da ƙarin ci gaba.haɗin chiplet, haɗin gauraye, kumaƙera matakin panel, inda gilashi ba wai kawai yana inganta aiki ba har ma yana rage jimlar farashi.

A ƙarshe, fitowarsabbin hanyoyin samar da kayayyaki a Asiya-musamman a cikinChina, Koriya ta Kudu, da Japan- an gano shi a matsayin babban abin da ke taimakawa wajen haɓaka samarwa da ƙarfafa shiTsarin halittu na duniya don gilashin marufi na ci gaba.